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The Belle II Silicon Vertex Detector Readout Chain Markus Friedl (HEPHY Vienna) TWEPP2012, 19 September 2012
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19 September 2012M.Friedl (HEPHY Vienna): Belle II SVD Readout2 Introduction Front-End Junction Box FADC DAQ Summary
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19 September 2012M.Friedl (HEPHY Vienna): Belle II SVD Readout3 Introduction Front-End Junction Box FADC DAQ Summary
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KEKB and Belle @ KEK (1999-2010) Center of mass energy: Y(4S) (10.58 GeV) High intensity beams (1.6 A & 1.3 A) Integrated luminosity of 1 ab -1 recorded in total Belle mentioned explicitly in 2008 Physics Nobel Prize announcement to Kobayashi and Masukawa Linac Belle KEKB ~1 km in diameter KEKB Belle Linac About 60km northeast of Tokyo Asymmetric machine: 8 GeV e - on 3.5 GeV e + 19 September 2012M.Friedl (HEPHY Vienna): Belle II SVD Readout4
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µ / K L detection 14/15 lyr. RPC+Fe CsI(Tl) 16 X 0 Si vertex detector 4 layers DSSD SC solenoid 1.5 T 8 GeV e - 3.5 GeV e + Aerogel Cherenkov counter n=1.015~1.030 Central Drift Chamber small cell +He/C 2 H 5 TOF counter Belle Detector (1999–2010) 19 September 2012M.Friedl (HEPHY Vienna): Belle II SVD Readout5
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SuperKEKB/Belle II Upgrade: 2010–2015 Aim: super-high luminosity ~8 10 35 cm -2 s -1 1 10 10 BB / year LoI published in 2004; TDR published in 2010 Refurbishment of accelerator and detector required nano-beams with cross-sections of ~10 µm x 60 nm 10 mm radius beam pipe at interaction region 19 September 2012M.Friedl (HEPHY Vienna): Belle II SVD Readout6 http://belle2.kek.jp
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Previous SVD Layout (until 2010) 4 straight layers of 4" double-sided silicon detectors (DSSDs) Outer radius of r~8.8 cm Up to three 4” sensors are daisy-chained and read out by one hybrid located outside of acceptance region (VA1 chip) 19 September 2012M.Friedl (HEPHY Vienna): Belle II SVD Readout7
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Belle Silicon Vertex Detector (SVD) Current SVD is not suitable for Belle II 19 September 2012M.Friedl (HEPHY Vienna): Belle II SVD Readout8 10% Previous SVD limitations were occupancy (~10% in innermost layer) need faster shaping dead time (~3%) need faster readout and pipeline Belle II needs detector with high background tolerance pipelined readout robust tracking low material budget in active volume
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New Layout for Belle II SVD (2015-) New double-layer pixel detector using DEPFET technology Four layers with 6” double-sided strip detectors and forward part Optimized for precision vertex reconstruction of the decays of short-lived B-mesons Two layers of DEPFET pixels 4 layers of double- sided strip sensors 19 September 2012M.Friedl (HEPHY Vienna): Belle II SVD Readout9
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19 September 2012M.Friedl (HEPHY Vienna): Belle II SVD Readout10 APV25 chips Cooling pipe Origami ladder Sensor underneath flex circuit Pitch adapter bent around sensor edge End ring (support)
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Readout Chain Overview Analog APV25 readout is through copper cable to FADCs Junction box provides LV to front-end 19 September 2012M.Friedl (HEPHY Vienna): Belle II SVD Readout11 1748 APV25 chips Front-end hybrids Rad-hard DC/DC converters Analog level translation, data sparsification and hit time reconstruction Unified Belle II DAQ system ~2m copper cable Junction box ~10m copper cable FADC Unified optical data link (>20m) Finesse Transmitter Board (FTB) COPPER
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Not Entirely New… 2007: plans for an intermediate upgrade of Belle I SVD Prototype system built and tested thoroughly in several beam tests since then Now enlarging and improving details, but concept is same See reports at previous TWEPPs for details & performance 19 September 2012M.Friedl (HEPHY Vienna): Belle II SVD Readout12
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19 September 2012M.Friedl (HEPHY Vienna): Belle II SVD Readout13 Introduction Front-End Junction Box FADC DAQ Summary
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APV25 Readout Chip Developed for CMS (LHC) by IC London and RAL (70k chips installed) 0.25 µm CMOS process (>100 MRad tolerant) 40 MHz clock (adjustable), 128 channels 192 cell analog pipeline no dead time 50 ns shaping time low occupancy Noise: 250 e + 36 e/pF must minimize capacitive load!!! Multi-peak mode (read out several samples along shaping curve) Thinning to 100µm successful Schematics of one channel 19 September 2012M.Friedl (HEPHY Vienna): Belle II SVD Readout14
