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Monolithic Pixel Detectors in a Deep Submicron SOI Process, TIPP, Tsukuba, Japan 11-17 March 2009 1 Discussion of process features.

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Presentation on theme: "Monolithic Pixel Detectors in a Deep Submicron SOI Process, TIPP, Tsukuba, Japan 11-17 March 2009 1 Discussion of process features."— Presentation transcript:

1 Monolithic Pixel Detectors in a Deep Submicron SOI Process, TIPP, Tsukuba, Japan 11-17 March 2009 1 email: deptuch@ieee.org Discussion of process features to target optimum monolithic SOI Pixel Detectors Grzegorz DEPTUCH Fermi National Accelerator Laboratory, Batavia, IL, USA  OUTLINE: 1) objectives of optimization, 2) conclusions from previous work, 3) Design details of pixel imaging detector „MAMBO”, 4) Achievements, observations and investigations, 5) Conclusions on current status of the technology, 6) Discussion around necessary changes to the process, 7) Conclusions.

2 Monolithic Pixel Detectors in a Deep Submicron SOI Process, TIPP, Tsukuba, Japan 11-17 March 2009 2 Fabrication of detecting layer and electronics in the same fabrication flow requires investigating potential improvements from different angles: Fabrication of detecting layer and electronics in the same fabrication flow requires investigating potential improvements from different angles: Objectives Optimization of the SOI electronics for designs of readout circuits with dominant presence of analog functions Optimization of detector – grade handle wafer for carrier lifetime and charge transport properties Cohesion of the detector layer and the electronics, minimisation of mutual detrimental coupling

3 Monolithic Pixel Detectors in a Deep Submicron SOI Process, TIPP, Tsukuba, Japan 11-17 March 2009 3 Summary and conclusions from pre-SOPIX works F. Pengg, „Monolithic Silicon Pixel Detectors in SOI Technology”, CERN/ECP, RD19 collaboration, January 1996, Ph.D. thesis  work related to detection of ionizing radiation J. Marczewski, et al., „Technology development for SOI monolithic detectors”, Nucl. Instr. and Meth. A, 560, 2006, 26-30 Need for careful shileding between the SOI electronics and the detector underneath the BOX () Thick SOI (quasi-bulk process for optimum analog performance) GOOD in CONCEPTS but NOT SUCCESSFUL – BECAUSE OF LACK OF SUFFICIENTLY ADVANCED TECHNOLOGY Coupling issue recognized!!! Nested buried wells proposed!!! Thick SOI layer

4 Monolithic Pixel Detectors in a Deep Submicron SOI Process, TIPP, Tsukuba, Japan 11-17 March 2009 4 Summary and conclusions from pre-SOPIX works  work related to visible light imaging B.Pain, Ch.Sun, X.Zheng, S.Seshadri, T.J. Cunningham, „SOI-based Monolithic Imaging Technology for Scientific Applications”, 2007 international image sensors workshop, June 6-10, 2007 Ogunquit, ME W.Zhang; M.Chan; H.Wang; Ko, P.K.;,” Building hybrid active pixels for CMOS imager on SOI substrate”, SOI Conference, 1999. Proceedings. 1999 IEEE International,1999, 102 - 103 X.Zheng, C.Wrigley, G.Yang, B.Pain;, ” High responsivity CMOS imager pixel implemented in SOI technology”, SOI Conference, 2000 IEEE International 2000, 138 - 139 Pinning layer implanted!!! No attention to coupling Excluded from sensitivity Path of evolution

5 Monolithic Pixel Detectors in a Deep Submicron SOI Process, TIPP, Tsukuba, Japan 11-17 March 2009 5 Implementation of buried P-well in current OKI process n - -type BPW is helpful in maintaining constant potential under any circuitry that is placed at the periphery of the matrix of pixels. The potential control underneath the BOX may be achieved by designing a closely spaced matrix of PSUB contacts. It was shown that this works relatively well on the fabricated circuits (the cost is a penalty of some are lost for multiple PSUB contacts). BPW is not providing any benefit for protection against charging of the BOX layer as a result of accumulation ionizing doses of the incident radiation. The circuitry is exposed directly to the modulation of conduction resulted from the charged oxide of the BOX.

