1. EM3DS 2007 www.memresearch.com

2. What is EM3DS EM3DS is a very efficient 3D High Frequency Electromagnetic simulator for structures involving multilayer substrates (e.g. semiconductor and integrated circuits [MMICs], MEMs, printed circuits etc) It implements a set of unique features (not found in any other software in the EM modeling area, to the best of our knowledge): coupled EM/acoustic modeling for FBAR/BAW controlled current sources for modeling active linear FETs seamless 3D/2.5D switch to reduce numerical burden extraction of parameters for transmission lines with any number of conductors unique calibration techniques: e.g. a generalized SOC method for standard ports, a new method for Generalized Admittance Matrices for waveguides

3. What about its solver EM3DS is in the class of frequency domain, method of moments (MoM) solvers, boxed formulation Frequency domain (FrD) vs Time domain (TD) frequency domain is needed for high Q devices FrD is generally known to be more accurate, especially for resonant circuits (e.g. filters) simpler definition of the material parameters (e.g. losses: dielectric are usually characterized in frequency) TD is generally faster for broad-band calculation (FrD recovered by FFT) TD is needed for non-linear simulation

4. What about its solver Method of Moments Vs Finite Elements (FEM), Finite Differences (FD), Transmission Line Matrix (TLM) MoM is generally faster, in particular much faster when dealing with multilayer where different layers have very different thicknesses MoM is not generally bound to iterative schemes (it is basically an integral equation): no convergence issues MoM of EM3DS is applied to structures with metal boundaries (boxed formulation): in this case there is a regular monotone increase of accuracy increasing meshing MoM is not as general as FEM/FD/TLM: it is generally bound to a class of devices

5. What about its solver Boxed Vs Open Formulations of MoM Boxed MoM has generally a much larger dynamic range: unpaired accuracy easy definition of ground in a boxed MoM useful to model interaction with the box in a shieleded environment Open MoM suitable for antenna problems; some class of antennas can be handled by boxed MoM by using absorbing boundaries, but with restrictions in Open MoM planar aspect ratio is less critical in determining the computational time Unlike other Boxed MoMs, EM3DS does not impose any grid to be used when entering a geometry

6. A summary about other popular solvers EM3DS is the only MoM using volume currents (A/m 2 ) to define conductors in 3D mode; the other MoM use surface currents (A/m)

7. EM3DS main features Parametric geometries and materials (the latter also frequency-dependent) Full-wave optimizer tuner Specialized for planar and quasi-planar layered structures, is also able to model Dielectric Resonators, dielectric discontinuities, thick metals, and active FET devices by using volume currents Includes 2.5D and 3D EM solvers with one click mode of operation change First EM software to include modeling of piezo-electric bulk acoustic wave resonators (FBAR; coupled EM/acoustic modeling) Includes a broad-band Spice-model extractor Antenna charts (polar plots, far field 2D and 3D view) EM3DS 2007

8. EM3DS main features Metal enclosure (shielded structures), absorbing boundaries (antennas) and magnetic walls (symmetry problems) Script Engine (Pascal) for full customization of EM3DS Internal ports (both planar and via): suitable for package modeling Differential Ports Several new calibration techniques SmartFIT, an adaptive frequency selection algorithm: response on 50-500 frequency points available from the analysis of 5-10 frequencies Asymptotic Evaluation: fast wide-band analysis Import/Export geometry in GDSII/DXF/BMP formats Seamlessly integrated in the AWR’ MW Office EM3DS 2007

9. EM3DS main features Handles external files in Touchstone format Includes a set of powerful pre- and post-processing tools in order to edit, visualize geometry and current distributions in 2D and in 3D, to animate, to create AVI and GIF movies, plot S/Z/Y/Antenna parameters in rectangular and Smith’ charts, and much more Also included is a linear circuit solver to connect lumped elements to the full- wave analysis Floating and node-locked licenses EM3DS 2007 + Many existing features improved in EM3DS 2007

10. Applications supported RF MEMS Applications Electrostatic switches (parallel/series/capacitive) Resistive switches EM MEMS switches Tunable MEMS capacitors Pacheco switch Phase shifters Inductors FBARS Microwave/Millimeter/THz wave Applications Multilayer Microstrip, Stripline and Slotline circuits Coplanar Waveguides (CPW) RF and Microwave Packages Thick lossy conductors Dielectric discontinuities (Bricks) 2-port (multimode) waveguide components Monolithic Microwave Integrated Circuits Linear active devices BAW Filters Electro optical modulators Planar Antennas Thick/Thin film, LTCC

11. Applications supported Packaging Interaction circuit/packaging Model extraction Internal ports RF Circuits components in RFID components in Remote controls components in Security/Safety systems components in Health Systems

12. Software Highlights Geometry Creation and Meshing Powerful, easy-to-use builder (group selection, editing, mirroring etc) Seamlessly integrated with AWR Microwave Office – (RF circuit and system simulator): AWR’ customers see EM3DS as an alternative engine Powerful GDS II (Data exchange with Coventorware), AutoCAD DXF and BMP import filters User defined arbitrary dielectric stacks Supports lossy conductors and finite thickness geometries Very efficient Dielectric discontinuities (bricks) handling – no much comp overhead Frequency dependent material parameters, entered as equations Geometry and materials are parametric Parameters can be tuned and optimized Topographic view and many 3D views updated in real-time

