1. Multichannel readout system of inner tracker for NICA-MPD Rogov Victor AFI, JINR, Dubna Afi.jinr.ru

2. Short data about NICA/MPD

3. Short data about Inner Tracker Afi.jinr.ru

4. The work purpose The development of a prototype of front-end- electronics for readout information from CBM01-B2 board Afi.jinr.ru

5. Collaboration – Scientific Research Technological Institute of Instrument Engineering (SE SRTIIE Ukraine) – Helmholtz Centre for Heavy Ion Research (GSI Germany) – Joint institute for nuclear research (JINR Russia)

6. Problems The analysis of the existing multichannel chargesensetive preamplifiers for experiments of physics (JINR); The analysis of main principles and methods of development of chips-adapters for open-frame installation of multichannel preamplifiers (JINR- SE SRTIIE); Research of technological parameters, development and manufacture of chip-adapter (SE SRTIIE); PCB layout development (JINR); Assembling and testing sample modules of front-end- electronics (JINR); Afi.jinr.ru

7. The base readout system Afi.jinr.ru

8. The sensor board СВМ01В2 Afi.jinr.ru

10. Key Features mixed signal chip, 128 channels,1 test channel with analogue diagnostic output, available for positive and negative signals self triggered, data driven de-randomizing, readout at 32 MHz digital time stamp output, analogue peak hight output analogue pile-up registry, programmable dead time, local threshold adjustment, dynamic Range: 120000 e Shaping time and noise performance: 18 ns fast shaper at 30 pF input, 850 enc for positive signals, 1000 enc for negative signals 140 ns slow shaper at 30 pF input, 600 enc Timing resolution ~ 2-3 ns, time stamp resolution 1 ns Afi.jinr.ru

11. The problems of existing FEB’s - three layer pads - small pitch of pads – 50 uM -A considerable quantity of bonding points - Low mechanical durability -Possibility of short circuit of donding conductors Afi.jinr.ru

12. The offered solutions For decrease in probability of short circuit at bonding point’s, augmentations of a conductors pitch, total reduction of bonding point’s on PCB, augmentations of mechanical strength, a possibility of testing n-Xyter before bonding on pcb, suggested to develop the chip- adapter, which: Increases pitch of tab bonding point’s with 100 to 300 microns for entrance pad’s, and 100 microns to 400 for out pad’s; Provides installation of the chip-adapter with a microcircuit at one layer of PCB. Afi.jinr.ru

13. TAB Bonding point’s of chip- adapter with PCB Chip-cable Afi.jinr.ru

14. The design sketch Afi.jinr.ru

15. 3D model and manufactured FEB Afi.jinr.ru Chip-adapter with n-Xyter Input’s Output&CTRL CTRL(i2c) ADC DC input

16. Evolution of system with chip adapters Afi.jinr.ru

17. Conclusions – The first prototype and tests of FEB ware made – Research of testing with senson board СВМ01В2 – New FEB with new n-Xyter Afi.jinr.ru

18. Thank you Afi.jinr.ru

19. Research of a photoresistive mask thickness (250 seconds are chosen) Research of exhibiting time of a photoresistive mask from a conductive layer (7 seconds are chosen) Afi.jinr.ru

20. Research of influence the maintenance of SAS in etchant at etching of aluminium layer on a etching wedge (0,7 %) Research of etching time of a conductive layer of aluminium (75 seconds chosen) Afi.jinr.ru

21. Research of temperature effect of etchant on dielectric layer. (75 degrees) Research of polyimide layer etching time (40 seconds are chosen) Afi.jinr.ru