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Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. www.tadin.com 1 The Ultimate Semiconductor Process and Machine Enhancement Tool Specific TadiGuard MRC-Eclipse Information TadiGuard
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Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. www.tadin.com 2 Typical TadiGuard Eclipse Real-time Alarms: Missing Index (No rotation, double–process) Skipped Index (Skipped station, no process) All stations: Pod Pressure (Throttle valves failure) All targets: Current, Voltage Base Pressure (Ion Gauges) Wafer handling Etch: Forward Power, Reflected Power, Bias Many more
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Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. www.tadin.com 3 Next, see typical TadiGuard Eclipse analysis screens TadiGuard’s most prominent contribution is its real-time watchdog features that cuts scrap, rework, maintenance, tests, test wafers, material, calibration, etc. With overall reduced Cost Of Ownership
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Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. www.tadin.com 4 Sput :1 typical Pod Pressure, Voltage, Current, Date, Time, Recipe, Lot#
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Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. www.tadin.com 5 Sput :2 typical Pod Pressure, Voltage, Current, Date, Time, Recipe, Lot#
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Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. www.tadin.com 6 Sput :3 typical Pod Pressure, Voltage, Current, Date, Time, Recipe, Lot#
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Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. www.tadin.com 7 Sput 1 Voltage / Current / Pod Press overlay (waterfall)
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Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. www.tadin.com 8 Sput 3 Voltage trend, SPC X-chart. Number of wafers: 9934
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Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. www.tadin.com 9 Sput 1 Volts, Current, Pod-Pressure X-Y-Z Correlation
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Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. www.tadin.com 10 Sput 1 Plasma Impedance calculated as V/I
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Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. www.tadin.com 11 Sput 3 voltage trend: Note target changes at pre-set voltage level. Number of wafers: 9934
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Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. www.tadin.com 12 Sput 1 Power, W, Lot#, Recipe over 12 Hours, 373 Wafers.
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Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. www.tadin.com 13 Sput 1 Current trend, 14796 wafers
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Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. www.tadin.com 14 Correlation graph of Sput1 #1 Volts Vs. Current (745 wafers).
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Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. www.tadin.com 15 Sput 1 Current and Voltage long-term (3 months) trend, with target changes.
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Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. www.tadin.com 16 Sput 2 Current and Voltage, Target change and 39 conditioning wafers
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Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. www.tadin.com 17 Sputter machine performance and capacity measurements: Average 33.491 wafers per hour.
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Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. www.tadin.com 18 Sputter Etch chamber pump-down curve.
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Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. www.tadin.com 19 Sputter Etch chamber measured pumping speed.
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