1. Konrad Ahlin Ben Davidson Bob Evans Jackson Lamp David Sachenik Rob Steigerwald David Yip

2. The Issue to be Investigated How to guide a deaf blind individual through a building they have never been in before? less than 10% of legally blind people in the US can read Braille 35% of people who are blind or visually impaired use a white cane to get around and 2% use a guide dog

3. General Requirements Navigates Efficiently Sized for 1 person Hands Free Communicates with deaf/blind individual Simple User Interface Easy to use and Train

4. Specifications of Design Device Weight muse be less than 0.25 Lb Fits within a 4in x 2in x 1in volume Inconspicuous Untethered <50 dB at 3ft Cost less than $700

5. Specifications of Design Device cont. Uses RFID Tags Power lasts for ten 20 minute navigations per charge Charges within 8 hours

6. Teams P11016 and P11017 Tactile actuation I2C Non-Modular RFID Tags and Reader Keypad Dijkstra’s Algorithm Wrist Strap Functional Flow Diagram

7. Changes Vibration Specific numbers of RFID tags Not on the arm I2C? Modular

8. Client Input – (Stephanie Ulman ) Needs to be Hands-free No vest – either necklace or belt-like device Push buttons would be best Calculator design Raised buttons Large print Warning before a turn Help to turn exact 90 degrees/ center in hallway Prefers Auditory responses, but vibration is second preferred

9. Assumptions Completely Deaf and Blind No Obstacle Avoidance (Dog or Cane) Must be independent of other devices Only Second Floor of Engineering Building Walking Speed

10. Worries About Design Size Components Weight of Components Issues with Magnetometer Selecting Exact Components Interconnections between Devices Power consumption for all devices Interaction of RFID Signals

11. Region Map Nearest Tag ID(s) Destination Charging Power On Map? Hardware Health Movement Instructions ETA Receive Map Info Record location history Regulate Power Enclosure: Support & Manage Internal Components Receive User Input Calculate path Determine Orientation (Compass) ID current location (RFID) Compare current to map Calculate next movement instruction Deliver Information to User Calculate Velocity Calculate ETA Monitor Hardware Health (MCU: Define Interfaces with Power, User Input, Map Input, RFID Reader, Compass, Output Drive Circuitry) On-Board Power Navigation Loop

12. User I/O Interfacing Inputs 6 digit room number/code Possible Testing Inputs Outputs Turn Warning Pulse Turning Vibration Testing Vibrations Confirmation of Destination and button push Warning when off track Battery Low

13. Different Conceptual Designs

14. Designs for Further Consideration and Evaluation BELT VEST NECKLACE

15. Concept Evaluation Criteria Directionally Intuitive Simple User Interface One Size Fits All Recognizable Feedback to User Versatile Relatively Inconspicuous

16. PUGH Method Necklace Vest Belt/Fanny Pack

17. PUGH Method

20. Final Designs: General Design Vibrating Feedback Motors Modular Design Magnetometer

21. Functional Decomposition

22. Benefits of Final Design Inconspicuous in nature Comfortable placement for user Intuitive to user Reliable directionality Consistent feedback Client approved (interview with potential customer)

23. Combination of Components Modular design with vibration Stationary placement for directional device Heat dissipation and location Reduced potential for damage

24. Final Design: Magnetometer HMC6352  0.6” x 0.6” Simple, clean, degree resolution compass heading with full integration of 2-Axis magnetic sensors and electronics  Cost: $34.95 http://www.sparkfun.com/products/7915 HMC6343  0.8” x 0.8”  3-axis accelerometer with tilt compensation  Cost: $149.95 http://www.sparkfun.com/products/8656

25. Final Design: Magnetometer LSM303 Breakout Board  2.0cm × 2.0cm  3-axis accelerometer combined with a 3-axis magnetic sensor  Cost: $29.95 http://www.sparkfun.com/products/10703 **Micro-controller must be selected first, so it can be determined where or not the digital compass will be able to affectively interact. (MCU selected might already include a digital compass)

