1. 26 September 2000 High Voltage Plates and Capacitors Jack Fowler

2. 26 September 2000 Fowler Duke HEP High Voltage Plate Procurement  Initial pre series received November 1999 u We determined that the Kapton was too thick and redesigned.  Second pre series was received in May 2000 u Traces on Kapton circuits exhibited cracks after flexing  New Kapton flex circuits ordered in July 2000  New High Voltage plates received September 2000 u Currently evaluating changes  Remaining High Voltage Plates to be delivered in 2000

3. 26 September 2000 Fowler Duke HEP High Voltage Plate

4. 26 September 2000 Fowler Duke HEP Changes to HV Plate  Gold plating was removed from the traces, except for contact regions u This was due to the thin layer of Nickel required under the gold. It was causing the cracking. u This was based on several recommendations from experts in the field of circuit manufacture.  Increased radius and added chamfers to areas on thick plate where bending will occur u This was based on recommendations from the manufacturer of the Kapton material. (DuPont)

5. 26 September 2000 Fowler Duke HEP Changes to Gold Plating

6. 26 September 2000 Fowler Duke HEP Changes to Thick Plate

7. 26 September 2000 Fowler Duke HEP Consequences of Changes  Due to the changes in gold plating, portions of the Kapton flex circuits had to be remanufactured u Added 4 weeks to the delivery time u Cost $15,000 for Type 1 and Type 2 HV Plates u Type 3 was not affected because only pre-series was on order u Thick plate changes had no effects on price

8. 26 September 2000 Fowler Duke HEP Capacitor Procurement  Johanson X7R dielectric turned to “dust” after radiation testing at CERN  Identified alternative sources and dielectrics  Samples have been sent to CERN for evaluation  Expect 20 to 30 week lead time due to shortage in electronics market  How does this affect module production and installation?