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ASME IMECE 2006 Elastomer-Based Micromechanical Energy Storage System Sarah Bergbreiter Prof. Kris Pister Berkeley Sensor and Actuator Center University.

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Presentation on theme: "ASME IMECE 2006 Elastomer-Based Micromechanical Energy Storage System Sarah Bergbreiter Prof. Kris Pister Berkeley Sensor and Actuator Center University."— Presentation transcript:

1 ASME IMECE 2006 Elastomer-Based Micromechanical Energy Storage System Sarah Bergbreiter Prof. Kris Pister Berkeley Sensor and Actuator Center University of California, Berkeley

2 ASME IMECE 2006 Goals and Motivation Build a micromechanical system to –Store large amounts of energy (10s of J) in small area and mass –Integrate easily with MEMS actuators without complex fabrication Motivation –Jumping microrobots –Injector systems –MEMS catapults –Any “high output power for short time” actuated MEMS system

3 ASME IMECE 2006 Why Elastomer? High Energy Density –Capable of storing large amounts of energy with small area and volume –2mm x 50m x 50m rubber band can store up to 45J Large Strains –Stress/strain profile suitable for low-power electrostatic actuators with large displacements –Actuator providing 10mN force over 5mm displacement would require MaterialE (Pa)Maximum Strain (%) Tensile Strength (Pa) Energy Density (mJ/mm 3 ) Silicon169x10 9 0.61x10 9 3 Silicone750x10 3 3502.6x10 6 4.5 Resilin2x10 6 1904x10 6 4

4 ASME IMECE 2006 Simplifying Fabrication Fabricate elastomer and silicon separately –Simple fabrication –Wider variety of elastomers available Silicon process –Actuators –Assembly points for elastomers Elastomer process –2 methods to fabricate micro rubber bands 100  m +

5 ASME IMECE 2006 100  m Fabrication: Silicon Two Mask SOI process –Frontside and backside DRIE etch Electrostatic Inchworm Actuators –Many mN force and several mm displacement in theory Hooks –Assembly points for elastomer 25  m

6 ASME IMECE 2006 Fabrication: Laser-Cut Elastomer Simple fabrication –Spin on Sylgard® 186 and cut with VersaLaser™ commercial IR laser cutter –No cleanroom required Poor Quality –10-20% yield due to poor precision of laser cutter –Mean 250% elongation at break

7 ASME IMECE 2006 Fabrication: Molded Elastomer Complex Fabrication –DRIE and passivated silicon mold –Sylgard® 186 poured into mold, scraped off and removed with tweezers High Quality –Close to 100% yield –Mean 350% elongation at break

8 ASME IMECE 2006 Fabrication: Assembly Fine-tip tweezers using stereo inspection microscope Mobile pieces need to be tethered during assembly Yield > 80% and rising 100  m

9 ASME IMECE 2006 Spring Performance: Laser-Cut Using force gauge shown previously, pull with probe tip to load and unload spring Trial #1 –165% strain –7.2 J –81% recovered Trial #2 –183% strain –8.2 J –85% recovered 8 J would propel a 10mg microrobot 8 cm

10 ASME IMECE 2006 Spring Performance: Molded Using force gauge shown previously, pull with probe tip to load and unload spring Trial #1 –200% strain –10.4 J –92% recovered Trial #2 –220% strain –19.4 J –85% recovered 20 J would propel a 10mg microrobot 20 cm

11 ASME IMECE 2006 Quick Release of Energy Electrostatic clamps designed to hold leg in place for quick release –Normally-closed configuration for portability Shot a 0.6 mg 0402-sized capacitor 1.5 cm along a glass slide Energy released in less than one video frame (66ms)

12 ASME IMECE 2006 Integrating with Actuator Electrostatic inchworm motor translates 30m to store an estimated 4.9nJ of energy and release it quickly Motors will be more aggressively designed in the future to substantially increase this number

13 ASME IMECE 2006 Conclusions and Future Work Process developed for integrating elastomer springs with silicon microstructures Almost 20 J of energy stored in molded micro rubber bands –Equivalent jump height of 20 cm for 10 mg microrobot Build higher force motors to store this energy Characterize new elastomer materials like latex and other silicones Keep the leg in-plane through integrated staples Put it all together for an autonomous jumping microrobot! Subramaniam Venkatraman, 2006

14 ASME IMECE 2006 Acknowledgments Ron Fearing Group for use of VersaLaser™ commercial laser cutter UC Berkeley Microfabrication Laboratory


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