1. AN ANALYSIS OF POROUS MEDIA HEAT SINKS FOR NATURAL CONVECTION COOLED MICROELECTRONIC SYSTEMS.
Engineering Project by: Eric Savery
Main Advisor: Ernesto Gutierrez-Miravete
Final Report

2. Project Objectives
The Purpose of this was to determine effect porous material has when used as a heat sink in microelectronic devices. This includes determining the following:
Effect Porosity:
Effect of Permeability
Comparison Different Permeability/Porosity Combinations.
Comparison of Porous Material vs Non-porous Material Heat Sinks

3. Porous Material
Porosity: (ε) is also known as void fraction, is the measure of voids or spaces inside a material
Permeability: (κ) is the measure of the ability of a material to transmit fluid though itself

4. How does Porous Material Effect Heat Transfer
Flow through Porous Material
Heat Transfer through Porous Material

5. Models No Heat Sink Solid Block Heat Sink Porous Block Heat Sink Qout
Qin
Qout Tc
Qin
Qout Tc
Qin
Qout Tc
No Heat Sink
Solid Block Heat Sink
Porous Block Heat Sink

6. Model Results

7. Porosity

8. Permeability

9. Permeability Cont.

10. Volumetric Flow Rate (m^2/sec)
Results
Trial
Depth (mm)
Heat Flux (W/m)
Volumetric Flow Rate (m^2/sec)
No Heat Sink
1.513
0.0012
Solid Heat Sink 10
2.9278
0.001
Form
Porosity
Permeability
Total Heat Flux (W/m)
Volumetric Flow Rate (m^2/s) 1g
0.6767
1.00E-08
3.1406
0.0011 2b
0.1544
5.05E-07
0.0027 3d
0.3633
1.00E-06
0.0033