6 Monolithic Pixel Detectors in a Deep Submicron SOI Process, TIPP, Tsukuba, Japan 11-17 March 2009 6 Review of role of BPW layer Generally electric field in the p-on-n detector is not uniform in case of very small p-type implant separated by large lateral distance Potential pockets can be created with no electric field – thus no charge collectio from some regions The distribution of electric field can be improved by increasing effective sizes of implants using BPW islands Smaller distances between BPW islands may lead to shorts, especially if some residual p-type effective „doping” occurs underneath the BOX

7 Monolithic Pixel Detectors in a Deep Submicron SOI Process, TIPP, Tsukuba, Japan 11-17 March 2009 7 Review of role of BPW layer Extension of effective size of diodes achieved by adding BPW over PSUB is not bringing any good inside pixels, direct coupling paths sending all transient interferences to the input of an in-pixel amplifier, additionally multiple feedback path are created taht may lead to instability of the processing chain

8 Monolithic Pixel Detectors in a Deep Submicron SOI Process, TIPP, Tsukuba, Japan 11-17 March 2009 8

9 9 Review of role of BPW layer

10 Monolithic Pixel Detectors in a Deep Submicron SOI Process, TIPP, Tsukuba, Japan 11-17 March 2009 10 Review of role of BPW layer This is not BPW, but contamination that may change effective conduction type to p type directly underneath BOX Generally electric field in the p-on-n detector is not uniform in case of very small p-type implant separated by large lateral distance Potential pockets can be created with no electric field – thus no charge collectio from some regions The distribution of electric field can be improved by increasing effective sizes of implants using BPW islands Smaller distances between BPW islands may lead to shorts, especially if some residual p-type effective „doping” occurs underneath the BOX

11 Monolithic Pixel Detectors in a Deep Submicron SOI Process, TIPP, Tsukuba, Japan 11-17 March 2009 11 Design details of pixel imaging detector „MAMBO”

12 Monolithic Pixel Detectors in a Deep Submicron SOI Process, TIPP, Tsukuba, Japan 11-17 March 2009 12 Achievements, observations and investigations Transistor with floating body was used (poor precision SPICE models gave wrong value of g ds ) – later measurements showed very small equiv. resistance 12  PMOS biased at V GS =const as a feedback resistor (50 M  ) 0.15  m 0.20  m  shaper design in MAMBO II used longer L & half-H-Gate design for feedback transitor (SBC) As a result, required values of feedback resistor were obtained. Empirical approach is needed to compensate for insufficient device modeling W/L=0.63u/0.3u MAMBO I MAMBO II MAMBO I single pixel test MAMBO I single pixel test

13 Monolithic Pixel Detectors in a Deep Submicron SOI Process, TIPP, Tsukuba, Japan 11-17 March 2009 13 Achievements, observations and investigations

14 Monolithic Pixel Detectors in a Deep Submicron SOI Process, TIPP, Tsukuba, Japan 11-17 March 2009 14 Achievements, observations and investigations

15 Monolithic Pixel Detectors in a Deep Submicron SOI Process, TIPP, Tsukuba, Japan 11-17 March 2009 15 Achievements, observations and investigations

16 Monolithic Pixel Detectors in a Deep Submicron SOI Process, TIPP, Tsukuba, Japan 11-17 March 2009 16 Achievements, observations and investigations

17 Monolithic Pixel Detectors in a Deep Submicron SOI Process, TIPP, Tsukuba, Japan 11-17 March 2009 17 Achievements, observations and investigations

18 Monolithic Pixel Detectors in a Deep Submicron SOI Process, TIPP, Tsukuba, Japan 11-17 March 2009 18 Achievements, observations and investigations MAMBO II single pixel test MAMBO II single pixel test

19 Monolithic Pixel Detectors in a Deep Submicron SOI Process, TIPP, Tsukuba, Japan 11-17 March 2009 19 Achievements, observations and investigations M. Connell, et all. Impact of Mobile Charge on Matching Sensitivity in SOI Analog Circuits, 2007 IEEE/SEMI Advanced Semiconductor Manufacturing Conference

20 Monolithic Pixel Detectors in a Deep Submicron SOI Process, TIPP, Tsukuba, Japan 11-17 March 2009 20 Achievements, observations and investigations

21 Monolithic Pixel Detectors in a Deep Submicron SOI Process, TIPP, Tsukuba, Japan 11-17 March 2009 21 Achievements, observations and investigations

