1. Lynnfield: Desktop Processor
Lynnfield Processor 1
45nm, Hi-K Process
Key Features:
Based on New Nehalem Microarchitecture
Intel® Turbo Boost Technology
Intel® Hyper-Threading technology (4 Cores, 8 threads) -> “i7 only”
8MB of Intel® Smart Cache
Integrated Memory Controller (IMC) – 2ch DDR3
Discrete graphics support – 1x16 or 2x8
Lynnfield
Processor
Discrete
Graphics
DMI
Socket:
LGA1156 Socket (compatible with Clarkdale)
Power: 95W
2009A & 2009B FMB’s
Intel® 5 series Chipset
Platform Compatibility:
Intel® 5 series Chipset
TECHNICAL SPECIFICATIONS
Processor Series
Clock Speed (GHz)
Cores/Threads
Cache
Memory Speed Support
TDP
i7-870
2.93
4/8
8 MB
DDR3-1333
95 W
i7-860
2.80
i5-750
2.66
4/4
1: Not all features are available on every processor line items
Intel® FDI: Intel Flexible Display Interfacec 1

2. 2009년 3분기 인텔® 코어™ i7&i5로의 전환 (린필드)
PCIe*
Graphics
GFX
Intel® 5 series
Chipset3
Processor ME
DDR3
IMC
DISPLAY
Display
DMI
Intel® Flexible Display Interface (Intel® FDI)
I/O
2009년 3분기 인텔® 코어™ i7&i5로의 전환 (린필드)
What’s New:
향상된 터보 부스트기술
하이퍼스래딩기술(only i7)
스마트캐시
향상된 Intel®Smart Cache
저비용 플렛폼
저전력 CPUs (95W)
소켓 1156
2 채널 DDR3 메모리
Intel® Turbo Boost Technology1 gives maximum performance to applications that need it most
Intel® Hyper-Threading Technology2 optimizes performance on highly threaded applications
Intel® P55 Express Chipset 2 2

3. Revolutionary, Intelligent, Incredible Performance
3-minute pitch
Intel® Core™i7 & i5 ( Lynnfield ) Key Message & Features
Key Message:
Revolutionary, Intelligent, Incredible Performance
Key Features
NEHALEM ARCHITECTURE
Integrated Memory Controller
DDR3 1333/1066 Support
Up to 8M Shared Smart Cache
INTELLIGENT PERFORMANCE WITH INTEL TURBO BOOST TECHNOLOGY
IMPROVED MULTITHREADING WITH INTEL® HYPER-THREADING TECHNOLOGY(i7 only)
Dynamically Increases Frequency
Potential instruction threads per processor 2 1 3
Processor speed can increase when running below temperature/power limits
Processor delivers more performance in every day usage applications
Revolutionary Architecture and Performance leadership with 45nm Nehalem Processor 3

4. Nehalem Desktop Processor Comparison
Feature
Bloomfield(45n) i7
Lynnfield(45n) i7
Lynnfield(45n) i5
Processing Threads
[via Simultaneous Multi-Threading capability (SMT)] 8 4
CPU Cores
Shared Cache
8MB
Integrated Memory Controller Channels
3 ch. DDR3
2 ch. DDR3
Discrete Graphics Support (PCIe Gen2)
2x16 or 4x8, 1x4 (via Tylersburg IOH)
1x16 or 2x8
Integrated GPU No
Processor Package TDP
130W
95W
Socket
LGA 1366
LGA 1156
First Samples / Production
Q4 ’07 / Q4 ‘08
2H ’08 / 1H ‘09
Platform Support
Tylersburg & ICH10
Ibexpeak
Common Features
Turbo Mode, 7 additional SSE4 instructions, VRD11.1, 45nm process
Nehalem Processor Leadership with Integration 4

5. 향상된 싱글 코어 주파수로 강력한 터보 부스트 기술
인텔®코어™ i5(린필드) 프로세서의 특징
향상된 싱글 코어 주파수로 강력한 터보 부스트 기술
기본 코어 주파수
2.93 GHz
(turbo up to 3.6 GHz)
8M, 4 Cores 8 threads
하이퍼 스래딩
인텔® 스마트 캐시

6. 메인 스트림의 인텔® 터보 부스트 기술 최적화된 성능향상과 에너지 효율
Previous Generation
without Turbo
Lynnfield1
with Turbo
Single-Threaded Workload < TDP
Near zero power for inactive cores
Lightly-Threaded Workload < TDP
Highly Threaded Workload < TDP
Not for End-User Messaging
1 Example based on 2.93GHz Lynnfield 6

7. Nehalem Architecture (Intel®Core™ i7) Intel® Smart Cache

8. Nehalem Architecture (Intel®Core™ i7) Simultaneous Multi-Threading (SMT)

9. Comparison of Desktop Sockets
LGA 775
Kentsfield/Conroe
LGA 1156
(Lynnfield/Havendale Processors)
LGA 1366
(Bloomfield Processors)
Contacts: 775
Package Size: 37.5 mm square
Contacts: 1156
Package Size 37.5 mm square Independent Load Mechanism (ILM)
Contacts: 1366 Package Size 42.5 x 45mm Independent Load Mechanism (ILM)
LGA 775
LGA 1156
LGA 1366
Pin A1
Pin A1