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Front-End Hybrids 2 variants Standard PCBs outside acceptance for the edge sensors “Origami” chip-on-sensor concept for inner sensors 19 September 2012M.Friedl (HEPHY Vienna): Belle II SVD Readout15 See presentation by C. Irmler today at 14:50 Martin Wood Lecture Theater
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19 September 2012M.Friedl (HEPHY Vienna): Belle II SVD Readout16 Introduction Front-End Junction Box FADC DAQ Summary
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Junction Box: Mother Board Junction box board with CERN DC/DC converters to be placed in SVD DOCK boxes Converter boards now have a commercial chip, to be replaced by the rad-hard AMIS5 chip 19 September 2012M.Friedl (HEPHY Vienna): Belle II SVD Readout17
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DC/DC Converter: Noise Comparison Same noise within measurement precision (few %) between conventional and DC/DC powering! 19 September 2012M.Friedl (HEPHY Vienna): Belle II SVD Readout18 Test hybrid (larger) Belle II design (smaller)
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Junction Box: Draft Design (Top lid not shown) As in Belle 1 SVD: Located ~2m from front-end (outside acceptance) = radiation zone Mostly aluminum, only bottom plate copper (to be cooled) 19 September 2012M.Friedl (HEPHY Vienna): Belle II SVD Readout19
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19 September 2012M.Friedl (HEPHY Vienna): Belle II SVD Readout20 Introduction Front-End Junction Box FADC DAQ Summary
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Readout Electronics: Scheme 19 September 2012M.Friedl (HEPHY Vienna): Belle II SVD Readout21 No direct connection between power supplies and FADC Bias currents are measured remotely by FADC
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FADC Block Diagram Analog & digital level translation between bias and GND Digitization, signal conditioning (FIR filter), data processing Central FPGA is an Altera Stratix IV GX 19 September 2012M.Friedl (HEPHY Vienna): Belle II SVD Readout22
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FADC: Overall Concept Similar to Belle 1 SVD FADC, but with twice higher density (48 APV25 inputs) and more powerful FPGA 19 September 2012M.Friedl (HEPHY Vienna): Belle II SVD Readout23
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FADC: Level Translation Daughter Boards Analog board: existing design, but simplified Digital board: completely new design based on digital isolator ICs (Analog Devices) No floating LV power needed for either board! 19 September 2012M.Friedl (HEPHY Vienna): Belle II SVD Readout24
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FADC: Level Translation Tests 19 September 2012M.Friedl (HEPHY Vienna): Belle II SVD Readout25 Both boards tested thoroughly, working perfectly fine Short (2m) and long (12m) cable to FADC 100V between floating and GND sides No damage with repeated instantaneous shorting of HV APVDAQ Repeater Ana+Digi daughter boards on adapter board APV25 Hybrid
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19 September 2012M.Friedl (HEPHY Vienna): Belle II SVD Readout26 Introduction Front-End Junction Box FADC DAQ Summary
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Finesse Transmitter Board (FTB) Sends FADC data through optical link to COPPER Pixel system (for online data reduction) Firmware in development 12 November 2011Markus Friedl (HEPHY Vienna): Status of SVD27
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COPPER = Common Readout Platform Standardized 9U VME crate with CPU and network interface 4 slots for FINESSE daughter boards (ADC, TDC, …) according to subsystem needs In case of SVD: Belle2Link (Optical receiver) 19 September 2012M.Friedl (HEPHY Vienna): Belle II SVD Readout28
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19 September 2012M.Friedl (HEPHY Vienna): Belle II SVD Readout29 Introduction Front-End Junction Box FADC DAQ Summary
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Overall Readout System Scheme DAQ: PC Farm COPPER: common readout platform FADC system with optical link to COPPER DOCK box with DC/DC Front-End 19 September 2012M.Friedl (HEPHY Vienna): Belle II SVD Readout30
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Summary & Outlook Belle I Belle II Needs completely new vertex detector (pixel + strips) Readout Chain Based on a 2007 design (for an earlier update option) “Origami” chip-on-sensor concept for front-end with APV25 Junction box near front-end with rad-hard DC/DC converters No noise penalty from switching power FADC with powerful FPGA for online signal processing Level translation daughter boards – working fine DAQ link to common readout platform Will report on performance at next TWEPP 19 September 2012M.Friedl (HEPHY Vienna): Belle II SVD Readout31
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