1. Conquer www.conquer.com.tw 1 Conquer Electronics Thin Film Chip Fuse Introduction

2. Confidential R&D Center. Conquer www.conquer.com.tw 2 現行市場 SMD fuse 製程種類 Thin Film Process –Ceramic substrate  Conquer, Sart, Vishay –PCB substrate  Littelfuse Thick Film Process –Ceramic substrate  Bussmann –Injection molding  KOA –LTCC Fuse  AEM (SolidMatrix), Conquer

3. Confidential R&D Center. Conquer www.conquer.com.tw 3 Thin Film ： Ceramic Type Process Conquer 12, 06, 04 series Vishay MFU series KOA, Sart, AVX

4. Confidential R&D Center. Conquer www.conquer.com.tw 4 Thin Film ： PCB Type Process Littelfuse 466, 467, 468 series marking PCB substrate Cu element Protect layer Drawing Not to Scale *Element on PCB substrate surface

5. Confidential R&D Center. Conquer www.conquer.com.tw 5 Thick Film ： Printing Process Bussmann 3216FF, 1608FF * Element on Ceramic substrate surface

6. Confidential R&D Center. Conquer www.conquer.com.tw 6 Conquer Electronics Surface Mount Thin Film Chip Fuse

7. Confidential R&D Center. Conquer www.conquer.com.tw 7 薄膜晶片保險絲 黃光微影製程配合電鍍技術，線 路製作精緻。 產品特性可精準控制。 特殊開發之防爆隔絕層與聚熱層 也可確保熔斷特性。

8. Confidential R&D Center. Conquer www.conquer.com.tw 8 Chip Fuse Specifications

9. Confidential R&D Center. Conquer www.conquer.com.tw 9 Chip Fuse Dimensions 1206 0603 0402 L W T Type120606030402 L3.1±0.21.6±0.150.95±0.1 W1.6±0.10.8±0.10.48±0.1 T0.65±0.20.43±0.10.33±0.1 Unit : mm

10. Confidential R&D Center. Conquer www.conquer.com.tw 10 Electrical Characteristics Rating CurrentElectrical Characteristics 100%4 Hours min 200% 5 Sec max 300% 0.2 Sec max CF series ( Very Fast-Acting Fuse Series) Rating CurrentElectrical Characteristics 100%4Hrs min 200% 120 Sec max 300%3 Sec max CT series ( Time Lag Fuse Series )

11. Confidential R&D Center. Conquer www.conquer.com.tw 11 Temperature De-rating Curve Ambient temperature on current-carrying capacity. For circuit,current rating shall be derated in accordance with the figure.

12. Confidential R&D Center. Conquer www.conquer.com.tw 12 1206 Applications and Ratings

13. Confidential R&D Center. Conquer www.conquer.com.tw 13 0603 Applications and Ratings

14. Confidential R&D Center. Conquer www.conquer.com.tw 14 薄膜晶片保險絲生產作業流程圖 Thin Film Chip Fuse Production Process Flow Chart Start 正面印刷矽膠平坦層 Silicon Printing 背面印刷低溫銀膠 Backside Silver Resin Printing 濺鍍鈦鎢與銅 Sputtering TiW/Cu 壓膜光阻與曝光與顯影 Press Photoresist & Optical Lithography 電鍍銅, 錫與蝕刻 Electroplate Copper, Tin & Etching 印保護層, 印字, 折條與折粒 Marking Printing, Snap wicker & granule 滾鍍銅, 鎳, 錫 Roll electroplate Copper, Nickel & Tin 測試與包裝 IPQC & Packing 此二層為功得開發之防爆材料

15. Confidential R&D Center. Conquer www.conquer.com.tw 15 Chip Fuse Materials Inner electrode Outside electrode Tin layer Nickel layer Copper layer Ceramic substrate & Silicon layer Insulating layer Marking layer

16. Confidential R&D Center. Conquer www.conquer.com.tw 16 Chip Fuse Multi-Layer Structure Ceramic Substrate Electrode Silicon layer Element layer Epoxy layer Marking layer *Drawing Not to Scale

17. Confidential R&D Center. Conquer www.conquer.com.tw 17 Taping Diameter Unit : mm

18. Confidential R&D Center. Conquer www.conquer.com.tw 18 Reel Dimensions Unit : mm

19. Confidential R&D Center. Conquer www.conquer.com.tw 19 CF & CT Label Product name & number

20. Confidential R&D Center. Conquer www.conquer.com.tw 20 Reflow Profile Reference : IPC-JEDEC J-STD 002B

21. Confidential R&D Center. Conquer www.conquer.com.tw 21 Test Circuit Board Unit : mm Test Circuit BoardReference Dimensions 1206 0603 Reflow solder L1L2W 1.11.521.78 0.660.761.0

22. Confidential R&D Center. Conquer www.conquer.com.tw 22 Peeling Force (EIA-481-1A) Peel-off forces are 0.1 N to 1.0 N (10 grams to 100 grams calibrated scale reading) for 8 mm tape at a peel-off speed of 300 mm ± 10 mm/minute. The peel-off angle should be between 165° and 180°. Angle: 0~15 ∘ Standard: 10 ~100 grams

23. Confidential R&D Center. Conquer www.conquer.com.tw 23 Product Characteristics & Reliability Tests

24. Confidential R&D Center. Conquer www.conquer.com.tw 24 Storage Conditions & Shelf Life The Maximum ambient temperature shall not exceed 40°C. The Maximum relative humidity recommended for storage is 70%. 1 years from manufacturing date

25. Confidential R&D Center. Conquer www.conquer.com.tw 25 Approval by UL JDYX8. E82636 Fuses, Supplemental Certified for Canada - Component

26. Confidential R&D Center. Conquer www.conquer.com.tw 26 Interrupting Rating Photograph (X-ray) 200% rating current 1000% rating current DC 50A 63V AC 50A 32V

27. Confidential R&D Center. Conquer www.conquer.com.tw 27 Consumer Electronics Personal & Portable Computing Office Machines Network Communications Industry System Application

28. Confidential R&D Center. Conquer www.conquer.com.tw 28 Manufacturing Country & City CONQUER ELECTRONICS CO., LTD. ( Taiwan – WuGu ) Tel: 886-2-89902189 Fax : 886-2-89902577 RD Center

29. Confidential R&D Center. Conquer www.conquer.com.tw 29 Thanks for your attention!!