1. FE Halogen free material- Technical necessity or marketing campaign 1 Dr. M. Cygon Isola AG October 2000

2. FE Main components of base materials Copper foil Glass fabric Thermosets 2

3. FE Brominated epoxy resin 3 CH 2 -CH-CH 2 -O- O -C- CH 3 -O-CH 2 -CH-CH 2 O -C- CH 3 -OHHO- Br + -C- CH 3 -O- Br CH 2 -CH-CH 2 -O- OH -C- CH 3 -O-CH 2 -CH-CH 2 O CH 2 -CH-CH 2 -O- O -C- CH 3 -O-CH 2 -CH-CH 2 OH TBBA DGEBA 2

4. FE Hazardous substances (EACEM list) Antimony and its compounds Arsenic and its compounds Beryllium and its compounds Cadmium and its compounds Chromium(VI) and its compounds Cobalt and its compounds Lead and its compounds Mercury and its compounds Metal carbonyl Organic tin compounds Selenium and its compounds Tellurium and its compounds Thallium and its compounds AsbestosCyanideBenzene Phenol (monomer) TolueneXylene Polycyclical aromatic hydrocarbons CFCs and halons (substances that destroy the ozone layer) Acrylonitrile (monomer) DMA (N,N)-dimethyl acetamide NMA (N)-methylacetamide DMF (N,N)-dimethyl formamide NMF (N)-methyl formamide DiethylamineNitrosamideNitrosamine Ethylene glycol ether and acetale Phthalates (all) Formaldehyde (monomer) Hydrazine Picric acid Halogenated aromatic hydrocarbons (general prohibition) PBD, polybrominated diphenyls PBDE, polybrominated diphenyl ether PCD, polychlorinated diphenyls PCT, polychlorinated triphenylsPentachlorophenolDioxinsDibenzofurans Halogenated aliphatic hydrocarbons Epichlorhydrin (monomer) Vinyl chloride (monomer) PVC and PVC mixtures 4

5. FE 5

6. FE 6 PCDD- and PCDF-Kongenere with 2,3,7,8-Chlorine substitution pattern Chlorine Oxygene “Seveso-Toxin“

7. FE 7

8. FE Waste treatment - Recycling not possible due to glass reinforcement and thermoset epoxy - Copper recycling possible - Thermo-treatment possible, if proper flame retarder - Waste uncritical for repository, after copper removal 8

9. FE Environmental aspects on base material cannot be converted to PCB´s! Solder metal Resist Devices Service print Ni/Au 9

10. FE Do we really need flame retarded laminates for all applications? 10

11. FE 11

12. FE Base materials without flame retarders Grade G-10 G-11 PD BT CE Gigaver UL-Rating HB V-1 12

13. FE Which compounds can be used to obtain a flame retardent effect ? nitrogen compounds phoshorous compounds halogen compounds (chlorine, bromine) hydrates (Al(OH) 3 xH 2 O, Mg(OH) 2 xH 2 O) Reactive components Additives tetrabromobisphenol A EP-phosphoric acid esters multifunctional amino-compounds melamines phosphates polybrominated biphenyls*) polybrominated diphenyl ethers*) brominated phthalimides hydrates *) can form dioxins and dibenzofurans 13

14. FE Mechanism of Flame Retarders HALOGENES R + HX R-H + X HX + OH H 2 O + X X = HALOGENES 14

15. FE Mechanism of Flame Retarders PHOSPHOROUS COMPOUNDS + H 3 PO 4 + C HO O P OH HO n -CH 2 -CH 2 - DEHYDRATION GLASS-LIKE POLYPHOSPHOROUS ACID ORGANIC COMPOUND PHOSPHOROUS ACID CARBON -H 2 O 15

16. FE Mechanism of Flame Retarders HYDRATES Al 2 O 3 + x + 3 H 2 O2 Al(OH) 3 xH 2 O 16 ~ 280 o C

17. FE Halogen free base material SC - VO 351 (FR-2) PHOSPHOROUS/NITROGENE ADDITIVE BROMINATED ADDITIVE IN OUT 17

18. FE Halogen free base material DURAVER-E-Cu 150 (FR-5) REACTIVE PHOSPHOROUS MODIFIED EPOXY RESIN REACTIVE BROMINATED EPOXY RESIN IN OUT NITROGENE HARDENER DICY HARDENER 18

19. FE Halogen free base material DURAVER-E-Cu 156 (FR-4) REACTIVE PHOSPHOROUS MODIFIED EPOXY RESIN REACTIVE BROMINATED EPOXY RESIN IN OUT 19

20. FE FE 20

21. FE Outlook 21 a) markets - halogen free PCB´s are interesting for the auto- motive industry due to the motor vehicle regulation - electronic for telecommunication will use halogen free PCB´s for marketing reasons - with TBBA flame protected PCB´s will be use furthermore in quantities

22. FE Outlook 22 b) materials