13. Software Highlights Electromagnetic Solver Features Fully 3D Method of Moments; works also in 2.5D mode Proprietary Asymptotic estimator for reduced computation time (most info deduced from the 1th freq. Of analysis) SmartFit: adaptive selection of frequencies for resonant structures Volume currents used for modeling as opposed to surface currents approximation S-, Z-, & Y-parameter computation; group delay; Losses; Q; phase difference; antenna measurements Edge, internal, Via Port and differential ports Full multi-port, multiple coupled line calibration and de-embedding to edge ports. Feed port lines parameters (even for multiple asymmetric lines) handles coupled acoustic/electromagnetic modeling implements controlled currents (transconductive sources): useful for active non reciprocal devices electric and magnetic walls; absorbing boundaries

14. Software Highlights Post-Processing and Tools Rectangular and polar charts (Smith’s chart, radiation diagrams) Several charts to plot volume currents and E-fields: standard surface plot, surface plot with rendering, contour plot, vector and pseudocolor plot in 3D view Calculation and plot of body force as response to magnetostatic field Animate over time or frequency, and save animation as GIF and AVI Automatic optimizer (modifies parameters and structure to reach a set of goals) Linear circuit solver: connect em solution to other circuits, to lumped elements etc; implements negative subcircuits for manual calibration Wide-Band Spice model extractor: if SmartFit was used, it produces an equivalent circuit perfectly reproducing the em response in the needed frequency band Import/export circuit response as Touchstone file (S?P, Z?P, Y?P). Batch Planner: to run a list of simulations Symmetry Wizard: to evaluate the response of a symmetric 2N ports from 2 N-port simulations

15. Software Highlights Post-Processing and Tools Pascal Script: customize EM3DS (modify also its menu!), accessing internal features to handle calculated response, perform analysis and optimization, access variables etc. Waveguide calibration tool: to use EM3DS in a class of 2-Port waveguide components Multimode-waveguide calibration tool: experimental tool to recover the Generalized Admittance Matrix (GAM) of a waveguide structure, possibly involving planar circuit. Differential ports: they can be defined in post-processing, also to existing results or imported data.

16. Software Highlights Licensing Node-locked and floating multiple license: a license server handles requests in a LAN License server can also run as a transparent service Direct check for available updates in the MEM Research website

17. Some features in detail SmartFIT Adaptively selects a set of frequency points -in a user-desired band- where actually the EM simulation is performed Builds an optimal interpolation, providing the full-band response within the prescribed accuracy In this filter the full band response over 300 frequency points (green curve) is predicted after adaptively evaluating only 8 points (red curve)

18. Some features in detail SmartFIT Here an example of a High Q Fbar resonator: 200 frequency points obtained from a mere 7 point calculation Dielectric resonators also strongly take advantage from this approach (easier to find the in-band peak)

19. Some features in detail Optimizer Select which parameter Select goal(s) Select @ frequencies Then RUN

20. Some features in detail Optimizer Example: An interdigital microstrip filter, initially de-tuned, is automatically tuned by the optimizer

21. Some features in detail Tuner or Tune it!

22. Some features in detail Spice model extractor Extracts a lumped equivalent circuit, that mimics the EM response all over the band, regardless the electrical length of the circuit This example shows an FBAR resonator: the graph compares the full-wave and the spice model responses

23. Some features in detail Coupled Acoustic modeling Enter Mechanical Specifications for the dielectric/metal Stack Create a variable to link EM and acoustic models

24. Some features in detail Coupled Acoustic modeling Example: filter in Agilent duplexer; comparison with measured data

25. Some features in detail Pascal Script Powerful OOP compiler to customize EM3DS

26. Some features in detail Thick Metals How 2.5D tools does handle thick metals? A number of “sheets” with only horizontal currents and a number of vias with only vertical currents 2.5D Model EM3DS Model In EM3DS, 3D mode, any conductor has all current components at the same time; conductors may be sliced with slices having finite thickness

27. Some features in detail Thick Metals Benchmark: thick stripline, whose analytical solution is known (Zo=30.887); neglecting thickness induces 25% error! 1 mm 0.5 mm EM3DS achieves<0.8% with only 3 “slices” (mesh over thickness)!

28. Some features in detail Thick Dielectric discontinuities Ability to model dielectric resonators e.g.: 1 slice (very quick!) gave 5% difference in resonant frequency with respect to HFSS; 3 slices provided 3% Excellent trade-off speed/accuracy to simulate planar structures with DR (typical application: tunable DRO)

29. Some features in detail Antennas Far field charts and plots (below a circular polarized patch) fields currents radiation pattern

30. Some features in detail Controlled sources Modeling of a pHEMT Litton Lp7512 they can model the channel current in a FET: see the example gate Depleted layer=“Control layer” “control plane”: where the control voltage is calculated Channel Controlled source…Id

31. Some features in detail Internal ports can be used to model e.g. packaging or to excite antennas (e.g dipole) SC70 Printed Yagi Uda

32. Some features in detail Magnetic walls/symmetry planes Enclosure walls can be perfect electric conductor (PEC), magnetic conductor (PMC) and absorbing boundaries. PMC useful for symmetric structures. Absorbing boundaries for antennas PMC for symmetric structure

33. Some features in detail MEMS applications Pacheco switchMumps capacitor Inductor

34. At a Glance Editor view

35. Concluding Pricing: lowest in the EM market affordable also for small companies and institutions discounted prices for Universities and qualified no-profit organizations discount for numbers Testing: download the full version; trial time of 30 days; www.memresearch.com download the free limited versions for additional information contact info@memresearch.com