1. Accelerating Productization

2. Functional Metrology TM Challenges of Semiconductor Productization Leading IDM’s Solution Novel Solution -> In-product Functional Metrology TM Functional Metrology TM User Applications Summary of Functional Metrology TM When and Where You Need Visibility Into Your Product

3. Challenge: Longer Productization Cycles Intel Investor Meeting 2014 Over 25% Increase in New Process/Product Introduction 26 Months 33 Months

4. Challenge: Longer Productization Cycles New product introduction is taking longer, driven by Advances in process technologies, new devices and “shrinks” Increasing design and process complexity Power-Performance balance Increasing yield detractors (e.g. across-chip variability) Lack of visibility inside of the product die restricts actionable plans

5. Shrinking Geometry - Time Data (Complexity & Volume) Longer Productization How to generate actionable / relevant data? Challenge: Exponentially Increasing Data “Data Mining” for Actionable/Relevant Functional Data is Difficult

6. Figure 21: Ring Oscillator can be placed product die Industry Leader Solution Test Circuits Deployed Across Product Die Enable Functional Measurements

7. tau-Metrix’s Functional Metrology TM enables across-die performance measurements, and provides early direct insight into the design, process and product from early R&D/Characterization to High-Volume Production Functional Metrology TM has been verified on product die delivering an estimated 20-40% cycle time reduction. Functional Metrology TM Introduction Shortening Productization Cycle at “Zero-Impact” and “Zero-Cost”

8. Enabling In-Product Functional Insight In-Product Die Measurements with Zero Impact – User's test circuits inserted at user’s choice (e.g. critical nodes, cells, etc.) – “Autonomous” non-invasive, no-impact high spatial density – Full design and process compatibility Relevant Functional Data at Metal 1 – Early Performance Metrics – “At-speed” measurement of circuit functionality and performance – Non-disruptive and complementary to standard test and metrology Shorten Every Phase of the Product Cycle

9. IC-Auditor TM – Direct @Speed TM Measurement Non-Contact Activation Non-Contact Activation Non-Contact @Speed TM Detection Non-Contact @Speed TM Detection User’s Circuit Inverter Switching delay Sensitive to Leff pFET Drive nFET Drive V t, Threshold Voltage Interconnect Resistance Drive Strength Gate Capacitance Interconnect Capacitance User’s electrical and physical “autonomous” in-product test-structures Full design/process (Bulk and SOI) and FinFET compatible Qualified from 90nm to 22nm ROs Output 1 Output 2 Input Scalable (~ 50-100  m 2 ) Examples: Ubiquitous, “Autonomous”, Zero Impact and Non-Contact Measurements

10. Product Die Functional Measurements Wafer Sort at Final Metal Logic Cell Block Chip Pad RO Pad Nth Pad Pad RO Pad RO Probe Tip Scribe Product Die Global full product functional test Long distance from core logic Accumulative timing delays tau-Metrix acquires Functional Measurements early at Metal-1

11. Predictive Performance Yield at M1 Functional Metrology TM User Applications IC-Auditor TM Shorten Every Phase of the Productization Cycle Process and Model Development Product Die Functional Performance Process Integration and Performance Wafer and Die Yield Forecast Failure Analysis

12. Productization Cycle Time Reduction Early Visibility to Capture Functional Data Reduces Cycle Times Design Mask FabPackageFT Active PollyPolly M1M1 MnMn Sort Months 16-18 Weeks Design Mask FabPackageFT Active PollyPolly M1M1 MnMn Sort 8-9 Weeks M6M6 M10M10 Traditional Functional Measurement Cycle Functional Metrology Cycles Data When and Where You Need it Across the Entire Productization Cycle

13. Time Complexity Shrinking Geometry “Early Visibility” and “Intelligent Data” Reduces Cycle Time by 20-40% Functional Metrology TM Impact Actionable Data Reducing Time by 20-40%

14. Functional Metrology TM Applying – User’s circuits utilized to build “IC-Auditor TM ” – Autonomous IC-Auditor TM embedded in “Fill Space” – Full process/design compatible (including FinFET) – Scalable and verified on 90nm-22nm Bulk and SOI Enables – Minimal implementation resources and design complementary – Ubiquitous and dense (spatial) in-product-die, scribe and cross-wafer – Fast and early Metal-1 performance measurements – @Speed TM functional performance measurements Applications – R&D/characterization of device and process – Design/process development and integration – Yield forecast and optimization in volume production – Process monitor/control and functional test – Failure analysis on “good” AND “bad” (non-functioning) die/wafer Eliminates – Weeks of waiting for product performance data – In-die test overhead circuitry for power/detection and control – Dedicated test-wafers and non-product mask-sets  Functional Metrology TM delivers performance measurements early, at Metal-1, using “Zero Impact” IC-Auditor TM embedded throughout the die  Non-contact performance measurements maintain design and wafer integrity while providing direct circuit access

15. Functional Metrology TM Summary Intra-Die “IC-Auditor TM ” – Early and Relevant Data Compatible “Zero Impact” – Ready to Use Autonomous “Circuit” – No Product Impact “Performance” Measurements – Non-Contact @Speed TM Simple “Plug & Play” Structures – Easy to Use Early/immediate visibility into across-die functional data significantly reduces the productization cycles

16. Implement user’s cells in product – tau-Metrix helps with design and integration process Measure IC-Auditor TM cells across die and wafer – tau-Metrix takes measurements and provides data Implementing Functional Metrology TM IC-Auditor TM Product Die Wafer Automated Measurement @Speed TM Measurement

17. Functional Metrology TM Deployment 1.Functional Metrology TM Service – tau-Metrix provides design integration support and measurement services on customer’s devices – Ease of adoption and implementation 2.Functional Metrology TM off-line – tau-Metrix provides design support as needed – Customer acquires fully automated measurement system – Enables full customer control and unlimited measurements 3.Functional Metrology TM in-line – tau-Metrix provides design support as needed – FAB deploys fully automated FAB measurement system – Enables in-line fully automated measurements, complementing metrology and test tools Enabling an innovative solution to support customer’s unique requirements

18. Thank You