1. Heterogeneous Technology Alliance Template HTA General Assembly November 12 – 13, 2013

2. The Heterogeneous Technology Alliance HTA Project Idea: RF MEMS SWITCH TECHNOLOGY FOR SPACE APPLICATION EU call:ESA Project Idea short description HTA common proposal for ESA call aiming at selecting best RF MEMS switch process in Europe Short Description: → benchmark RF MEMS suppliers with a common standardized procedure → select the optimum RF MEMS switch process for further reliability testing → prepare it for further space qualification Potential Applications: Space, defense, telecom Potential Consortium/Competences needed: Contact: christophe.billard@cea.fr RF MEMS switch process Hermetic packaging Reliability testing, Space qualification

3. The Heterogeneous Technology Alliance HTA Project Idea: RFID Acoustic Sensors EU call:H2020 Project Idea short description Wireless battery free sensor system for harsh environment Short Description: → Lamb wave sensors enabling measurements of pressure, temperature, viscosity, or humidity → Operation in harsh environment (T°>600°C) and eventually in liquids → Develop packaged RFID sensor modules and their interrogation system Potential Applications: automotive, medical, industry, space, aeronautic … Potential Consortium/Competences needed: Contact: christophe.billard@cea.fr Acoustic technology (Lamb wave, SAW, BAW) Process bricks for harsh environment (electrodes, packaging…) RFID (reader, antenna) System deployment (monitoring software, tag identification)

4. The Heterogeneous Technology Alliance HTA Project Idea: Flexible self-powered RFID sensor tag EU call:H2020 Project Idea short description Flexible sensor tag with integrated energy harvester Short Description: → shape memory alloys (SMA) can detect and harvest from temperature variation → Magnetostrictive materials detect and harvest from a movement (moving magnet) → Idea is to build flexible sensor tag which can detect an event and harvest energy to send the information or write in an embedded memory Potential Applications: traceability in medical, food, industry… Potential Consortium/Competences needed: Contact: christophe.billard@cea.fr Materials for harvester/sensor (SMA, magnetostricitve) Flexible technology (encapsulation, memory) RFID (reader, antenna) System deployment (monitoring software, tag identification)

5. The Heterogeneous Technology Alliance HTA Project Idea: OPEN3D EU call:Other initiatives Idea short description: Provide an European complete 3D & packaging integration platform Short Description: Open 3D™ is a CEA LETI 3D technology offer, targeting industrial (SMEs) & academic customers: 3D mature technologies, no NRE, short cycle time, 200 mm & 300 mm, Global offer from 3D design to component final packaging. Possibility to make proof-of-concept, prototyping & small volume production Potential Applications: niche market for 3D: Space, defense, telecom, fundamental physics (CERN…) Competences needed: Contact: yann.lamy@cea.fr Wafer-level TSV-last and RDL process Balling, stacking & packaging Testing Reliability

6. The Heterogeneous Technology Alliance HTA Short Description: Ambitious µ-fluidic project for HPC. Investigation innovative new fluidic compound thermal evacuation in micro-cooling channels in silicon interposers. New nanofluids synthesis and modelling, interposer fabrications, Test & validation Potential Applications: HPC, servers, micro-servers, particle physics detection Potential Consortium/Competences needed: - New fluid synthesis and fabrications / simulation modeling - µ-channels fabrication, Si interposer, Si-si bonding at CEA LETI - strong expertise on fluidic connectors (e.g: CSEM) Project Idea: 3DIC thermal management EU call:H2020 Project Idea short description Thermal Management with microfluidic / High performance computing (HPC) Contact: Patrick.leduc@cea.fr 10-100µm channels in silicon – LETI examples

7. The Heterogeneous Technology Alliance HTA Short Description: realize a generic 3d technology for 4-side buttable ultra fine pitch detectors for particle physics and/or X-rays -Start with 130-nm existing ROIC -Prepare the 65nm shift with ultra fine pitch TSV -Large surface bow/warp management of thin modules -Compliant and high yield 2 nd level interco for flip chio -Strategy for high yield assembly and pre-industrialization Potential Applications: Large area particle detection, / X-rays detection  HEP, medical, X-rays cristallography, synchrotron Improvement of sensitivity / reduction I dark Potential Consortium/Competences needed: TSV fabrication (last/middle), thin module hanlding, fine pitch interco, bumping and report capabilities Project Idea: 4-side buttable 3D detectors EU call:H2020 Project Idea short description 3D integration for particles physics & medical imaging Contact: Yann.lamy@cea.fr Dead zone free detection Courtesy from Advacam