26. Final Design: Micro-controller Requirements: Low power Small size and low weight High RAM capacity Ability to interface with a range of devices Ability to go into low power states Prebuilt boards preferred

27. Final Design: Micro-controller STMicroelectronics iNemo2 (INertial MOdule) Evaluation Board ($286) http://www.st.com/internet/evalboard/product/250367.jsp Small size – 4cm x 4cm Built around an ARM Cortex –M3 MCU 72 MHz clock (maximum) 64 KB SRAM, 256 KB Flash, and SD controller Features multiple low power modes Features an array of built-in sensors Built in 3-axis magnetometer Built in accelerometer Built in gyroscopes

28. Final Design: Micro-controller TI Stellaris 3000 Series ARM Cortex –M3 ($1.00-$8.25 apiece) http://focus.ti.com/mcu/docs/mculuminaryfamilynode.tsp?sectionId=95&tabId=2601&familyId=1760 Larger footprint – 14mm x 14mm Up to 50 MHz clock Up to 64 KB SRAM and 256 KB Flash Comes with Stellaris RTOS and tools in ROM Large selection of serial and analog interfaces, including USB controller and PWM outputs on some models Freescale K10/K20 Series ARM Cortex –M4 ($5.00-$8.00 apiece) http://www.freescale.com/webapp/sps/site/homepage.jsp?nodeId=01624698C9 Smaller footprint – As small as 5mm x 5mm Up to 100 MHz clock Up to 128 KB SRAM and 512 KB Flash K20 has USB controller Support for Freescale Tower development system

29. Final Design: Micro-controller TI MSP430 ($0.50-$6.95 apiece) http://focus.ti.com/paramsearch/docs/parametricsearch.tsp?familyId=1615&sectionId=95&tabId=2229&family =mcu Lowest power MCU on the market Up to 25 MHz clock Up to 18 KB SRAM, 256 KB Flash Limited feature set depending on model Microchip PIC32MX795F512L ($10.00 apiece) http://www.microchip.com/wwwproducts/Devices.aspx?dDocName=en545660#2 Low-powered PIC MCU comparable with ARM chips Up to 80 MHz clock 128 KB SRAM, 512 KB Flash Numerous serial and analog interfaces, including USB controller

30. Final Design: Main Case Material Material Density (lbs/in3) Youngs Modulus (psi) Yield Strength (lbs)Dimensions (in)SupplierCost ABS Plastic0.037320000650012x24x0.0625Parts Express+/- $50 Acrylic0.0444641201000028x30x0.1Plaskolite$17 Acetal0.0561750000880012x12x0.125Small Parts$14 Polypropylene0.033290000450012x24x0.0625Small Parts$5 PVC0.049319000650012x24x0.0625Small Parts$13 Polycarbonate0.0433200001000012x24x0.25Small Parts$21 Teflon0.07970000335012x12x0.015Small Parts$11

31. Retail Case: http://www.radioshack.com/product/index.jsp?productId=2062279 Specs: Material: ABS Plastic Volume: 3” x 2” x 1” Wall Thickness:< 0.09” Weight: <1.5 oz Cost: < $3

32. Final Design: Keypads Series 96 Conductive Rubber Keypad Produced by Grayhill INC. Specifications: 2.00 in. x 2.70 in. x.125 in.075 in. button height Uses conductive rubber to mate PC board traces Matrix Circuitry Backlit and Shielded Options Available Termination Mates With Standard Connectors Tactile Feedback to Operator 1,000,000 Operations per Button Compatible With High Resistance Logic Inputs

33. Final Design: Keypads Series 84S Sealed Keypad Produced by Grayhill INC. Specifications: 3.1 in. x 2.35 in x.270 in..230 Button Height Waterproof Silicone Rubber Easily Customized Legends Audible, Tactile Contacts Low Contact Resistance Optional RFI/EMI Shielding 3,000,000 Operations per Button

