1. Lead-free Roadmap 2002 Roadmap 2002 for Commercialization of Lead-free Solder official version 2.1 September 2002 Lead-Free Soldering Roadmap Committee Technical Standardization Committee on Electronics Assembly Technology JEITA Japan Electronics and Information Technology Industries Association

2. Policy in making the Lead-free Roadmap 2002 ■ Make the clear definition of lead-free. ■ Put the trends of lead-free application on a timeline. Clearly show the leading makers and the followers. Clearly show the leading makers and the followers. ■ Make the de facto standard. Extract and promote the standardization, without picking up every factor. Extract and promote the standardization, without picking up every factor. ■ Make active proposals towards the rest of the world. ■ Based on questionnaire survey. February 2002, 160 answers February 2002, 160 answers

3. Roadmap 2002 1. Definition of Lead-free: Lead content ■ Definition of lead-free: In the following phases, the amount of contained Pb in the prescribed parts planned for lead-free adoption should be less than 0.1w percent. ■ The value must be given if it exceeds that amount. ■ If there is any exemption, the definition refers to the rest parts of the product, with indication of the name of the item of the exemption and the amount of contained Pb.

4. Roadmap 2002 1. Definition of Lead-free: Lead-free phase Components Components withstand heat resistance: Heat resistance against soldering in assembly with lead-free solder Components with lead-free solder: Module components etc. Correspond to Phase1 in Equipment. Lead-free terminal components: No lead contained plating and electrodes of terminal parts of components assembled to PWB etc. The components may contain leaded composing components and materials. Lead-free components: No lead contained in all the internal bonding and/or composing components and materials Phase 1 Phase 2 Phase 3 Phase 1A Equipment Equipment with lead-free solder A: Application of current components or components withstand heat resistant, Phase1 (Composing components and materials may contain lead, while the assembly solder is lead-free) Equipment with lead-free solder B:Application of lead-free terminal components, Phase2, or lead-free components, Phase3 (Even if the assembled components are lead-free, the other components and materials may contain lead.) Lead-free equipment: Application of lead-free components, Phase3, only and non leaded composing components and materials in addition to assembled components and bonding materials Phase 1 Phase 2 Phase 3 Common definition in the equipment for lead-free:No leaded solder is used at the stage of board assembly in board surface finishing, solder paste and solder bath, Lead-free component equipment: Application of lead-free terminal components, Phase2, or lead-free components, Phase3, with lead-bearing solder in bonding materials (Excluded from the category of lead-free equipment) Phase 0

5. Roadmap 2002 2. EU-regulation and Japanese reaction ■ The lead-free regulation in the EU will be accepted with reluctance in Japan, if it is crucial for the environment. ■ In that case, the same kind of regulation should be required also in Japan. ■ A global agreement on the definition of lead-free and on the standard for judgment is needed as early as possible.

6. Roadmap 2002 3. Timeline for lead-free ■ Timeline for lead-free: Set up the schedule for the average makers as follows. ■ Components: Start supplying components withstand heat resistance / lead-free terminal components: ---------------------------------------------2001 Start supplying components withstand heat resistance / lead-free terminal components: ---------------------------------------------2001 Complete supplying of lead-free terminal components: --2003 Complete supplying of lead-free terminal components: --2003 Complete supplying of lead-free components: --------------2004 Complete supplying of lead-free components: --------------2004 ■ Equipment: Start introducing lead-free solder: ------------------------------2002-2003 Start introducing lead-free solder: ------------------------------2002-2003 Totally adopt lead-free solder into new products: -----------2003 Totally adopt lead-free solder into new products: -----------2003 Complete lead-free adoption: ------------------------------------2005 Complete lead-free adoption: ------------------------------------2005 ■ The “leading makers” are 1 year ahead of this schedule, and the “followers” are 2 years behind. ■ The “leading makers” are 1 year ahead of this schedule, and the “followers” are 2 years behind. ■ There is a need to establish a worldwide milestone and a roadmap.

