3. Mr. FLIP flow method : Good for lead free solder Mr. FLIP makes perfect molten solder circulation in the pot. Movement of solder occurs under the two nozzle then flow through the nozzle and go down by gravity. Movement is slow and evenly through out whole pot, conventional pump system around propeller 5 to 7 time faster than FLIP. Slow and even solder flow has better temperature control (as good as 1± ℃ ) it is good for Lead-Free (30 ℃ higher melting point) wave soldering. 6mm

4. 「 Mr.FLIP 」 Flow simulation Whole area circulation at the low solder flow speed that makes an uniform temperature and composition. Bottom

5. Tamura FLIP Solder Bath Advantages Slow and even solder flow: create stable wave. : create better temperature control. : create less solder dross. : create almost no erosion. : quick response for temperature and flow. Less solder used: only 300kg, instead 650kg Eliminate moving parts: Improved machine reliability. : Elimination of acid oxidization around motor spindle. : Ease of maintenance Open space to access inside bath. Easier nozzle cleaning. Easier passage cleaning (6 mm gap)

6. Ease of FLIP Maintenance Clean nozzle Remove the nozzle (Remove two screw x 2) Clean the passage In between back iron and pot wall (6 mm gap) Insert narrow AL prate From top of pot of clean. Clean whole pot. Remove the back iron. (Remove 4 x 2 screw x 4) Do not have to drain the solder. 6mm Remove the nozzle Remove the back iron

7. Conventional Pump System Two this mechanism inside Pulley Belt Motor Duct Bearing Impeller Bump Shaft Heater 5 to 7 time faster flowDirection change Maintenance; drain-out whole solder to clean the mechanism to clean the mechanism Maintenance; drain-out whole solder to clean the mechanism to clean the mechanism Acid oxidization