34. Final Design: Battery NameCompanyWeightSize (LxWxH) CostOther NP-FG1Sony1 oz41.6 x 35.5 x 8.3 (mm) $37.493.6V, 960mAh SLB-1137Samsung1.94 oz53.2 x 35.3 x 7.1 (mm) $7.493.7 V, 1130 mAh AB463446B A Samsung1.1 oz2.1 x 1.35 x.28 (in) $2.933.7 V, 800mAh RIM Blackberry C-X2 Battery Blackberry0.8 oz2 x 2 x 1 (in) $25.013.7, 1400 mAh

35. Battery which looks most promising: Given our restrictions with size (primarily weight), it would be reasonable to say that Samsung’s SLB- 1137 would be best for the following reasons: Ideal size and weight for a battery (unlike the Blackberry). Longer life (mAh) than the Samsung AB463446BA. Longer life (mAh) and cheaper than the Sony NP-FG1

36. Final Design: Motors Navigation Feedback Precision Haptic 10mm Vibration Motor - 15mm Type Two motors Motors come as shown, no casings included Input Confirmation Pico Vibe 12mm Vibration Motor - 3.4mm Type One motor within the base unit or keypad

37. Final Design: RFID Antenna/Reader Light weight (>1lb) and only 8.5 inches square Superior performance 8 dBi gain with broad coverage It is suitable for both indoor and outdoor wireless applications in the 900MHz ISM band, GSM, 900MHz cellular and RFID applications.

38. Stress Testing Heat and Cold Impact Vibrations Humidity Loading

39. Project Time Line Task NameDurationStartFinishPredecessors System Design Review Done 5 daysThu 9/29/11Wed 10/5/1114,15,16 Basic CAD Drawings 3 daysThu 9/29/11Mon 10/3/1115 Confirm Guests1 dayFri 9/30/11 16 Complete Mock Presentation 1 dayWed 10/5/11 18 SLDR1 dayThu 10/6/11 18 Design Alterations 3 daysFri 10/7/11Tue 10/11/1122 Basic BOM3 daysWed 10/12/11Fri 10/14/1123 Product List3 daysWed 10/12/11Fri 10/14/1123 Evaluate Time Line 1 dayFri 10/14/11 Order Initial Parts 5 daysMon 10/17/11Fri 10/21/1125 Begin DLDR5 daysMon 10/17/11Fri 10/21/1122 Finalize BOM5 daysMon 10/17/11Fri 10/21/1124 List of Testing Plans 5 daysMon 10/24/11Fri 10/28/11 PCB Layouts5 daysMon 10/24/11Fri 10/28/11 DLDR Finalized4 daysMon 10/31/11Thu 11/3/1128,29,31 DLDR Presentation 1 dayFri 11/4/11 32 Prep for Project Review 5 daysMon 11/7/11Fri 11/11/1133 MSD I Project Review 5 daysMon 11/14/11Fri 11/18/1134 Task NameDurationStartFinishPredecessors Meet Group0 daysFri 9/9/11 Establish Norms and Values1 dayFri 9/9/11 1 Role Assignment1 dayFri 9/9/11 1 Become familiar with last year's design 3 days Mon 9/12/11 Wed 9/14/113,1,2 Become familiar with Requirements 3 days Mon 9/12/11 Wed 9/14/113,1,2 Outlined Specifications3 days Mon 9/12/11 Wed 9/14/113,2,1 Brainstormed Solutions5 days Mon 9/12/11 Fri 9/16/113,2,1 Drafted own Project Requirements 5 days Mon 9/12/11 Fri 9/16/113,2,1 Rated Brainstorm Ideas3 days Mon 9/19/11 Wed 9/21/118,7 Evaluated Personal Concepts 3 days Mon 9/19/11 Wed 9/21/118,7 Finish Functional Decomposition 3 days Mon 9/19/11 Wed 9/21/118 Establish Benchmarks2 daysThu 9/22/11Fri 9/23/1111 Develop Schedule2 daysThu 9/22/11Fri 9/23/1111 Establish SLDR Requirements/Deliverables 2 daysThu 9/22/11Fri 9/23/1111 Pugh's Evaluation3 days Mon 9/26/11 Wed 9/28/1114 Contact Invites for SLDR1 day Mon 9/26/11 14 Presentation Plan4 daysFri 9/30/11Wed 10/5/1114