22 Monolithic Pixel Detectors in a Deep Submicron SOI Process, TIPP, Tsukuba, Japan 11-17 March 2009 22 Achievements, observations and investigations

23 Monolithic Pixel Detectors in a Deep Submicron SOI Process, TIPP, Tsukuba, Japan 11-17 March 2009 23 Achievements, observations and investigations

24 Monolithic Pixel Detectors in a Deep Submicron SOI Process, TIPP, Tsukuba, Japan 11-17 March 2009 24 Conclusions on current status of the technology M. Connell, et all. Impact of Mobile Charge on Matching Sensitivity in SOI Analog Circuits, 2007 IEEE/SEMI Advanced Semiconductor Manufacturing Conference

25 Monolithic Pixel Detectors in a Deep Submicron SOI Process, TIPP, Tsukuba, Japan 11-17 March 2009 25 Discussion around necessary changes to the process  minimum: CURRENT VIEW INCREASE THICKNESS OF BOX this is only partial improvement!  t BOX =200nm, t GOX =4.5nm, wide oxide areas favors positive charge trapping, threshold voltage shifts, ions flows and transistors shows poor behavior Isolation of vertical contacts achieved naturaly as contact openings are etched in oxide  all is the same but bottom gate action is dcreased proportionally to t BOX increase of t BOX may affect metrology on the production line It is not believed that only only increase of t BOX will be enough

26 Monolithic Pixel Detectors in a Deep Submicron SOI Process, TIPP, Tsukuba, Japan 11-17 March 2009 26  real improvement (suggestion for minimum process complication) shift from FD-SoI to quasi-bulk-SoI – this is necessary!!! Discussion around necessary changes to the process I step: Grow epitaxial silicon on UNIBOND wafers from SOITEC II step: blanket implantation of p-type film and n-type film island The grown layer will be used for the substrate for transistors, no isolation of transistor islands!! to achieve screening III step: cuts of contact holes, S/D implants, cuts of STI Important is that p- type film is left around cuts, it is fully enclosed by n- film for self centering

27 Monolithic Pixel Detectors in a Deep Submicron SOI Process, TIPP, Tsukuba, Japan 11-17 March 2009 27  real improvment (prepared in such way that minimum modificatio) Discussion around necessary changes to the process After this step all processing is the same as it was for the original OKI-SOI process! IV step: fill with oxide and planarization P-type film areas left around opening will be left floating. After etching opening for S/D, poly-gate and diode openings there will not be needed to passivate walls with exposed p-type Silicon with oxide Islands hosting pmos transistors will be AC-grounded - It is wise to stay with n-type detector silicon - Transistors will be closer to bulk devices (advantage is that the continuous film will be AC-grounded, but each n and p type island will be fully isolated

28 Monolithic Pixel Detectors in a Deep Submicron SOI Process, TIPP, Tsukuba, Japan 11-17 March 2009 28 Discussion around necessary changes to the process V step: etch contact opening and fill Eacthing of contact opening is self centered, the fill material will be in contact wit p-type material but the opposite side of the diode will be grounded - The contact between the fill metal and the floating p-type material will result in some extra capacitance, however it should not be meanigful for amplifiers based on the virtual ground principle – as it is the optimum implementation for the readout circuitry!

29 Monolithic Pixel Detectors in a Deep Submicron SOI Process, TIPP, Tsukuba, Japan 11-17 March 2009 29 Conclusions  The SOIPIX collaboration formed around KEK is a opportunity to explore new 0.15  m 1P/5M and 0.20  m 1P/4M FDSoI CMOS processes by OKI altered to allow charge collection from H-R substrate,  Within two available runs, we managed to obtain working design of the continuous time pixel circuit,  We have problems with counters switchable to shift registers for outputing the data; problem is understood and could be avoided if parasitics extraction was available,  Effort spent on extensive tests led to conclusion on unavoidable deeper adaptations of the process to make it suitable for monolithic detectors,  Guidance for the optimum process has been drawn; can it be introduced by the foundry?  Our experience with 3D-IC using 0.18  m FDSoI process by MIT-LL and discussions with experts suggests excluding the use of FD-SoI for designs with analog,  more runs and more efficient communication are needed to forge the design – dominant part of learning occurs through experimenting (modeling required),

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