8. The Heterogeneous Technology Alliance HTA Short Description: Merge 3D silicon electronics for high speed/freq. with electronics on foils, development of integrated interconnects and packaging/encapsulation solutions in order to ensure enhanced durability of these heterogeneous smart systems. First levels of intelligence with passives components and organic thin film transistors, and biocompatible coating. Potential Applications: Medical applications, health patch, telemonitoring, wireless communications, biosensors (glucose, spO2, T°C…) Potential Consortium/Competences needed: Foil manufacturers, compliant and stretchable intercos, ultra thi si interposers, passives en foils, thermomechanical modeling, reliability and test LETI, LITEN, VTT. Project Idea: 3D Silicon and smart system on foil for medical EU call:H2020 Project Idea short description Heterogeneous smart system on flexible foils Contact: Yann.lamy@cea.fr On foil and si to foil intercos Foil-on-foil to multifoils interco Medium to high 3D interco + multiple sensors User frinedly durable and flexible packaging

9. The Heterogeneous Technology Alliance HTA Short Description: realize a full transparent biocompatible and hermetic glass packaging for System- in-Package for medical implants -Glass process investigation (etching, thining) -Heterogeneous assembly -Hermetic sealing -In vitro testing Potential Applications: Medical implants: cardiac probes, neural probes, Potential Consortium/Competences needed: Sensors development, glass interposer development, hybridation rdie report, Through-glass-Vias, glass thinning and handling Biocompatibility evaluation Project Idea: Glass hermetic biocompatible packaging for medical implants EU call:H2020 Project Idea short description Highly integrated medical implantable sensors Contact: Yann.lamy@cea.fr 3D vertical electrical connection. Through Glas Via (TGV). IC Chip Glass cap ME MS Biocompatible electrical pads: 3D printing or ECD Ex: hermetic sealing SiO2/SiO2, Au/Au, Au/Si, Au/Sn… Ultra-thin package < 750µm Glass interposer Cavity in glass Add-on: Integrated humidity sensor - Antenna <2mm

10. The Heterogeneous Technology Alliance HTA Project Idea: ultra large interposer for HPC/data servers EU call: H2020 - LEIT Project Idea short description: « ultra large and fine pitch Si interposer : from simulations to fabrication » Short Description: Stress monitored ultra large ( >5cm) Si interposer realization with possibility of fine pitch interconnect (<10 µm). Simulation: -stress and layer compensation. - DRM for direct copper bonding on TSV fine pitch. -Thermal dissipation simulation. Demonstrator realization. Smart interposer? ( open to consortium proposals) Potential Applications: 3D interposer fine pitch for HPC, Leds, power devices, 3D devices. Potential Consortium/Competences needed: LETI (CNRS SIMAP, IMP Bordeaux) : interposer process, top die post process, simulation Partners for : demonstrator design and characterization, design/fabrication or supply of top dies thermo-mechanical material behavior expertise, characterization,., other proposals? Contact: lea.dicioccio@cea.fr

11. The Heterogeneous Technology Alliance HTA Project Idea: advanced non destructive failure analysis EU call: H2020 (“STREP”-preferred) Project Idea short description: Development of a « TOBIC » 3D failure analysis tool Short Description: Problem to be solved: submicronic failure detection in buried layers (TOBIC offers additional informations compared to existing techniques, and allows a better resolution) → Principle: Two-Photon Optical Beam Induced Current (TOBIC) → Electrical analysis of signal produced by carriers optically injected in the layers → Objective of the project: design and fabrication of a “demonstrator” equipment adapted to various market segments Potential Applications: -Detection of crystalline defects, doping modifications, interco failures, 3D-imaging of defects… -3D reliability, package in package, WLP, MEMS… Potential Consortium/Competences needed: -Industrial partners: TEEM Photonics (Equipment Manufacturer, coordinator, F), SERMA (Characterization Service provider, F), equipment end-user (Foundry? tbd), image reconstruction (tbd), low current detection instrumentation (tbd) -Academic partners: Grenoble Univ. IMEP-LAHC (F), understanding of materials-laser interaction (tbd) -HTA partners :CEA-LETI, image reconstruction (FhG?), Cross X-Ray analysis (CSEM?)…(?) Contact: didier.bloch@cea.fr

12. The Heterogeneous Technology Alliance HTA Antenna PCB Project Idea: Metamaterials for mmW SiP packages EU call: H2020 LEIT Project Idea short description: Development smart interposer with metamaterials for millimeter wave mmW applications Short Description: Integration and packaging of heterogeneous SiP for mmW applications. -Integration of the mmw antenna directly on an interposer (Si or organic) -Replacement of the reflector by 3D metamaterials -Subwavelength cavity reduction,     Ultra directive antenna  Goals: improve diminution of package footprint Costs, and antenna performances Potential Applications: -Wireless 60 GHz high data rate applications -Automotive radar 77GHz -Imaging 100-120 GHz Potential Consortium/Competences needed: -Mmw heterogeneous electromagnetic simulations -Si/organic interposer fabrications, 3D integration: TSV, intercos -Reliably assembly and wafer level packaging -RF/mmw anechoic testing, 100 GHz Contact: Yann.lamy@cea.fr High Impedance Surface Metamaterials