1. 1 Electrical and Computer Engineering Cam Proctor Ramsey Khudairi Tom Gilbert Chad Young Project Orion TekBand

2. 2 Electrical and Computer Engineering Outline  Motivation  Design  Band & Mold  Microcontroller  Bluetooth  Battery  Memory  Q&A

3. 3 Electrical and Computer Engineering Motivation – Cellular Phone Interface  Call, Text, & Emergency Notification Uses: During Meetings In Class On the Road Will lead to: Safer Driving Less Interruptions

4. 4 Electrical and Computer Engineering Motivation – Wireless Storage  Wireless Data Storage Uses: On the run During group projects Will lead to: Protection from Identity Theft Fewer lost files Greater Convenience

5. 5 Electrical and Computer Engineering Design  Goals: Interface with Cell Phone to alert user of calls and messages Interface with PC to program the band Interface with PC as wireless storage device Maintain Fashion & Style  Our wristband will contain: Microcontroller Bluetooth module MicroSD card Lithium ion battery

6. 6 Electrical and Computer Engineering The Band-Materials

7. 7 Electrical and Computer Engineering The Band-Construction Target Size: 200mm x 5mm x 22mm Two-Part Silicone Rubber – 1:1 Ratio – Pour in mold – Cure time of a few hours Can be bought at any local craft store ~$20/lb.

8. 8 Electrical and Computer Engineering The Mold Silicone – Rubber-To-Rubber mold release Master mold – Mold poured around wooden band Other options – Putty – www.amazingmoldputty.com www.amazingmoldputty.com

9. 9 Electrical and Computer Engineering The Clasp  Neodymium  Rod Magnets  ~$10-$20  Trials

10. 10 Electrical and Computer Engineering Microcontroller Considerations  Form factor Must be small enough to fit inside band  Low power Running continuously  Interface with peripherals I/O for user control Interface with Bluetooth module Read/Write to storage media

11. 11 Electrical and Computer Engineering Microcontroller Capabilities  I/O 3 pins to drive single tri-color LED Possible analog inputs for gyro, microphone, etc.  SPI (Serial Peripheral Interface) Read/Write MicroSD card Communicate with Bluetooth module (KC-21)  UART (Universal asynchronous receiver/transmitter) Data transfer from Bluetooth module (KC-21, BTM-182)

12. 12 Electrical and Computer Engineering Microcontroller Solutions PIC16F1827 (Microchip) PIC16F1824 (Microchip) PIC16F1938 (Microchip) C8051F531A- IM (Silicon Laboratories) ATTINY2313 -20MU-ND (Atmel) SPI21111 USART11111 I/O Pins16 (18 pin)12 (14 pin)25 (28 pin)16 (20 pin)18 (20 pin) ADC10 bit 12 bitn/a Program Memory 7kB, flash 28kB, flash8kB, flash2kB, flash Size4x4mm3x3mm4x4mm Power 30nA standby, 100μA @1MHz 20nA standby typical, 600nA operational 60nA Standby, 150μA @1MHz.1mA operational <.1μA standby, 230μA @ 1MHz Cost$1.75$1.40$2.25$2.55$2.65

13. 13 Electrical and Computer Engineering Best Candidates  PIC16F1827 (Microchip) Good middle ground 2 SPI ports Low power Small size, multiple chips…  PIC16F1938 (Microchip) Large program memory Small form factor Higher cost Greater power consumption, critical

14. 14 Electrical and Computer Engineering  PIC16F1827 (Microchip) Appears to be the ideal candidate Low power and cost Small size, possibility for >1 chip in bracelet 2 SPI ports and USART Start with this chip, others as fallback Middle of the road – good starting point Selecting a Microcontroller

15. 15 Electrical and Computer Engineering Selecting a Bluetooth

16. 16 Electrical and Computer Engineering Bluetooth modules ModuleDimensionsPowerTransmit RateRangeCost LMX9830*9x6x.86mm65mA0.704Mbps10m17.15 WRL-099131.4x2.5cm58mA0.704Mbps10m18.95 KC-2127x15x2.5mm90mA3Mbps20m36.00 CSR1000**5x5x0.6mm60mA24Mbps50mNA * Does not come with an antenna ** Not yet available on the market

