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April 16 th, 2007 1 FLCC Optical Digital Profilometry Test Patterns, Database, and Strategy Wojtek Poppe, Ben Yu, Jing Xue, Marshal Miller, and Andy Neureuther.

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Presentation on theme: "April 16 th, 2007 1 FLCC Optical Digital Profilometry Test Patterns, Database, and Strategy Wojtek Poppe, Ben Yu, Jing Xue, Marshal Miller, and Andy Neureuther."— Presentation transcript:

1 April 16 th, 2007 1 FLCC Optical Digital Profilometry Test Patterns, Database, and Strategy Wojtek Poppe, Ben Yu, Jing Xue, Marshal Miller, and Andy Neureuther University of California Berkeley

2 April 16 th, 2007 2 FLCC Collaborative FLCC Experiments FLCC Experiments Optical Digital Profilometry (ODP) Original Experiments FLCC Experiments Designs from industry

3 April 16 th, 2007 3 FLCC Outline New set of masks from Toppan and experiments at SVTC with the help of ASML Web accessible database for data aggregation and analysis Optical Digital Profilometry New Defocus Test Structures Measuring Mask Edge Effects Illumination and 2-D Patterns Conclusion

4 April 16 th, 2007 4 FLCC New Company New Process Cypress SVTC Silicon Valley Technology Center 65nm CMOS Flow

5 April 16 th, 2007 5 FLCC New Company New Process Cypress SVTC Silicon Valley Technology Center 65nm CMOS Flow

6 April 16 th, 2007 6 FLCC New Company New Process Cypress SVTC Silicon Valley Technology Center 65nm CMOS Flow Developing new vanilla CMOS flow No Cypress customizations, so more representative More synergy and direct benefit for SVTC translates to more wafers

7 April 16 th, 2007 7 FLCC Old Test Chip Layout Cypress Test Structures 178 30-pad cells Over 15,000 Electrical Test Structures Six students, six sets of conclusions, one chip

8 April 16 th, 2007 8 FLCC Old Test Chip Layout Cypress Test Structures 178 30-pad cells Over 15,000 Electrical Test Structures Six students, six sets of conclusions, one chip

9 April 16 th, 2007 9 FLCC New FLCC06.v2 Chip Electrical Test Structures (Magma) ODP litho (Yu Ben) ODP Mask Edge (Marshal Miller) ODP Etch (Cadence) 21 extra 30-pad cell structures (199 total) 256 gratings for Optical Digital Profilometry (ODP) Two more students and three companies contributing New Overlay Structures (ASML)

10 April 16 th, 2007 10 FLCC 4 Layers Per Mask 9X 8 450um x 220um gratings 1mm x 1mm block

11 April 16 th, 2007 11 FLCC 4 Layers Per Mask 48 450um x 220um gratings 3mm x 2mm block Wojtek Marshal Yu

12 April 16 th, 2007 12 FLCC Space Available on Dark Field Mask All four layers available Thirty-Two 1mm x 1mm blocks Four 2mm x 3mm blocks Atten PSM + 90 degree phase etch Mosi or Chrome Glass can have extra 90 degree etch

13 April 16 th, 2007 13 FLCC Outline New set of experiments at SVTC and a new set of masks Web accessible database for data aggregation and analysis Optical Digital Profilometry New Defocus Test Structures Measuring Mask Edge Effects Illumination and 2-D Patterns Conclusion

14 April 16 th, 2007 14 FLCC Tons of Test Structures, Tons of Data, One Chip Looking at Systematic CD variation LWR Defocus Enhanced Transistors Contact hole variation (correlate with pattern noise work) BSIM model fitting Oxide thickness and channel doping Poly corner rounding Active corner rounding Non-rectangular transistors Poly overlap Electrical Overlay Error SRAMs and Standard Cells Poly Etch Poly CMP Mask edge effects

15 April 16 th, 2007 15 FLCC Tons of Test Structures, Tons of Data, One Chip Looking at Systematic CD variation LWR Defocus ETEC-M validation Contact hole variation (correlate with pattern noise work) BSIM model fitting Oxide thickness and channel doping Poly corner rounding Active corner rounding Non-rectangular transistors Poly overlap Electrical Overlay Error SRAMs and Standard Cells Poly Etch Poly CMP Mask edge effects Data Management Nightmare

