2. ksjp, 7/01 MEMS Design & Fab Foundry Services: MOSIS as a model MOSIS: MOS implementation service, ISI, 1980. UCB HP Stanford Startup X MIT users Mask maker Orbit 2um HP 0.5um Dicing and packaging vendors Chips Information $$$$$ MOSIS

3. ksjp, 7/01 MEMS Design & Fab Foundry Services and Standard Processes MCNC/MUMPS (now by Cronos) 3 level poly, no electronics started in 1992, now 6 runs per year LIGAMUMPS single level metal, no electronics Sandia 5 level poly, no electronics 1 level poly w/ quality CMOS CMOS + post-processing EDP, TMAH, XeF2 (Parameswaran) Plasma (Fedder)

4. ksjp, 7/01 MEMS Design & Fab MUMPS process flow

5. ksjp, 7/01 MEMS Design & Fab MUMPS process flow

6. ksjp, 7/01 MEMS Design & Fab MUMPS process flow

7. ksjp, 7/01 MEMS Design & Fab MUMPS process flow

8. ksjp, 7/01 MEMS Design & Fab MUMPS process flow

9. ksjp, 7/01 MEMS Design & Fab MicroOptical Bench (Ming Wu, UCLA)

10. ksjp, 7/01 MEMS Design & Fab MCNC/MUMPS layer thicknesses

11. ksjp, 7/01 MEMS Design & Fab Design “Rules” Guidelines for communication between fab people and design people Generally not enforced MUMPS, 2um CMOS: no HP sub-micron CMOS: yes Often desireable to violate MUMPS: process exploration, new devices, some previous design rule violations are now encouraged CMOS: Parameswaran, Fedder style MEMS depends on design rule violations

12. ksjp, 7/01 MEMS Design & Fab Typically due to lithographic resolution limits lithographic alignment repeatability etching capabilities Most important: Line/space due to lithography or etching varies from layer to layer varies near topography no guarantee of dimensions: the lines will exist and be distinct. Design Rules Line width... and spacing

13. ksjp, 7/01 MEMS Design & Fab Design Rules

14. ksjp, 7/01 MEMS Design & Fab MCNC/MUMPS Design Rules Rules for line/space on all mask layers.

15. ksjp, 7/01 MEMS Design & Fab MCNC/MUMPS Design Rules

16. ksjp, 7/01 MEMS Design & Fab MCNC/MUMPS Design Rules Examples for POLY2 from mems.mcnc.org/smumps/mrules

17. ksjp, 7/01 MEMS Design & Fab Breaking the Rules Sub-minimum lithography risky, but often successful, especially in planar areas Breaching nitride (substrate contacts and opens) Stack anchor1 and poly1-poly2-via don’t include poly1 include poly2 for electrical contact to substrate, or remove to expose bare substrate Double-thick poly continuous sheet of poly1 enclosed in poly1-poly2-via poly2 structures on top

18. ksjp, 7/01 MEMS Design & Fab MCNC/MUMPS access Cost is $3,500 per submission 1cm 2 die area per submission 15 identical dice returned (~$2/mm 2 ) Files are submitted by anonymous ftp Dicing, bonding, HF release are all available for additional cost Parameterized and static design cells are free online (CaMEL) Design services are available for additional cost

19. ksjp, 7/01 MEMS Design & Fab MCNC/MUMPS process specs Polys are compressive, nitride and metal (Cr/Au) are tensile.

20. ksjp, 7/01 MEMS Design & Fab MCNC/ LIGAMUMPS

21. ksjp, 7/01 MEMS Design & Fab MCNC/LIGAMUMPS Design Rules A, W, L must be greater than or equal to 20.0 microns. Photoresist aspect ratio, L/W, must be less than or equal to 10.