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Laser Cleaving of Optical Connectors Didi Hachnochi VP Engineering & R&D Duane Dinkel President Sagitta Incorporated 655-H Fairview Road Simpsonville,

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Presentation on theme: "Laser Cleaving of Optical Connectors Didi Hachnochi VP Engineering & R&D Duane Dinkel President Sagitta Incorporated 655-H Fairview Road Simpsonville,"— Presentation transcript:

1 Laser Cleaving of Optical Connectors Didi Hachnochi VP Engineering & R&D Duane Dinkel President Sagitta Incorporated 655-H Fairview Road Simpsonville, SC 29680

2 Introduction The Problems  Mechanical cleaving – operator and tool-dependent quality (hand- scribe, sand-blasting, etc.)  Epoxy Bead size – operator and process-dependent quality  Polishing – sub-optimal initial conditions (overuse of consumables; costly)  Connector/Fiber-specific challenges – MT, Large OD fiber, SMA’s, etc.  Compromised First Pass Yield, Throughput, Quality, and Cost! The Solution  Laser Cleaving (integrated denubbing and epoxy removal) Results Future Technologies Conclusion

3 Connector Termination Process Cut to Length Strip & Clean Assembly I Insertion Into ferrule Epoxy Application Epoxy Cure Fiber Cleave Air Polish “Denub” Epoxy Removal Polish Sequence Assembly II Clean Endface Visual Inspection Geometry Inspection Optical Inspection Label And Pack

4 Uncleaved Connector Tip Ceramic Ferrule Fiber “Stinger” Epoxy Bead 5.0–15.0mm Ceramic Ferrule Fiber “Stinger” Epoxy Bead 5-15 mm 300-1200um

5 Manual Cleave Process Mechanical techniques represent > 90% of the industry

6 Hand Polish Process – “Denubbing” Hand polishing can consume up to 30 sec per end After Fiber Stub & Epoxy Bead Before Coarse Hand Polishing Material –1000um 300– Fiber Stub & Epoxy Bead Coarse Hand Polishing Material 300 – 1200 um 300 – 500 um

7 Manual Cleave – The Problems Variable Epoxy Bead Size  Polishing process variable  Requires hand polish to remove Variable “Stinger” Length  Extra polishing step Epoxy Bead Size Range Height:300 - 1200um Volume:0.02 – 0.05 mm 3 Cleaved Fiber Range 300 – 500um Poor Cleave = Bad Endface  Yield (and quality) problem ⇨ reworks!  Core cracks  Endface chips

8 Laser Cleaver Animation

9 Laser Cleaving Principal Ceramic Ferrule Fiber “Stinger” Epoxy Bead 300 – 1200um 5.0 – 15.0mm From Curing 80 – 120um Into Polishing Focused CO2 beam spot passes thru fiber and epoxy Combines Cleaving + Denubbing + Epoxy Removal

10 Simplex Connector Before/After Cleave Small epoxy beadLarge epoxy bead Before Cleave Hand Cleave Bellow epoxy! Laser Cleave Fiber stub & residual epoxy < 100μ After Laser Cleave

11 Field Performance - Simplex USL TGT LSL Cleave Height Reproducibility Limits must be sufficient to eliminate polishing steps

12 MT Connector Cleaving Progress Ferrule Epoxy 12 Fibers Before After 4 cycles After 2 cycles

13 Field Performance - MTP Maximum fiber variation < 20um Demonstrated ability to remove 20mm 3 (5mm x 2mm x 2mm) of epoxy bead Cleave height adjustable from 50um Only constraint is in molded ferrule tolerance (specified at +/- 50um)

14 Laser Cleaving Implementation Laser safety compliance Ergonomics Ferrule size (1.25mm vs. 2.5mm vs. MT, etc.) Fiber type – SM vs. MM Process flow Violation of intellectual property

15 Quality Benefits of Laser Cleaving Eliminates operator and tool dependent cleave quality Simplifies the polishing process & removes interdependencies Eliminates cleave related multimode fiber “core cracking” Improves connector reliability - laser “ tempers/anneals ” fiber endface relieving inherent fiber stresses Removes up-stream variability “Levels the process playing field” Removes up-stream variability “Levels the process playing field”

16 Cost Benefits of Laser Cleaving Reduces consumable costs  Minimizes abrasive consumable cost (1-2 polishing operations eliminated)  Eliminates scribe blade wear-out Higher yields Reduces headcount (or increases throughput) Combines scribing + denubbing + epoxy removal

17 Cost Benefits of Laser Cleaving Labor ⇩ Cost of Consumables ⇩ (abrasive films, scribes, etc.) Yields ⇧ COGS reduces by 5 – 10% (Shaving $50M annually out of industry costs) COGS reduces by 5 – 10% (Shaving $50M annually out of industry costs) ManualLaser Cleaving BOMCoCL&OTotalBOMCoCL&OTotalSavings, $/end SM Low-Volume US (325K ends)$1.13$0.13$1.85$3.17$1.13$0.11$1.51$2.83$0.33 MX (650K ends)$1.13$0.13$0.46$1.75$1.13$0.11$0.37$1.65$0.10 China (950K ends)$1.06$0.11$0.18$1.36$1.06$0.10$0.14$1.32$0.04 MM Mid-Volume US (650K ends)$0.98$0.07$1.44$2.54$0.98$0.05$1.16$2.26$0.28 MX (1300K ends)$0.93$0.07$0.36$1.38$0.93$0.05$0.28$1.30$0.08 China (1900K ends)$0.83$0.06$0.14$1.05$0.83$0.05$0.11$1.01$0.04

18 Enabling Benefits of Laser Cleaving Cleaves fiber types that are not readily mechanically cleaved Accommodates large OD and specialty fibers Suitable for MTP production

19 Field Data AssessmentSC (MM)LC (MM) (Laser)(Manual)(Laser)(Manual) Total Connectors Evaluated> 50K -> 25K - First Pass Yield95% 85%98% 85% Cracks1% 5%1% 5% Chips4% 10%1% 10% Average Throughput, UPH360 150450 200 Average Cleave Height, um95 40060 300 Cleave Height Variability*, +/- um2030020300 Field Observations and Comments  Laser cleaving removes operator dependence – excellent repeatability between shifts, minimizes training  Laser cleaving removes upstream epoxy bead variability – reduces polishing steps  Laser cleaving decreases manufacturing costs – 2x throughput, improves yield Field Observations and Comments  Laser cleaving removes operator dependence – excellent repeatability between shifts, minimizes training  Laser cleaving removes upstream epoxy bead variability – reduces polishing steps  Laser cleaving decreases manufacturing costs – 2x throughput, improves yield

20 Image Acquisition & Processing Extending the Capability 1. Raw data image 2. Image processing – Edge 3. Image processing – Best fit to edge 4. Best edge fit on original image Enables automating the laser cleaving process

21 Field Module Single Step Polishing Support Module Fully automated platform Extensions of Laser Cleaving Technology Cleaving + Polishing + Cleaning + Inspection

22 Conclusion Advantages of Laser Cleaving  Increased Quality & FPY  Faster – eliminate polishing process steps  Cheaper – lower process cost, less rework  Reliable – no detrimental impact  Field scalable  Enables Single Step Polishing Disadvantages  None, of course

23 Thank You!


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