1. 1 IAR MakeApp for the Bluetooth protocol stack A superior configuration and optimization tool!

2. The importance of tool support Most stacks come with no tool support for configuration and optimization Manual adaptations are needed to use the stack on a new H/W or S/W platform Most stacks contain code for many features you don’t use –> waste of memory space! Manual optimizations are needed to get a fast and compact stack for your project You will need training courses or expensive consultants You will suffer a heavy development cost and time-to-market penalty! 2

3. The IAR MakeApp tool IAR MakeApp is the most powerful Bluetooth protocol stack optimization tool ever created! Advanced configurations are made within a few seconds on a high abstraction level The tool generates optimized and adapted Bluetooth protocol stacks in ANSI-C The stack becomes highly optimized for your H/W and S/W platform in seconds You save development time, production cost, and shorten time-to-market! 3

4. MakeApp ”runtime” environment - Superior GUI power and flexibility! Configure using property lists Support MCUs or external devices Support a Bluetooth stack or other configurable software blocks Drag components from the library and drop in the drawing editor Component drag & drop Add text or drawings (like the LEDs here) to enhance clarity Project explorer Source code generation output log

5. Feature highlights Highly graphical, ”CAD-like” drawing editor with drag & drop Optimizing code generator Built-in IAR Editor with source code syntax coloring HTML report generator creates detailed project reports with hypertext-links. Built-in HTML report viewer XML based file formats

6. Component model - Power and flexibility MakeApp supports many types of components, that can be added to the same project for configuration & code generation: Microcontrollers (8/16/32-bit, DSP) External devices (Ethernet, LCD, USB, CAN, ASIC, FPGA) S/W emulated peripherals (I2C) S/W components (Bluetooth or TCP/IP stacks, Keyboard scan) Unprecedented flexibility – MakeApp becomes a code generation platform, that can generate source code for the complete embedded system!

7. Stack configuration Environment H/W (Host CPU, Bluetooth device) S/W (RTOS, Compiler) Stack features Core (HCI, L2CAP, RFCOMM, SDP,...) Profiles (GAP, SDAP, SPP,...) Other (TCI, Message logs,...) Select API functions to implement 7

8. Configuration controls code generation MakeApp helps the user focus on the application rather than MCU and stack internals! Stack A: GAP SDP SPP Stack B: GAP SDP SPP Headset Stack C: GAP SDP SPP Headset (other settings)

9. ANSI-C code generation Code adaptations The stack source code is generated for the selected H/W and S/W environment The generated stack source code only implements the selected stack features Code optimizations Unused features and API functions are removed from the stack implementation Gives you a very compact stack = reduced memory usage and faster execution! 9

10. Stack optimizer Stack source code is generated in ANSI-C. Configuration controls the actual implementation. Compiler, RTOS and target adaptations can be made automatically from GUI configurations. Typical optimization situations: » Unused profiles are removed (headset) » Unused files are removed (BMC) » Unused features are removed (master/slave role switch) » Unused code is removed (defragmentation/assembly of long Msgs) » Unused functions are removed (unused HCI commands) The generated stack is tailor made for the customer project! No ”dead-code” is included in the stack.

11. Code size affect production cost! The stack optimizer makes a ”vertical slice” of the stack and removes unused code The resulting stack becomes very compact and waste no ROM space Production cost is reduced as CPU and ROM requirements are lower! 11 L2CAP SDAPSPP BMC HCI RFCOMMSDP GAP Application program Unused stack parts are removed Selected features are implemented

12. Time to market is critical – delayed launch means lost market window and reduced sales. Use good tools to shorten your time to market! SALESSALES Planned intro Lost sales Fixed in time Maturity Time Slip Source: McKinsey & Co. Product life cycle 12

13. 13 Sensitivity of profits over life cycle % diff. profit 0 -5 -10 -15 -20 -25 -30 -35 -40 -45 -33 % -22 % -3.5 % Source: McKinsey & Co. ship 6 mths lateprod. cost 9% high 50% dev. cost overrun No tool support for stack adaptation Stack uses too much memory or needs faster CPU More expensive development tool IAR comments.This symbol gives examples of reason to failure

14. Superior tool support Configurable stack Compact stack Shorter development RAD expertise Timely arrival to market Optimal solution Lower production cost Lower NRE cost Increased human capital Bluetooth Protocol Stack technology from IAR Systems 14