1. UK – quad module

2. Experience with FE-I4 UK groups relatively new to ATLAS pixel Have 5 USBPix systems up and running now – Glasgow, Edinburgh, Manchester, Liverpool, RAL Bare chip characterization performed – Same procedure as with the IBL testbeam – Low threshold noise dependence measured Pulser DAC calibration Near future on single chips – Sr-90/Am-241 testing of Micron planar and 3D to start soon – Environmental chamber + active cooling of sensors in the lab – Laser set-up to perform in pixel maps – X-ray source rate measurements?

3. Quad Module items Sensor – New quad wafer being processed at Micron 6inch wafer Available in range of thickness (150um to 250um) – 250um to start with 5 quads, 8 singles per wafer – Quads have different guard ring designs Baseline : IBL like – Active to cut edge : 450um, 6 guard rings Conservative : 850-900um Single GR : 450um Active to GR Single GR : 300um Active to GR – 5 quads to be assembled from this sensor with VTT UBM – Trial of UBM deposited by Micron will take place after this on 4 quad sensors

4. Quad module parts continued ASICs – 2 UK wafers plus MPI wafer – First wafer expected before end of September Is this still possible? UBM and Flip-chip at VTT – Order placed – UBM mask for FE-I4 and sensor wafers in design – Flipping to take place in October at VTT

5. Future Exploring future work with VTT Front side passivation – BCB/Parylene coating – To be performed in near future on single chip modules to start with – If successful will attempt on quad module Thin modules – Thin sensors (150um demonstrated at Micron) – Thin ROC – will require a supply of FE-I4 wafers – Start with single chip modules but go to quads once proven TSVs – Single chip R&D program. – Looking for interested parties to contribute – CMS/ALICE other ATLAS groups