40. Project Time Line

41. Risk Management #RiskCauseEffectLSIActionOwner 1Lack of preparation for SLDR Bad team organization Lack of or poor communication Team members not doing work Improperly assigned work Other obligations take over Bad grade Disappointed guide Behind schedule More work late in project 236 Clear plans and timeline Communicate issues early Make sure everyone is clear on what is required for SLDR Get input beforehand Facilitator Lead engineer Project manager 2Team member leaves Student is too busy drops class, Co-op, Family Emergency, Frustrated Teammate Workload gap to fill within the group, Bad Feelings within Groupe 133 Constant Peer Evaluation, Communicate issues early within group Everyone 3Team member is absent Sickness, Personal Issues, Rebelious Team member, Religious reasons, transportation issues Team member misses valuable information, takes time to inform member next time or via email, extra work, unable to present 212 Clear communication of schedules, Make sure to inform teammates about conflicts and absences ahead of time, Check email regularly Everyone (Facilitator) 4Delivery of parts delayed Company purchased parts from has part on back order, Unknown reason (act of God), wrong part sent Project Timeline may be adjusted slighty, can't perform certain tasks without the part 224 Order parts in a timely manner to take into account for a couple of days delay, Keep in steady contact with supplier, Identify alternative suppliers and backup plans Project Manager 5Falling behind schedule All members are not pulling their weight, slackers in the group, busy schedules Project Timeline effected, Ultimately effects build and testing time (MSD II), increase workload of group 224 Good up to date and detailed project timeline that adjusts accordingly, Flexiblity of timeline, Be responsible for the team Facilitator Project manager 6Design isn't feasible Incorrect assumptions Didn't do sufficient research Design too complicated Poor project planning Forced to re-design Fall behind schedule Don't finish More work late in project 236 Constant Re-evaluation of design Go through details carefully and repetitively EVERYONE (Lead Engineer) 7 Interfaces fail (See Risk 6) Forgetting to read all specs in detail, wrong information from company which parts were purchased Can't complete project, forced to re-design and make things just work even though it might not be the best way to do it 236 Constant Re-evaluation of design Go through details carefully and repetitively EVERYONE (Lead Engineer) 8 Hardware failure (See Risk 6) Forgetting to read all specs in detail, wrong information from company which parts were purchased, Problem occurs during testing (blows up or circuit shorted) Set back in time, can't move forward with other tasks because hardware can't be tested and complete device will be unoperable 236 Constant Re-evaluation of design Go through details carefully and repetitively EVERYONE (Lead Engineer) 9 Loss of work due to technical issue Someone accidently deletes files from SVN, loss of a flash drive with valuable information, work not backed up Set back in time, can't move forward with other tasks because information was pertinent to future work 133Back up all work to EDGE websiteEveryone