16 April 16 th, 2007 16 FLCC Relational Database for Data Aggregation Over 15,000 transistors, 150 die per wafer, and dozens of wafers Slice and dice the data in any way Each data point will be associated with many different tables Comparing simulation and experiment results Finding Correlation Can find correlation between transistors with specific attributes such as proximity or distance from center Looking at subsets of test structures Filtering out confounding effects (systematic CD variation) Platform for Collaboration Each designer can access and update the database online Outside people can log on as guests and explore different pattern dependent phenomena

17 April 16 th, 2007 17 FLCC Store All Possible Data Measurement Conditions (ex. Temp) Transistor Attributes Simulation results for different process conditions Upload process non- idealities Store Process Conditions Transistor Location Data Analysis Reports Testing Strategy

18 April 16 th, 2007 18 FLCC Store All Possible Data Measurement Conditions (ex. Temp) Transistor Attributes Simulation results for different process conditions Upload process non- idealities Store Process Conditions Transistor Location Data Analysis Reports Testing Strategy What else should I look at???

19 April 16 th, 2007 19 FLCC Web Accessible and Centrally Located Server Probe Station Upload test results Download test scripts Download data for analysis. Access any data through SQL queries or pre-built filters Run some basic statistical analysis Upload results for others to see Update database with calculated process offsets Designers

20 April 16 th, 2007 20 FLCC ODP Data Management and Sharing

21 April 16 th, 2007 21 FLCC Outline New set of experiments at SVTC and a new set of masks Web accessible database for data aggregation and analysis Optical Digital Profilometry New Defocus Test Structures Measuring Mask Edge Effects Illumination and 2-D Patterns Conclusion

22 April 16 th, 2007 22 FLCC Optical Digital Profilometry Upper CD Pitch Lower CD Film Thickness 300350400450500550600650700750 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 wavelength (nm) R, cos , Tan  LIGHT SOURCESPECTROMETER 100um The goal of scatterometry is to measure the geometry of fine lines nondestructively with light

23 April 16 th, 2007 23 FLCC Simulated vs. Measured Results Wavelength (nm) Goodness of Fit (GOF) – Indication of best match. 1 is best, 0 is worst. Typical iODP100 GOF > 0.995 Note: Red spectra is simulated and blue is measured Reflectance

24 April 16 th, 2007 24 FLCC ODP Overview 1 3 2 4 1.(n,k) values can be determined on Sopra, or from standard table. 2.Spectra will be collected on Sopra. Data need to be interpreted in the form that can be read by Timbre ODP TeraGen. 3.This is what we have from Timbre. 4.Only for volume production.

25 April 16 th, 2007 25 FLCC Step 1: Thin Film Data Collection (Recommended)

26 April 16 th, 2007 26 FLCC Step 2: Collect and Import Data of Patterned Wafer

27 April 16 th, 2007 27 FLCC Step 3: The Profile Model

28 April 16 th, 2007 28 FLCC Step 3: The Profile Model Si 3 N 4 SiO 2 Si

29 April 16 th, 2007 29 FLCC Model Verification Forward Simulation tntn 0th 1st Incident Light for θ 、 λ Rigorous Coupled Wave Analysis (RCWA)

30 April 16 th, 2007 30 FLCC Model Verification Wavelength (nm) Refelctance Forward Simulation tntn 0th 1st Incident Light for θ 、 λ Rigorous Coupled Wave Analysis (RCWA)

31 April 16 th, 2007 31 FLCC Model Verification

32 April 16 th, 2007 32 FLCC Step 4: Library Generation and Verification Based on the confirmed model (parameter) RCWA simulation generates the library The library is applied to the whole data set to verify its validity Export the library to PAS system for in-line metrology

33 April 16 th, 2007 33 FLCC Outline New set of experiments at SVTC and a new set of masks Web accessible database for data aggregation and analysis Optical Digital Profilometry New Defocus Test Structures Measuring Mask Edge Effects Illumination and 2-D Patterns Conclusion

34 April 16 th, 2007 34 FLCC p d wbwb wnwn d 90 o -90 o 0o0o 0o0o wbwb 0o0o - Periodic testing pattern, - Probe width provides reference 25% CF magnitude : - Pattern width equal to minimum feature size - Probe phase coherent to even (defocus) aberration - Distance d determines the sensitivity of this aberration and the orthogonality to the other aberrations Resonant Even Aberration Testing Mask

