1. © 2013 Toshiba Corporation Toshiba Electron Tubes & Devices Co., Ltd. November, 2013 Scope of Disclosure Owner Comparison of fabrication techniques in TTF3/STF2 couplers

2. © 2013 Toshiba Corporation 2 Contents 1.Introduction 2.Comparison between STF2 and TTF3 type couplers 3.Advantages of two types of coupler 4.Summary

3. © 2013 Toshiba Corporation 3 Introduction STF2 type Couplers TTF-III type Couplers TETD has plenty of experience with STF2 type coupler. TETD also has some experience in producing TTF3 type coupler. I’d like to share with you comparison between two types of coupler about manufacturing.

4. © 2013 Toshiba Corporation 4 Because TETD does not produce a rectangular wave guide and a door knob in STF2 couplers. Windows and Coaxial parts of STF2 type Coupler TTF-III type Coupler To compare Windows and Coaxial parts of TTF-III type Coupler What we will compare between two couplers Coaxial assemblies and Window assemblies

5. © 2013 Toshiba Corporation 5 * Excluding Waveguide, Capacitor, Adjusting mechanism and Support brackets Comparison table: TTF3, TTF3 by TETD, STF2 TTF-IIITTF-III TETD versionSTF2Remarks Warm Window Ceramic Cylindrical (with V-shaped groove) Disk Cold Window Ceramic Cylindrical (with V-shaped groove) Disk Ceramic Purity97.6% 95% Number of parts *373349 Brazing TypeVacuum Hydrogen EBW points *400 Number of Processes20 21 exclude final assembly and Inspection Brazing *61112 EB Welding200 TiG Welding522 TiN coating333 Copper Plating344 Vacuum Treatmentmore than 4some0 Materials * * SUS316LN/316L/ 304L/304 * SUS316L/304L/ 304 (no 316LN) Cu OFE

6. © 2013 Toshiba Corporation 6 Experience of TTF type coupler: Techniques of junctions Benefit by choosing brazing method Warm assembly The number of junction processes : 14 → 6 The number of parts : 25 → 21 Cold assembly The number of junction processes : 7 → 5 The number of parts : 12 → 12 For mass production TETD proposes simplification of parts shape and reduction of the number of junction processes and that of parts.

7. © 2013 Toshiba Corporation 7 All parts to be washed, Cleaned, then dried with dry air. H2 degas stainless steel in clean vacuum oven at 950 ℃ for 2 hours. (this step mat be done on raw material) Braze stainless parts together and single ring (I65 4D 1234) under vacuum at the same time. During assembly of parts, respect their angular orientation. Copper plating of external surfaces : 10±5μm : - no copper on contact surface of CF flange. - copper plating also on face of CF flange. Handle only with gloves. Bake the assembly for 2 hours at 400 ℃ in vacuum. 1. All junctions are brazed and single ring(I65 4D 1234) under vacuum at the same time. 2. The number of junction processes is reducible from five to one and that of parts is from eight to six. Experience of TTF type coupler: Techniques of junctions Example: Cold assemblies

8. © 2013 Toshiba Corporation 8 Proven and trusted structure by developing klystrons and couplers in KEK TTF-III type Couplers STF2 type Couplers Window ceramics: Disk or Cylindrical Metalized surface Double V-shaped groove Only so many ceramics makers can supply this structure.

9. © 2013 Toshiba Corporation 9 Summary 1.Advantage of brazing in mass production –To reduce joining and parts numbers –To make batch processing easy 2.Advantage of disk windows –Simple structure of metalized surface –Proven and trusted structure by developing klystrons and couplers in KEK –Easier to coat TiN