1. COUNCIL FOR THE CENTRAL LABORATORY OF THE RESEARCH COUNCILS EAP dimple fabrication process. Process D EAP dimple using carbon powder electrodes and DRIE

2. COUNCIL FOR THE CENTRAL LABORATORY OF THE RESEARCH COUNCILS Basic process sequence (1) Double side polished silicon wafer. (approx 400um thick)

3. COUNCIL FOR THE CENTRAL LABORATORY OF THE RESEARCH COUNCILS Basic process sequence (2) Coat top side with photoresist (to form interface layer)

4. COUNCIL FOR THE CENTRAL LABORATORY OF THE RESEARCH COUNCILS Basic process sequence (3) Pattern resist

5. COUNCIL FOR THE CENTRAL LABORATORY OF THE RESEARCH COUNCILS Basic process sequence (4) Bake at ~120deg to reflow and round edges Bake at ~200deg to harden

6. COUNCIL FOR THE CENTRAL LABORATORY OF THE RESEARCH COUNCILS Basic process sequence (5) Sputter-coat with Cr/Au for lower electrode tracks

7. COUNCIL FOR THE CENTRAL LABORATORY OF THE RESEARCH COUNCILS Pattern and etch Cr/Au to form lower electrode tracks Basic process sequence (6)

8. COUNCIL FOR THE CENTRAL LABORATORY OF THE RESEARCH COUNCILS Basic process sequence (7) Coat with electro-active polymer layer

9. COUNCIL FOR THE CENTRAL LABORATORY OF THE RESEARCH COUNCILS Basic process sequence (8) Sputter-coat with Cr/Au and pattern to form upper electrode tracks

10. COUNCIL FOR THE CENTRAL LABORATORY OF THE RESEARCH COUNCILS Basic process sequence (9) Coat resist on lower surface and pattern for dimple apertures.

11. COUNCIL FOR THE CENTRAL LABORATORY OF THE RESEARCH COUNCILS Basic process sequence (10) DRIE lower surface to form dimple apertures and strip resist.

12. COUNCIL FOR THE CENTRAL LABORATORY OF THE RESEARCH COUNCILS Apply carbon powder electrodes Basic process sequence (11)

13. COUNCIL FOR THE CENTRAL LABORATORY OF THE RESEARCH COUNCILS Basic process sequence (12) Spray-coat protective elastomer film Bond into annulus, wire-up and test!