1. 1 Chapter IV Semiconductor Fabrication 半導體製造

2. 2 Semiconductor Fabrication Process 基本上, 整個完整的 IC 元件及電路是在矽晶 片上形成層數不等且材質厚度不同的薄膜 (Film), 經過多次使用光罩 (Mask) 與微影 (Lithogrophy), 蝕刻 (Etching) 及摻雜 (Doping) 等加工技術後所組合而成的. Film formation –Deposition –Growth Lithography –Photo-Lithography –E-beam Lithography Etching –Dry etching –Wet etching Impurity doping –Diffusion –Ion inplamtation Mask sets

3. 3 Cross Section of MOSFET

4. 4 Oxidation

5. 5 Furnace and Boat

6. 6 PVD_Evaporation

7. 7 PVD_Sputtering

8. 8 CVD_Chemical Vapor Deposition

9. 9 Photo-lithograhy Process 1.Dehydration bake 2.Priming 3.Photoresist coating 4.Soft bake 5.Exposure 6.Post bake 7.Development 8.Hard bake  (Etching or Doping) 9. Photoresist removal

10. 10 Pattern Transfer

11. 11 Mask

12. 12 Step-and-Repeat

13. 13 Pattern Transfer_1

14. 14 Pattern Transfer_2

15. 15 Doping_Diffusion

16. 16 Doping_Ion Implantation

17. 17 Process Integration