1. Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 Integrated Systems Nanofabrication Cleanroom

2. OUTLINE Optical Lithography Main Tools Lithography Support Equipment Future Tools and Projects Acknowledgements October 6, 2010

3. SUSS CONTACT ALIGNER Model MA6 TSA/BSA Alignment Pieces to Full 6” Wafers 1 um Resolution with Vacuum Contact Wafer Direct Bonding October 6, 2010

4. SF100 XPRESS Maskless Lithography Uses a Range of Wavelengths Smart Filter Technology Process Wafers and Non-Wafer Substrates Process Non-Flat Subs File in BMP October 6, 2010

5. SF100 EXPRESS October 6, 2010

6. SF100 EXPRESS October 6, 2010 Photoresist Patterns on Round Substrates

7. ASML STEPPER Model PAS 5500 /200 5X I-Line SHORT STORY October 6, 2010

8. SOME DIFFICULTIES October 6, 2010

9. SOME DIFFICULTIES October 6, 2010

10. ASML STEPPER Model PAS 5500 /200 5X I-Line 2 Point Global Alignment Resolution < 350nm Single Machine Overlay < 50nm Field Size X Y Max 22.0mm x 27.4mm Pieces to Full 8” Wafers Variable NA 0.48-0.60 Arial TM Illuminator October 6, 2010

11. ILLUMINATION PATH October 6, 2010

12. SIZE MATTERS October 6, 2010

13. ASML STEPPER RETICLE Reticle Size 6” x 6” Quartz 0.250” for Sub-0.5um Pellicle GDSII File Design can be checked before generating reticle October 6, 2010

14. ALIGNMENT MARK October 6, 2010

15. ANATOMY OF THE ASML JOB Cells Die and Exposure Fields Images and Image IDs Layer Numbers and Layer IDs Layer ID, Image ID and Reticle ID Image Location and Masking Window Alignment Marks October 6, 2010

16. RETICLE ORDER FORM October 6, 2010

17. ASML JOB ORDER FORM October 6, 2010

18. INITIAL RESULTS Test Mask Megaposit SPR 660 Developer MF-26A Resist Thickness 750nm Exposure 130mJ at -0.1um Focus October 6, 2010

19. INITIAL RESULTS October 6, 2010

20. SVG 8800 WAFER TRACK Two Track System One Active Coat Track Send-HMDS-CP-Coat-SoftBake-Receive Configured for 4” or 6” Wafers Two Active Resist Pumps Capable of 3 Resists October 6, 2010

21. SVG 8800 WAFER TRACK October 6, 2010

22. SVG 8800 WAFER TRACK IDI M450 Photoresist Pumps ChemNet TM Software Dispense Volume Range 0.1ml to 50ml Viscosity Range 1.0cP to 100cP October 6, 2010

23. SVG 8800 WAFER TRACK Program #EventOperationArmTimeSpeedAccelExhaust Material s Used 11SPIN00010PI 2771 Target: 10um 2DISP16010 3SPIN03.02.0010 4SPIN028.03.0050 5EBR125.01.0050 6225.01.0050 7SPIN015.02.0050 8END 9 October 6, 2010 Coat Program

24. LITHO SUPPORT EQUIPMENT Headway Spin Coaters Headway Stand Alone Coater Hot Plates Acid and Solvent Fume Hoods Carbolite High Temperature Oven October 6, 2010 Vacuum Oven Nanospec Film Thickness Measurement AST Contact Angle Measurement Leica and Nikon Microscopes

25. HEADWAY SPIN COATERS October 6, 2010

26. WAFER SURFACE ANALYSIS AST VAC-3000S Contact Angle Measurement October 6, 2010

27. CARBOLITE HIGH TEMP OVEN Up to 600°C Programmable Eurotherm Controller October 6, 2010

28. MICROSCOPES Leica and Nikon Microscopes Leica Application Software October 6, 2010

29. FUTURE PROJECTS Add Developer Track Add Third Resist Pump Add Spin Coater for Thick Resist Applied Material 7830SI CDSEM Several Fume Hoods October 6, 2010

30. ACKNOWLEGEMENTS Micron Technology & ASML Janine Rush-Byers Micron University Relation Manager Troy Sych ASML VP Strategic Account Management Michael Brennan ASML Regional Customer Support October 6, 2010

31. International Rectifier Corporation Oleg Khaykin President and CEO Nick Brand GM & VP, El Segundo & WW Wafer Fab Strategies Larry Jones Site Facilities Manager October 6, 2010 ACKNOWLEGEMENTS