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Semiconductor/ Polymer Integrated Fabrication Facility CLEANROOM.

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Presentation on theme: "Semiconductor/ Polymer Integrated Fabrication Facility CLEANROOM."— Presentation transcript:

1 Semiconductor/ Polymer Integrated Fabrication Facility CLEANROOM

2 WHAT TO EXPECT (OUTLINE) Why a cleanroom? What is it? Facilities Procedures

3 WHY? IT’S A DIRTY WORLD! –UNCOUNTABLE PARTICLES IN AIR –ALL SIZES, SHAPES, PROPERTIES NANOTECH –S M A L L L L L L L –FRAGILE

4 WHAT is a cleanroom? A room, enclosure, and or environment in which you move the air by way of supply and return locations to control the airborne particle levels and in some cases temperature and humidity. Courtesy of http://www.mcr-1.com/definitions.html A place where harmful junk is kept away from sensitive items or materials.

5 CLEANROOM CLASSIFICATION Class limits [maximum allowable particles per cubic foot (SI/209) or meter (ISO)] ISOSIFed Std 2090.1 micron0.2 micron0.3 micron0.5 micron5 micron 3M 11100 35 35 1 M 1.51357310 M 21099.1 2.83 4M 2.51010,000 3457530352 100 M 3100991 28.1 5M 3.5100100,000 3,4507503003520 1000 6M 4.51,0001,000,000 34,500N/A 35,200 1,0007 7M 5.510,000345,000N/A 352,000 10,00070 8M 6.5100,0003,450,000N/A 3,520,000 100,000700 Courtesy of http://www.mcr-1.com/class.html

6 CLEANROOM FACILITIES 2003 July 15 Class 10,000 by airflow design Upgradable to Class 1,000 Tested (empty) as Class 1,000 (~780 actual counts)

7 ENTRY INTO THE CLEAN WORLD >>> STOP <<< NO FOOD OR BEVERAGES BEYOND THIS POINT

8 STAY ON THE MATS PAST THIS POINT

9 SHOES OR BOOTIES Booties Shoes

10 NOW YOU CROSS THE LINE

11 CHEMICAL PREPARATION Solvents Acids

12 THE CLEANROOM

13 THE GOWNING ROOM Follow the sequence of bouffant (hairnet), shoe covers, gloves, and frock. If you are only stepping out for a short time reuse the same items. If you are carrying something into the cleanroom wipe it down with the presoaked wipes. The reason for gowning is to expose a minimum of flaking skin, hair, etc. that could harm your work.

14 CLEANROOM ENTRANCE

15 GOWNING STEPS REVERSE THE STEPS WHEN REMOVING THE APPAREL

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20 COMMON GOWNING ERRORS Hair protruding from bouffant. Ears not covered. Open collar on frock. Gloves rolled up and/or frock sleeves pulled back from gloves. The gloves should be fully extended up the forearms. Once again, the reason for gowning is to expose a minimum of flaking skin, hair, etc. that could harm your work.

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25 WHITE ROOM 4’ Fume Hood In process of obtaining additional equipment. –Reactive Ion Etcher –Deposition System(s) Will be adding Emergency Eye Wash / Shower.

26 WHITE ROOM Acid

27 YELLOW ROOM Exhausted Laminar Flow Hood –Photolithography Sink, Spinner, Hot Plate, Oven –ISO 5 (Class 100) environment Vertical Laminar Flow Hood –MJB 3 Mask Aligner –Microscope –ISO 5 (Class 100) environment If the room is occupied use the telephone’s intercomm from the White Room to verify it’s safe to open the door and enter.

28 YELLOW ROOM

29 PHOTOLITHOGRAPHY Sink I Spinner I Contaminate Waste I & Hot Plate Oven

30 HORIZONTAL LAMINAR HOOD OLD Mask Aligner I Microscope (No DIC) I MJB 3 Mask Aligner I

31 MASK ALIGNER MUST be trained before use

32 MICROSCOPE MUST be trained before use

33 CHARACTERIZATION HALL X-rays –Scintag X’trA XRD: powder/low angle –Philips XRD: High Resolution Wiring Stations –Ball Bonder –Indium Soldering Station Horizontal Laminar Flow Hood –pH –Anodization Station Optical Tables (a work in progress) –Mid-IR Photoluminescence C-V Analysis Coming Soon –FIB –Hall Effect

34 X-RAYS Philips XRD Scintag X’trA XRD

35 WIRING STATIONS MEI 1204B Ball Bonder Home Built Indium Soldering Station

36 pH and ANODIZATION pH I Anodization I

37 SOME GENERAL INFO You must be trained before using it unassisted. Clean up and put away. –Leaving your work area in better condition than you found it is a good habit to develop. If you have any doubts or questions, ASK. –Harm to you and / or equipment can result from improper procedures. Using / operating available facilities / equipment is a privilege not a right. –Your privilege can be restricted or revoked if you refuse to follow accepted practices or rules.

38 Some Useful References UCLA Nanoelectronics Research Facility –http://nanolab.ucla.edu/new_users.htmhttp://nanolab.ucla.edu/new_users.htm –http://nanolab.ucla.edu/pdf/Orient.ppthttp://nanolab.ucla.edu/pdf/Orient.ppt University of California at Berkeley –http://microlab.berkeley.edu/http://microlab.berkeley.edu/ Georgia Tech –http://www.mirc.gatech.edu/facilities/http://www.mirc.gatech.edu/facilities/ University of Alabama in Huntsville –http://www.licos.uah.edu/nmf.htmlhttp://www.licos.uah.edu/nmf.html Cornell Nanofabrication Facility –http://www.cnf.cornell.edu/cnf/http://www.cnf.cornell.edu/cnf/ –http://www.cnf.cornell.edu/cnf/CNFSafetyManual8.htmlhttp://www.cnf.cornell.edu/cnf/CNFSafetyManual8.html


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