17. 17 Electrical and Computer Engineering Battery Considerations  Form factor Small enough to fit inside band (< 20mm wide x 2mm thick)  Capacity: 100mAh Approx. 100mA during read/write to MicroSD Approx. 90mA during Bluetooth transmit  Must be rechargeable Wireless Charging  Strategy: Multiple Small Batteries

18. 18 Electrical and Computer Engineering Battery Options  Coin Cell:  Thin Film Surface Mount: ModuleVoltageCapacityDimensionsCost ML-2020/F1AN3.0V45mAh20mm diam x 2mm thick$2.68 ML 1220/F1AN3.0V17mAh12.5mm diam x 2mm thick$2.38 MS920SE-FL27E3.1V11mAh9.5mm diam x 2mm thick$2.05 MS621FE3.0V5mAh6.8mm diam x 1.5mm thick$0.94 ModuleVoltageCapacityDimensionsCost CBC050-M8C-TR13.8V50uAh8mm x 8mm ultrathin$3.82

19. 19 Electrical and Computer Engineering Battery Form Factor Considerations 50mm (1/4 of total band length) ML621 6.8mm 5mAh MS920SE 9.5mm 11mAh MS920SE 12mm 17mAh CBC050 8mm 50uAh ML2020 20mm 45mAh 20mm

20. 20 Electrical and Computer Engineering 4GB Memory – Possible Add-on  MicroSD Small – 11mm X 15mm X 1mm Voltage Range: 2.7 – 3.6V Clock Rate: 0 – 25MHz Supports Serial Peripheral Interface (SPI) Assuming 25MHz clock, Read/Write time: 40s/Gb Power: Sleep – 150uA max Read – 100mA max Write – 100mA max Cost: $3 - $5 Performance: -25 o C to 85 o C

21. 21 Electrical and Computer Engineering MicroSD Communication  Serial Peripheral Interface (SPI) protocol Data clocked with clock signal (SCK) Clock signal controls when data is changed and read SPI is Sychronous Data rate will change to accommodate changing clock rate SSP or MSSP module in PICmicro device allows SPI Pin #NameTypeDescription 1RSVDisconnected 2CSInputChip Select 3DIInputData In 4VddSupplySupply Voltage 5SCLKInputClock 6VssSupplySupply Ground 7DOOutputData Out 8RSVDisconnected

22. 22 Electrical and Computer Engineering Timeline Oct 17-23Oct 24 - 30Oct 31 - 6Nov 7 - 13Nov 14 - 20Nov 21 - 27Nov 28 - 4 Battery - Tom Purchase Test & Reconsider Components Integrate Microcontroller - Cam Purchase Test & Reconsider Components Integrate Bluetooth - Chad Purchase Test & Reconsider Components Integrate Band Construction - Ramsey Purchase Supplies Build Protype Band Test & Evaluate Construct Prototype Mold Memory - Tom & Ramsey Purchase Card Test Power Consumption Integrage or Eval Other Options MDRMDR

23. 23 Electrical and Computer Engineering Budget  Band Construction Supplies for 10 Bands & Mold: $60 Rubber to rubber mold release: $10 100 Magnets: $20 Total: $90  Bluetooth Module: $40 Development Kit: $100-$150 (depending on module) Total: $140-$190  Microcontroller Module: $1.20 Breakout Board & Dev Kit: $165  MicroSD Module: $3-$5

24. 24 Electrical and Computer Engineering Conclusion  Our wristband will contain: Microcontroller Bluetooth module microSD card  The final product will: Interface with Cell Phone to alert user of calls and messages Interface with PC to program alert preferences Possible Addition: Interface with PC as wireless storage device  Key constraints: Power and Size  Deliverables by MDR: Prototype of electronics working on board Prototype wristband w/o HW