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Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Technical status of the W-Si project CALICE : CAlorimeter for the LInear Collider.

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Presentation on theme: "Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Technical status of the W-Si project CALICE : CAlorimeter for the LInear Collider."— Presentation transcript:

1 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Technical status of the W-Si project CALICE : CAlorimeter for the LInear Collider with Electrons A calorimeter optimized for the Energy Flow measurement of multi-jets final state at the Future Linear Collider running at a center-of-mass energy between 90 GeV to 1 TeV. Electromagnetic Calorimeter Electromagnetic Calorimeter Hadronic Calorimeter Hadronic Calorimeter http://polywww.in2p3.fr/flc/calice.html

2 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 General view of the calorimeter Tracker : TPC ECAL : Sandwich Wplate & Si Wafer HCAL : DHCAL or AHCAL Coil : 4 T (2 )

3 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 ECAL concept : - A fine granularity calorimeter with large number of segmentation is proposed as the best solution for the energy flow, lepton identification, photon reconstruction with good precision on energy and direction. - On the other side, the coil thickness is bigger than usual due to the 4 Tesla field needed to maintain the machine background close to the beam pipe. Therefore, the ECAL has to be very compact. (1,30 m for ECAL and HCAL) - Such a calorimeter could be made of Tungsten-Silicon sandwich. -With pad of 1x1 cm and 40 layers : A TRACKER CALORIMETER. -It gives a clean picture of all energy flow objects in all type of events -Simulation using GEANT4 lead to think of an energy resolution on electron/photon in the region of Delta E /E = 11% / sqrt(E)

4 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Toward physique prototype :

5 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 ECAL general view 3 rd structure (3×1.4mm of W plates) 370 mm 180 mm Silicon wafer 2 nd structure (2×1.4mm of W plates) VME/… HCAL VFE Movable table ECAL Beam monitoring Global view of the test beam setup Prototypes overview Prototypes overview BEAM 1 st structure (1.4mm of W plates) Detector slab 370 mm

6 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Design and construction of a mould with all metallic pieces for the 3 different structures Mould for alveolus structure 1.4 Alveolus structures Structure 5 alveolus :(10 layers) Detector slab (here it is just a type H structure)

7 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Sizes of the structure : Alveolus 8.5 mm 125.6 mm 374.5 mm

8 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Front End electronics (Cfi / W) structure type H Silicon wafer Shielding PCB Al. Shielding PCB (multi-layers) (  2.4 mm ) Silicon wafer (0.525 mm) Tungsten (1.4 mm, 2×1.4 or 3×1.4 mm) 8.5 mm Composite structure (0.15 mm / layer) Transverse view Detector slab PCB : - 14 layers - Thickness 2.4 mm

9 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Type H structure Carbon fiber Tungsten 1.4 mm thick Conception and realization of mould for manufacturing the whole 30 type H structures (3 different thickness W) : Mould structure H : Ended alveolar :

10 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Sizes of the structure : Slab 8,3 mm Aluminum foil : ~0.1 mm PCB : 2.4 mm Wafer : 0.525 mm Carbon fiber : 0.15 mm W plate : 1.4 mm

11 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 PCB PCB, Wafer, Chip : still in progress

12 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Wafer PCB PCB, Wafer, Chip : still in progress

13 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 PCB Chip PCB, Wafer, Chip : still in progress

14 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 4” high resistivity wafers - - 525 microns thick – 5K  cm - - tile side: 62.0 + 0.0 - 0.1 mm - - guard ring ECAL prototype ECAL prototype silicon wafer description Dead zone width is only 1mm 39 good 39 good (< 2 nA leakage) First test production with 43 wafers with 43 wafers

15 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Wafer : Leakage curent (nA) Thickness : 525 microns  3 % In silicon ~80 e-h pairs / micron  42000 e - /MiP Capacitance : ~25 pF Leakage current : 1 – 5 nA Full depletion bias : ~150 V Nominal operating bias : 200 V Institute of Nuclear Physics - Moscow State University Institute of Physics, Academy of Sciences of the Czech Republic - Prague

16 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 1 wafer 62mm PCB Wafers The aluminium sheet is the ground Aluminium sheet 10mm 22222 2 6 Diode footprint Detector schematic description Amorphous silicon deposition  Resistance  Capacitance (AC coupling) Yvan Bonnasieux Physique des Interfaces et Couches Minces - Ecole Polytechnique - Palaiseau Diode pin out Diode bias Sig. readout

17 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Passive component on the wafer :   Capacitance :   Dielectric : silicon nitrite   Refractive index : n=2   Thickness : e = 2  m   Resistance :   material : aSiH   Resistivity :  =10 11 .cm   Thickness : l = 2  m C= 1,32 nF R= 102 M 

18 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Passive component on the wafer :   Capacitance : C ~ 1.4 nF Leakage current Problem of measurement   Resistance : Still in progress …

19 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Gluing of Si wafer A automatic device is use to deposit the conductive glue : X-Y-Z table (400×400×150 mm 3 ) with glue dispensing tool (conductive glue) 270 Gluing and placement (  0.1 mm) of 270 wafers with 6×6 pads 10 000 About 10 000 points of glue.