42. Risk Management 10Design doesn't satisfy customer Misunderstanding with customer, designed because it was easier for manufacturer not the user, incorrect assumptions Customer won't purchase product, needs to be modified in order to satisfy customer 122Communicate constantly with customerProject Manager 11Design doesn't meet specs Simply couldn't meet specs, bad design, bad preparation, incorrect assumptions Fall behind schedule and can't finish, guide takes off points in grading rubic, uncomfortable for user to use 224 Constant Re-evaluation of design Go through details carefully and repetitively Project Manager Lead Engineer 12Can't get assistance from faculty Faculty office hours conflict with member class times, students do not get along with faculty, Poor communicate Lack of knowledge base on the design development and unsolveable issues 111 Keep regular contact with faculty, talk to guide or other faculty members, keep everyone informed Everyone 13Failure to identify potential problems Overlooking details, not specific enough with technicalities Fall behind schedule, forced to redesign and come up with new ideas 235 Constant Re-evaluation of design Go through details carefully and repetitively Facilitator Project Manager (Everyone) 14 Design a system that is beyond team's ability to implement Overthinking of project to be designed, group wants to design the perfect project but doesn't have the skill set to do so, poor project planning Can't actual build the device, stuck looking for alternatives to design product 224 Be realistic, follow detailed project timeline Constant Re-evaluation of design Go through details carefully and repetitively Lead Engineer 15Over budget Having to re-purchase parts Fail to anticipate shipping cost Poor communication Can't finish product, has to compensate for parts that are less than ideal 224 Updated and accurate BOM, designate a consultanted/treasurer Project Manager 16MCU has insufficient RAM Incorrect assessment of resource requirements Can't finish product Have to replace MCU 224 Build sample program to test resource requirements Find cheap sample device to test CE/EE 17Inability to interface with MCU Incorrect assessment of resource requirements Unable to find or build PCB for MCU MCU failure Can't finish product Have to replace MCU Need to change interfaces 326 Find MCU with prebuilt board Choose MCU with simple interface Decide on interfaces before finding MCU Have a fallback MCU in case of failure CE/EE 18Cannot program MCU Cannot afford proprietary tools Cannot find tools Lack of programming interfaces Can't finish product Have to choose different MCU 224 Find MCU demo board with free tools Choose MCU with tools owned by RIT Use prebuilt board with programming interface Find cheap development system Research common programming interfaces CE/EE 19MCU power consumption too high Incorrect assessment of MCU power requirements Inability to put MCU to “sleep” Board's components drain excessive amounts of power Failure to meet requirements Have to choose different MCU Have to alter design Turn off MCU manually (may require second lower-powered MCU) 310 Research/test each board's power consumption Test each MCU's low power states CE/EE 20 Can't Machine Material Melting point too low Material too soft Can't properly make casing122Talk to machine shopME

43. Risk Management 21 Case doesn't survive impact tests Material not strong enough Joints not strong enough Flaw in design Case is not strong enough to suit customer needs 133Field test materials for likelyhood of breakingME 22 Not enough volume Components too big, design too small Can't meet requirements236Map out components before building case ME Everyone 23 Material Too heavy Components are too heavy, case too heavy Can't meet requirements236Weigh components, estimate total ME Everyone 24 Battery Does not supply enough power Bad Design Wrong part Poor communication amongst team Have to order a different battery Change the design 122 Order appropriate battery Communicate with team Lead Engineer EE 25 Battery Takes up too much space/weight Poor selection of part Project specifications & requirements Part can not be used Need a different part Design will not meet specs 122 Order appropriate battery Communicate with team Lead Engineer EE 26 Magnetometer doesn't work properly, direction sensing appears to be off Incorrect research on device, interference with other magnet fields in the building Unable to sense direction, guides user to incorrect location 236 Properly install and program device, perform tests with magnetometer to ensure proper direction sensing, determine if tilt sensitive EE/CE 27 Magnetometer can't interact with MCU Not enough research on MCU and digital compass interaction No magnetometer in design, unable to sense north direction making it difficult to properly navigate the user of the device 236 Properly install and program device, make sure magnetometer can easily interact with the microcontroller EE/CE 28Feedback Can't be UnderstoodNot being familiar w/ user.Doesn't work133Talk to user.Rob 29User can't input destination.Using interface not familiar withNeed to use different interface133Find more user friendly interface.Rob 30 User can't figure out how to turn off device with selected input. Confusing interface selected.Device will run out of battery.111Find simplistic user interface.Rob

44. Possible Ideas for the Future Interchangeable Output Devices Loading Maps Incorporation with every day items (GPS) Hot Keys (programmable) Different Wearable Application

45. Questions