1. Token Bit Manager for the CMS Pixel Readout
Edward Bartz
(R.Stone)
Rutgers University
Description of the TBM Functions
First Prototype in DMILL
0.25 m Translation
CMS Pixel Electronics
Systems Review
5 November 2003

2.  Custom, Mixed Mode, Rad-Hard, Chip Located Near Pixel Readout Chips
TBM Overview
Orchestrate the Readout of Several Pixel Chips on a Single Analog Output Link
Provide a Link Between the Front End Controller and the Pixel Chips For Control Commands
 Custom, Mixed Mode, Rad-Hard, Chip Located Near Pixel Readout Chips

3. Dual TBM Chip Dual TBM Chip Dual HUB TBM Chain of Read Out Chips
Control
Commands
40 MHz
Clock
CLK L1
Analog
Output
L1A
Dual TBM Chip
Two Token Bit Manager’s
Each TBM Controls one ROC Chain
8 to 24 ROCs per TBM
Control Network Hub
Port addressing for control commands
6 to 14 Dual TBMs per Control Link
120 Links in the Detector
~1200 TBMs & 20,000 ROCs

4. TBM Functions
Write header and trailer (2 bit analog encoded digital)
8 bit Event Number  Header
8 bit Error status word  Trailer
Distribute to Pixel Readout Chips (ROC)
L1 triggers (2 Outputs/TBM)
Clock (2 Outputs/TBM)
Control readout through token pass
Stack triggers awaiting token pass
32 event deep
No readout after 16 deep L1
Trigger
TBM
ROC
CLK
Token In
Token Out
Analog Output
Analog
Output
Clock
Reset
To Flash
ADC

5. Analog Output Levels Chosen To Match ROC
Output Levels Fully Adjustable
Gain Adjustment
Differential Offset Adjustment
Driver Current Adjustment
Output Driver Identical to ROC
Note: Voltages are referenced to Analog Optical Link input. Levels 4&5 ROC Only

6. TBM Control Features Analog Adjustments Trigger Control Token Passing
Adjust Analog Levels
Disable Analog Output
Trigger Control
Inject Any Trigger Type
Ignore Incoming Triggers
Disable Trigger Outputs
Token Passing
Disable Token Passing
Reset Token Out
Stack Control
Read Number of Events on Stack
Read Stack Contents (non-destructively)
General Control
Switch Readout to 40 MHz or 20 MHz
Disable TBM Clock
Reset TBM

7. Control Network Hub Dual TBM HUB TBM ROC Up to 32 hubs addressable.
mI2C
4 mI2C Ports Output Only
Control Link
ROC
Up to 32 hubs addressable.
5 Ports per hub.
4 mI2C (40 MHz) external  ROCs.
1 mI2C (40 MHz) internal  TBMs.
Functions of addressed hub.
Selects addressed port.
Strips off byte containing hub/port address. Passes remainder.
Reflects data back to Front End Controller.

8. DMILL Dual TBM 4 mm 5.3 mm 1st (& only) Sub. 5/02 It Works!
Analog sections
Stacks
Control sections
Hub
5.3 mm
4 mm
1st (& only)
Sub. 5/02
It Works!

9. TBM Test Results Trailer ID Header ID 6 Tested / 5 Fully Functional
Event # = 11
Status Reg.
UBLK 1 2 3
Trailer ID
Header ID
Token Pass
Power consumption 600 mW
core 140 mW
Differential Drivers 460 mW
6 Tested / 5 Fully Functional
Header marker 3 “UBLK” + “1”
8 Bit Event Number (4 Clocks)
Trailer marker 2 “UBLK” + 2 “1”
8 Bit Status Word (4 Clocks)

10. Analog Adjustability
Before
Adjustment
After
TBM 1
TBM 2

11. Expected Max CMS Trigger Rate = 100KHz
1 MHz Trigger Rate
Expected Max CMS Trigger Rate = 100KHz
Header ID
Event
Number
Status Info
Trailer ID

12. mI2C Command Output From Port 0
Hub Testing
Internal fast port - fully tested and functional
External fast ports - fully tested and functional
mI2C Command Output From Port 0
Serial Data
Serial Clock

13. Changes For 0.25 m Reduce Power Consumption Limit use of Analog bus
Redesign LVDS Drivers
Minimize Clock Usage
Shut Down Clock when not needed
Limit use of Analog bus
Pass ROC Analog Through TBM
Analog Output Line Driver
Redesign Serial Protocol For CMS Optical Transceivers.
8 Bit data + Complement Bit 8  4 Bit data + Complement Bit 4
Request Modification to Optical Receiver Chip
Allow Transition Dual  Single TBM Operation

14. TBM Operation Modes Dual Mode Single Mode S ROCs
ROC readout
Readout token chip 1-8
Half-Module Readout 1 S
Readout token chip 9-16
Half-Module Readout 2
Dual Mode
ROCs S
ROC readout
Readout token
Module Readout
Single Mode
TBM

15. Single Event Upset SEU cross section of 0.25mm Flipflop
[cm2]
SEU cross section of 0.25mm Flipflop
300 MeV/c pion beam
Standard: s =2 x cm2
Protected: s =2 x cm2 (284 ff per DTBM)
10-12
10-13
10-14
10-15
TBM Placement
Expected Flux
(MHz/cm2)
Time Per SEU
Protected F/F
(Hrs/SEU)
4cm Barrel 40 12
7cm Barrel 20 24
11cm Barrel/
Foreward 8 60
10-16
10-17
1.4
1.6
1.8
2.0
2.2
2.4
2.6
Standard Latch
Protected Latch

16. 0.25 m Hub “Fast” Hub “Slow” Hub IBM Process “Fast” Hub “Slow” Hub
3 metal layers
MIMCaps
“Fast” Hub
Normally Part of TBM
Tested in Simulation with ROC Control Section
PSI Low Power LVDS Drivers
“Slow” Hub
Can reside on same control link as Fast hubs
Provides Control data for PLL & Laser Drivers Via I2c Protocol
Submitted June 2003
Received: Sept. 19, 2003
“Fast” Hub
“Slow” Hub

17. Slow Hub Modified Version of Fast Hub Divide 1 to 7 By 256 Decoder
Serial
Data In
40 MHz
Clock
Slow Clock
Out
Start-Stop
8 Bit
Reg.
Address
Compare
1 to 7
Decoder
7 to 1
Mux
Divide
By 256
Odd
Data
Bits
Slow Data
I/O
Return
Modifications

18. 0.25 m Dual TBM IBM Process 3 voltage regulators 4.4 mm 3.2 mm
3 metal layers
MIMCaps
3 voltage regulators
Core Digital
Analog
LVDS Drivers
Pad Dominated
Completed: October 2003
CERN rules check now
Nov 10th MPW submission
Analog Readout
Analog Power
Stacks
Control
Sections
4.4 mm
Hub
Regulators
3.2 mm

19. 2nd 0.25 m Version Fix any bugs? Improvements Spring 2004 submission?
Rad-Hard regulator band gap reference
More flexibility in token passing (bypass non-responding ROC segment)
TBM Aout driver enhancements
Spring 2004 submission?
Analog Readout
Analog Power
Stacks
Control
Sections
Hub
Regulators

20. Conclusion Dual TBM worked on first DMILL submission
0.25 m Fast and Slow Hubs are Awaiting Testing
0.25 m TBM Complete
10 November 2003 MPW Submission
Second 0.25 m Prototype Submission Anticipated
Production TBM Available End of 2004