20 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Vdc = -200V DC block Detector Amp Charge preamp OPA shaperTrack & hold Front end electronic : Asic Laboratoire de l'Accélérateur Linéaire - Orsay

21 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Vdc = -200V DC block Detector Amp Charge preamp OPA shaperTrack & hold Front end electronic : Asic 4.2 pC max input charge (650 MIP) 2.8V dynamic range below 1% non-linearity Laboratoire de l'Accélérateur Linéaire - Orsay

22 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Vdc = -200V DC block Detector Amp Charge preamp OPA shaperTrack & hold Front end electronic : Asic 180ns peaking time Laboratoire de l'Accélérateur Linéaire - Orsay

23 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Vdc = -200V DC block Detector Amp Charge preamp OPA shaperTrack & hold Front end electronic : Asic Multiplexing output : 18 channel / chip 2 chips / wafer ENC = 2200 @ 80 pF Laboratoire de l'Accélérateur Linéaire - Orsay Talk from Bernard Bouquet : R&D for ECAL-VFE technology prototype

24 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Front end electronic : Asic

25 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 New FLC_PHY2 Peaking time is 200ns on both gain High-gain shapers can be shut down by switching off their biases Two different output for low gain and high gain   Interface compatibility with the read out is kept New interface not written at this point Linearity simulation Transient simulation

26 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 DAQ : VME (use and modify CMS board for Si tracker) Need of 6 boards for physic prototype Talk from Paul Dauncey : DAQ for the CALICE beam test

27 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Cosmic test bench: general view

28 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 2 XY planes : 16 in X et 16 in Y (40x40 cm 2 ) scintillators reading : PM + Ampli + Trigger Logic Crate VME : - QDC CAEN - Trigger + Veto (dual timer) - Crate Controller : PCI MXI-2 (NI) board 2 XY planes : 16 in X et 16 in Y (40x40 cm 2 ) scintillators reading : PM + Ampli + Trigger Logic Crate VME : - QDC CAEN - Trigger + Veto (dual timer) - Crate Controller : PCI MXI-2 (NI) board Cosmic test bench: general view

29 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Cosmic test bench: general view Pattern generation board (Labo) : Pattern generation board (Labo) : Numerical CPLD Clock toward PCB : 208 KHz Level translator TTL/RS422 Pattern generation board (Labo) : Pattern generation board (Labo) : Numerical CPLD Clock toward PCB : 208 KHz Level translator TTL/RS422

30 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Cosmic test bench: general view Talk from Cristina Lo Bianco : Assembly and cosmic test for the W-SI prototype (CALICE) Commercial board (National Instrument) - PCI Interface - PCI Interface - ADC 12 bits (1.25 Msa/s) - ADC 12 bits (1.25 Msa/s) - DMA Transfer - DMA Transfer - Input dynamic : from +/- 0.05 to +/- 10V - Input dynamic : from +/- 0.05 to +/- 10V Commercial board (National Instrument) - PCI Interface - PCI Interface - ADC 12 bits (1.25 Msa/s) - ADC 12 bits (1.25 Msa/s) - DMA Transfer - DMA Transfer - Input dynamic : from +/- 0.05 to +/- 10V - Input dynamic : from +/- 0.05 to +/- 10V

31 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Other ECAL R&D Thermal studies Thermal studies VFE inside beam (Chip evaluation board and small DAQ are ready) VFE inside beam (Chip evaluation board and small DAQ are ready) Passive component on the wafer (Capacitance Ok and resistance still in progress) Passive component on the wafer (Capacitance Ok and resistance still in progress) Amorphous silicon … (works of Pierre Jarron at Cern) Amorphous silicon … (works of Pierre Jarron at Cern) …

32 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Other ECAL R&D Thermal studies Thermal studies

33 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Other ECAL R&D Thermal studies Thermal studies In the case of 40 layers and considering a power dissipated of about 5 mW/cm 2 the temperature at the middle of structure would be about 280 °C

34 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Other ECAL R&D Thermal studies Thermal studies PCB 1mm thick (with wafers) Heat points (VFE chip) Cooling channel Radiator aluminium plate Structure type H Thermal sensors External connections

35 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Other ECAL R&D Thermal studies Thermal studies VFE inside beam (Chip evaluation board and small DAQ are ready) VFE inside beam (Chip evaluation board and small DAQ are ready) Passive component on the wafer (Capacitance Ok and resistance still in progress) Passive component on the wafer (Capacitance Ok and resistance still in progress) Amorphous silicon … (works of Pierre Jarron at Cern) Amorphous silicon … (works of Pierre Jarron at Cern) …

36 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Physic prototype : who ? Mechanic : Mechanic : –W plates : Russian –ECAL Structure : LLR –Infrastructure of beam test : LPC Clermont-ferrand ? and ? –beam Hodoscope : ? Data processing : Data processing : –DAQ / Event Builder : ? –Simulation : LLR Electronic : Electronic : –VFE : LAL –DAQ : UK –Slow control : ? Instrumentation : Instrumentation : –silicon : LLR and PICM + Russian and Czech –ECAL Integration : LLR –Cosmic test bench : LLR

37 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Physic Prototype : Planning

38 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Physic Prototype : Planning

39 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Physic Prototype : Planning

40 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Physic Prototype : Planning

41 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Physic Prototype : Planning

42 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Physic Prototype : Planning

43 Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Physic prototype  Physic prototype  program is well advances First test beam with electrons  mi 2004 First test beam with electrons  mi 2004 First hadronic test beam  2005 First hadronic test beam  2005 All is not covered : All is not covered : –Physic prototype in 2004 –R&D (thermal et electronic) –… http :// polywww.in2p3.fr/flc/calice.html

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