35 April 16 th, 2007 35 FLCC Line Spread Function vs. Aberration Defocus SphericalComa Reference 0.01451 0.01817 0.02314 0.05831

36 April 16 th, 2007 36 FLCC Resonant Even Aberration Testing - Inverse Fourier transform of even aberration based on line spread function - Reciprocity of the electric-field spillover Line & point spread function

37 April 16 th, 2007 37 FLCC Resonant Even Aberration Testing Sensitivities of defocus and spherical target are at least 28 times larger than the Strehl ratio measurement of aberration at 0.01  aberration

38 April 16 th, 2007 38 FLCC Defocus Monitoring + ODP Calibration? pos- resist neg- resist

39 April 16 th, 2007 39 FLCC Outline New set of experiments at SVTC and a new set of masks Web accessible database for data aggregation and analysis Optical Digital Profilometry New Defocus Test Structures Measuring Mask Edge Effects Illumination and 2-D Patterns Conclusion

40 April 16 th, 2007 40 FLCC Mask Edge Effects Phase Shifting Mask Opening Cross-Talk –Use TEMPEST time-evolution to visualize cross-talk as it occurs among masks openings –Introduced reduced parameter edge and line source models Imag C EI Real C ER

41 April 16 th, 2007 41 FLCC Simple Mathematical Model for 2 nd order Fourier component x For 50% duty cycle Edge effects approximated by rectangular box with height unity and width w x x w is assumed to be small, so the function is approximated as constant This value are the quantities C ER and C ER for the real and imaginary correction components w Ideal thin mask model

42 April 16 th, 2007 42 FLCC Intuition Re(E) (ideal box) Im(E) Mag(E) actual E Field Duty Cycle Mag(E) (actual) 50% Mag(E) ideal ff Horizontal Shift: C ER Vertical Shift: C CEI

43 April 16 th, 2007 43 FLCC Simulation Results Cutline taken far from interface in order to analyze propagating modes

44 April 16 th, 2007 44 FLCC 2 nd order component of TE mode Vertical Walls Walls undercut 5 degrees Expect 2 nd order to go to zero Period Magnitude Minimum Zero 50% Duty

45 April 16 th, 2007 45 FLCC Imag C EI Real C ER Simulation Values for C ER and C EI

46 April 16 th, 2007 46 FLCC Experiment: FLCC March ‘07 Mask Gratings put on current FLCC mask to explore simulation results –Alternating 0 o and 180 o phase shift regions –4 periods ranging from 3 to 12 (on mask) –Duty cycle ranging from 35-65% –24 different gratings in total Compare data from these gratings to the TEMPEST simulations

47 April 16 th, 2007 47 FLCC Outline New set of experiments at SVTC and a new set of masks Web accessible database for data aggregation and analysis Optical Digital Profilometry New Defocus Test Structures Measuring Mask Edge Effects Illumination and 2-D Patterns Conclusion

48 April 16 th, 2007 48 FLCC ODP Illumination Test Patterns Binary Mask Example P = 1.7 /NA Normal Incidence Spillover Subtracts Center line not print

49 April 16 th, 2007 49 FLCC ODP Illumination Test Patterns Binary Mask Example P = 1.7 /NA s = 0.59 dipole Spillover Adds! Center line prints! + 180 - 1800

50 April 16 th, 2007 50 FLCC ODP Illumination Test Patterns Binary Mask Example P = 1.7 /NA s = 0.59 dipole + 180 - 1800 A richer set of combinations are allowed by Phase-shifted openings Using spillover from a sizeable 1RU+ programmed focus offset example P = 1.2 /NA => s = 0.83 dipole

51 April 16 th, 2007 51 FLCC ODP 2-D Test Patterns are Better Binary Mask Example r = 0.85 /NA More Flexible: spillover separation and illumination phase can be adjusted somewhat independently.  = 0.45 /NA => 0.9 dipole

52 April 16 th, 2007 52 FLCC Optical Digital Profilometry Test Patterns, Database, and Strategy: Conclusion We have been able to respond quickly in generating a new multi-student test mask for automatic measurement and profile recognition with ODP. The clear field mask includes line patterns. Phase-shifting patterns will be put on the dark-field mask that tapes out soon. A database is also proposed for assembling and cross- interpreting ODP results. Monitoring concepts from pattern-and-probe test patterns and electronic test patterns have been used to generate novel ODP-based parameter specific monitors for focus, illumination, and mask edges.


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