1. The fastest e-passport of the world – SESAMES 2013 winner for new generation eletronic documents Matthias Bruestle from MaskTech GmbH mbruestle@masktech.de Ji Zheng from Infineon Technology AG Ji.Zheng@infineon.com

2. Infineon Technologies – leading the security industry for over 25 years Infineon Chip Card & Security Infineon provides semiconductor and system solutions, focusing on three central needs of our modern society: Energy Efficiency, Mobility and Security No. 1 in the chip card security controller market with 24% 1 market share in 2012 by revenue. Innovation leader with numerous product awards:  Sesames Award (Fastest e- Passport, 2013)  Germany's Industry Innovation Award 2010  Nomination German Future Prize 2013 1 Source: IHS/IMS, September 30, 2013 "Smart Cards and Smart Card ICs - World" CC Microcontroller IC Market Share 2013 1 Infineon 24,1% Page 2Dec 2013Copyright © Infineon Technologies AG 2013. All rights reserved. Awards/Recognitions: Sesames: Best Hardware Germany´s Industry Innovation Award Nomination German Future Prize

3. MaskTech Page 32013-11-18Copyright © Infineon Technologies AG 2013. All rights reserved. #1 independent System on Chip / OS manufacturer for travel & eID documents German company, founded in 2002 Industries: Government ID, Health Care, Access, Authentication, Public Transport Common Criteria certified embedded solutions developed in Nuremberg, Germany Achievements:  Worldwide first ICAO masked OS  In over 60 countries ePassports and ID documents (10 in Asia)  >100 million licensed

4. Why do we need high speed e-passport? e-Passport should be the only identification document in international traveling Currently only a carrier of personal identity – only inspection Information all around cross-border activities has to be digitally managed and recorded ICAO LDS 2.0 (Logical Data Structure) to be included in DOC9303 will specify data format and secure handling Complete personal data will increase High speed processing is mandatory in the future to ensure quick border crossing Page 42013-11-18Copyright © Infineon Technologies AG 2013. All rights reserved.

5. 4th Generation ePass goes LDS 2.0 Logical Data Structure 2.0 Page 52013-11-18Copyright © Infineon Technologies AG 2013. All rights reserved. Specifies a new application independent of current LDS 1.7 to ensure backward compatibility Application will contain more persistent data groups for  Visas  Entry / Exit Stamps  Additional Biometric Data not considered in LDS 1.7 To update data on the e-passport PKI authentication will be necessary (EAC2) With a data capacity like a 60 page passport the complete personal data will be up to 500 kB

6. Page 62013-11-18Copyright © Infineon Technologies AG 2013. All rights reserved. Large flexible memory on controller High speed contactless personalization in production High speed contactless readout at the border Chip requirements Demand

7. eID goes Multi Application Combine several gov’t and commercial applications on one card Driver: added citizen value leveraging gov’t invest Requirement: host many apps flexibly & secure Page 7SDW May 2013Copyright © Infineon Technologies AG 2013. All rights reserved.

8. Major Trend of electronic ID  Long term security (>10 years)  Certified security (common criteria)  System security (HW, OS, Appl.) Security  Performance  Interoperability  Multiple interface  Standards compliance Convenience  ICAO Travelling  National eID  Mobile eID  eVisa, LDS2.0 with mega data Multiple Applications Performance Security Memory Page 82013-11-18Copyright © Infineon Technologies AG 2013. All rights reserved.

9. 3-Stages to Boost Performance Through Contactless Innovation 1.Higher Frame Sizes  Transmit 4 times more bytes per frame  Also available for bitrates 106-848kBit/s  Increase up to 40% application speed 2.Very High Bitrates  Transmit data 8 times faster (6.8MBit/s)  Increase up to 40% application speed 3.Parallel NVM Programming  Program NVM during communication  Increase up to 30% application speed All features are ISO/IEC compliant Infineon is first to introduce this features Features available on SLE 78 in 90nm Page 9set dateCopyright © Infineon Technologies AG 2013. All rights reserved.

10. 106kBit/s 2005 ISO 7816 ISO 7816 Flash Controllers for e-Government Need High Speed Contactless Data-Writing 424/848 kBit/s 2010 ISO 7816 ISO 7816 NOW ISO 7816 ISO 7816 Flash about to dominate government market as superior solution Large amounts of code and data have to be personalized Contactless interface dominant in many governmental apps Fast Flash Data-Writing Page 102014-03-11Copyright © Infineon Technologies AG 2014. All rights reserved. High Speed contactless writing can outpace contact-based writing already today

11. Acceleration Toolbox for High Speed Perso Higher frame sizes for data packages Programming of memory in parallel to data transmission Data transmission at Very High Bit Rates (VHBR) up to 6.8 Mbit/s Modern Flash Controllers Support Page 11SDW May 2013Copyright © Infineon Technologies AG 2013. All rights reserved.

12. MTCOS ID on SLE 78 with ISO VHBR World‘s Fastest e-Passport Transaction Time (1) Measurements based on certified EAC ePassports w full security implementation (2) Measurement based on certifiable EAC ePassport w full security implementation with VHBR Very High Bit Rate data transmission (3) Typical benchmarking hardwares lie at 2~3 seconds currently Market Average 3.1 sec SLE 66 2007 1.5 sec MTCOS SLE 78 MTCOS SLE 78 2010 0.8 sec MTCOS - SLE 78 with VHBR 2013 Page 122013-11-18Copyright © Infineon Technologies AG 2013. All rights reserved. BAC SAC

13. Customer Benefit SESAMES winner 2013 Best performance enhanced by VHBR (Very High Bit Rate) enables SAC ePass transition <1 second Increase transition efficiently by border control up to 22% World-wide references (>60 countries) of secure ID solutions from MaskTech GmbH Best fit for future applications like SAC & LDS2.0 10 years lifetime Claims and Customer Values Page 132013-11-18Copyright © Infineon Technologies AG 2013. All rights reserved.

14. Demonstration Page 142013-11-18Copyright © Infineon Technologies AG 2013. All rights reserved.

15. Contact Page 152013-11-18Copyright © Infineon Technologies AG 2013. All rights reserved. MaskTech GmbH Nordostpark 16 D-90411 Nuremberg Germany www.masktech.com P: +49 911 955149-0 Infineon Technologies AG Am Campeon 1-12 D-85579 Neubiberg Germany www.infineon.com P: +49 (0) 89 234 - 0