1. Office of the Secretary of Defense Defense Microelectronics Activity (DMEA) Defense Microelectronics Activity (DMEA) Doug Casanova Defense Microelectronics Activity (DMEA) Doug Casanova Defense Microelectronics Activity (DMEA)

2. DMEA Mission  DoD Mission - Provide microelectronics technology solutions  Leverage advanced microelectronics technologies  Improve reliability and maintainability  Enhance capability and performance  Address effects of rapid obsolescence  Assigned as DoD Executive Agent for microelectronics DMS  Coordinate DOD activities  Develop OSD policy and strategy  Serve as joint resource for DoD / government / industry / foreign allies  Established by Secretary of Defense  Defined DMEA’s joint mission & explicit organizational structure  Report directly to the Deputy Under Secretary of Defense for Logistics & Materiel Readiness  DoD Mission - Provide microelectronics technology solutions  Leverage advanced microelectronics technologies  Improve reliability and maintainability  Enhance capability and performance  Address effects of rapid obsolescence  Assigned as DoD Executive Agent for microelectronics DMS  Coordinate DOD activities  Develop OSD policy and strategy  Serve as joint resource for DoD / government / industry / foreign allies  Established by Secretary of Defense  Defined DMEA’s joint mission & explicit organizational structure  Report directly to the Deputy Under Secretary of Defense for Logistics & Materiel Readiness

3. The Challenge  Increased DoD use / reliance on microelectronics (“Smart” weapon systems)  Essential technology for all military missions  Strategic, tactical, C4I, special ops  “Critical” DoD technology  Enabling technology for transformational opportunities  Extended system life cycles (20 – 40 years)  Increased reliability and maintainability issues  Rapidly evolving, expanding missions - new capability requirements  Diminishing Manufacturing Sources (DMS)  Decreased technology stability  Dynamic development drives obsolescence cycles of 18 months or less  Over 95% of all DoD DMS cases are electronics  Increased DoD use / reliance on microelectronics (“Smart” weapon systems)  Essential technology for all military missions  Strategic, tactical, C4I, special ops  “Critical” DoD technology  Enabling technology for transformational opportunities  Extended system life cycles (20 – 40 years)  Increased reliability and maintainability issues  Rapidly evolving, expanding missions - new capability requirements  Diminishing Manufacturing Sources (DMS)  Decreased technology stability  Dynamic development drives obsolescence cycles of 18 months or less  Over 95% of all DoD DMS cases are electronics 2040+ 94+ Years B-52 19551946 Notional Projected Lifetime Extended Life 050100 Years

4. DMEA’s Total Solution Approach  Key: Understand ALL the military requirements  Verify System Problems  Reliability and maintainability of system/boards  Adequacy of spares  Testability and repair issues  Existing and projected obsolescence  Develop Solution Options  Component  Aftermarket  Substitution  Emulation  Custom  Board / Box / System  Technology Compression  TOC savings over chip for chip  Increased capability (transformation)  Opportunity for open architecture  Key: Understand ALL the military requirements  Verify System Problems  Reliability and maintainability of system/boards  Adequacy of spares  Testability and repair issues  Existing and projected obsolescence  Develop Solution Options  Component  Aftermarket  Substitution  Emulation  Custom  Board / Box / System  Technology Compression  TOC savings over chip for chip  Increased capability (transformation)  Opportunity for open architecture

5. DMEA’s Advanced Reconfigurable Manufacturing for Semiconductors (ARMS)  Government / Semiconductor Industry partnership  New flexible foundry technology  New business model  Government-held process licenses  No commercial conflicts  Prototype / low volume production by DMEA  High volume production by industry  Terminal transfer to DMEA upon OEM business decision  Transfers industry-developed (commercial) IP & technology  COTS as a solution, not a problem  Ensures continued DoD supply as industry flexes with market  Government / Semiconductor Industry partnership  New flexible foundry technology  New business model  Government-held process licenses  No commercial conflicts  Prototype / low volume production by DMEA  High volume production by industry  Terminal transfer to DMEA upon OEM business decision  Transfers industry-developed (commercial) IP & technology  COTS as a solution, not a problem  Ensures continued DoD supply as industry flexes with market Save processes, Not parts !

6. DoD / Industry Partnership Together Supporting the Warfighter  Boeing / F-22 Obsolescence Problem  Custom power management device no longer available  Used throughout the weapon system  Multi-year production requirement  500 parts / year X 10 years  Part for Part solution determined the best value  Requested DMEA’s ARMS Foundry Support  Solution - DMEA & Boeing “Cooperative Research And Development Agreement” (CRADA)  DMEA / Boeing worked together on developing new IC  DMEA provided design engineering  DMEA tested & delivered new IC  Boeing / F-22 Obsolescence Problem  Custom power management device no longer available  Used throughout the weapon system  Multi-year production requirement  500 parts / year X 10 years  Part for Part solution determined the best value  Requested DMEA’s ARMS Foundry Support  Solution - DMEA & Boeing “Cooperative Research And Development Agreement” (CRADA)  DMEA / Boeing worked together on developing new IC  DMEA provided design engineering  DMEA tested & delivered new IC

7. DMEA B2 Support  B-2 Defensive Management System (DMS) unsupportable  DMSMS plus lack of repair procedures, lack of tech data, spares, etc  Prime Contractor wanted $54M to redesign system  DMEA Proposed $22M to make supportable for next 10 years  DMEA performing System-level DMS Supportability Improvement Program  System level assessment  IC / board / box solution strategies  Reverse engineering  Solution design, prototype, and test  Cost avoidance = $32 Million  B-2 Defensive Management System (DMS) unsupportable  DMSMS plus lack of repair procedures, lack of tech data, spares, etc  Prime Contractor wanted $54M to redesign system  DMEA Proposed $22M to make supportable for next 10 years  DMEA performing System-level DMS Supportability Improvement Program  System level assessment  IC / board / box solution strategies  Reverse engineering  Solution design, prototype, and test  Cost avoidance = $32 Million

8. DoD / Industry Partnership Evolved Sea Sparrow Missile (ESSM)  Raytheon / ESSM Obsolescence and R&M Problems  Obsolete Custom Microprocessor & Interface Logic Devices  Impacts future production of Missile Borne Computer (MBC) Subsystem  Requested DMEA’s Support to Eliminate Obsolescence  DMEA Provided 3 Options  Navy and Raytheon decided to improve R&M, and testability, as well as resolve DMS  DMEA to redesign 6 boards and 2 ASIC’s  Microprocessor & Interface Logic redesign  Technology Compression to replace other ICs & develop new FFF MBC Subsystem  DMEA / Raytheon to Integrate & Test new MBC  Cost Avoidance of $20,000,000  Raytheon / ESSM Obsolescence and R&M Problems  Obsolete Custom Microprocessor & Interface Logic Devices  Impacts future production of Missile Borne Computer (MBC) Subsystem  Requested DMEA’s Support to Eliminate Obsolescence  DMEA Provided 3 Options  Navy and Raytheon decided to improve R&M, and testability, as well as resolve DMS  DMEA to redesign 6 boards and 2 ASIC’s  Microprocessor & Interface Logic redesign  Technology Compression to replace other ICs & develop new FFF MBC Subsystem  DMEA / Raytheon to Integrate & Test new MBC  Cost Avoidance of $20,000,000