7. Roadmap 2002 4. Phase 0 in Equipment ■ Combined packaging of lead solder for PWB and lead- free terminal components (Phase 0 in Equipment) In the stage of shifting to lead-free, packaging of lead-free terminal components with lead solder (  Phase 0) should be allowed. In the stage of shifting to lead-free, packaging of lead-free terminal components with lead solder (  Phase 0) should be allowed. Component and equipment makers should work together on shortening the transition period, as the components makers have to prepare both lead-free terminal components and lead components. Component and equipment makers should work together on shortening the transition period, as the components makers have to prepare both lead-free terminal components and lead components.

8. Roadmap 2002 5. Purchased/procured products ■ Promote lead-free adoption corresponding to moving production plants overseas, components procurement overseas, and technology overseas. ■ Equipment: Promote technology transfer overseas. Give technology to overseas cooperative plants. Promote technology transfer overseas. Give technology to overseas cooperative plants. Require that overseas plants cope with lead-free adoption 1 year behind at latest. Require that overseas plants cope with lead-free adoption 1 year behind at latest. Require that they cope with purchased and procured products immediately. Require that they cope with purchased and procured products immediately. ■ Components: Require that overseas plants cope with lead-free adoption 1 year behind at latest. Require that overseas plants cope with lead-free adoption 1 year behind at latest. There is a need of giving supports to the followers. There is a need of giving supports to the followers.

9. Roadmap 2002 6. Standardization of lead-free solder ■ The following types of solder are recommended. Board assembly:(Recommended) Sn-3Ag-0.5Cu Board assembly:(Recommended) Sn-3Ag-0.5Cu Reflow: Sn-3Ag-0.5Cu > Sn-Ag > Sn-Zn-BiReflow: Sn-3Ag-0.5Cu > Sn-Ag > Sn-Zn-Bi Wave: Sn-3Ag-0.5Cu > Sn-CuWave: Sn-3Ag-0.5Cu > Sn-Cu Hand: Sn-3Ag-0.5CuHand: Sn-3Ag-0.5Cu Components: Components: Solder balls (Recommended): Sn-3Ag-0.5CuSolder balls (Recommended): Sn-3Ag-0.5Cu Land finish (Recommenced): Plating/Au, Solder precoat/Sn-3Ag-0.5CuLand finish (Recommenced): Plating/Au, Solder precoat/Sn-3Ag-0.5Cu ■ Currently, more than one type are adopted to component electrodes and terminal plating as follows. Component electrodes and terminal plating (Current situation) Component electrodes and terminal plating (Current situation) Semiconductor components: : Sn-Bi plating is majority; Sn-Bi > Sn-Cu > Sn > Sn- Ag > Au-PdSemiconductor components: : Sn-Bi plating is majority; Sn-Bi > Sn-Cu > Sn > Sn- Ag > Au-Pd Passive components: Sn plating is the main; Sn > Sn-Cu > Sn-BiPassive components: Sn plating is the main; Sn > Sn-Cu > Sn-Bi Terminal finishes: Sn-Cu plating and Sn plating are the majorities; Sn-Cu > Sn > AuTerminal finishes: Sn-Cu plating and Sn plating are the majorities; Sn-Cu > Sn > Au

10. Roadmap 2002 7. Assessment standard for heat resistance of components: wave soldering ■ For the time being, the heat resistance standard for wave soldering is; 260  C, 10 seconds.

11. Roadmap 2002 7. Assessment standard for heat resistance of components: reflow soldering ■ As for the temperature profile for heat resistance assessment in reflow, the equipment makers are likely to assume the ‘Hat type’ and the component makers are likely to assume the ‘Angle type’. The ‘Hat type’ is a recommendation. 90 〜 120s 90s 150/ 150 180/180 240 〜 250 220 〜 230 220 30 〜 60s 30 〜 40s 260 <10s Angle type Hat type

12. Roadmap 2002 8. Facilities, processes, and design change ■ Promote lead-free adoption and energy saving by improving facilities and processes without large changes in design.

13. Roadmap 2002 9. Labeling ■ Promote industrial standardization of lead-free labeling.