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6/1/2011 Team members: Duc Tran Tuan Ngo Giang Nguyen Peter Elabd Thien Nguyen The Duong Advisor:Dr. Mark Weislogel Capstone 2011 Mobile Environment Chamber
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Introduction Basic requirements Design and manufacturing Validation Proposals Conclusion
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A chamber that provides temperature controlled air to Solid State Drives (SSDs) while they are powered on and functionally tested.
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Chamber PC Controller Facility Chiller Actuator Solid State Drives Set T Temp. range: -5 o C to 65 o C Accuracy: ± 2 o C Temp. uniformity: ± 4 o C Transient:10 o C /minute Airflow: ≥0.5 m/s Capacity: 4-12 SSDs /chamber Mobility Mobile temp. control system
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Concept selection PROSCONS Temperature uniformitySpace constraint Condensation preventionNumber of SSDs Counter-flow air movement Manufacturing
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Detailed Temperature Control System
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Mechanical Model
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Electrical System RTD Alarm Valve Power Converter AC Power PC GUI Gateway/ Controller Control Board Heaters Fans
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Software GUI Intel® Modbus Service Modbus TCP/IP Profile loading Data logging Written in C# Data Package Processing Written in Python Industrial standard Communication over TCP/IP network
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Final Chamber
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Final System
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Temperature Uniformity Test results: Mean temp. difference: 0.64 o C Standard deviation: 0.39 o C Max: 1.6 o C Min: 0 o C Requirement: Temperature difference: within ± 4 o C
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Stability Requirements: Maximum range: ± 2 o C from set point) Maximum range: ± 1.6 o C Extreme Max TempExtreme Min Temp
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Ramp rate (transient) System: Average Ramp up: 17.5 o C/minute Average Ramp down: 10.7 o C/minute Requirement: Ramp rate : 10 o C/minute (up and down)
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Other Results & Requirements CriteriaChamberRequirements Mobility Weight/Density Ratio (lb/in) 20.6275 Dimensions (in)19x5x5 19" Form FactorYes CapacityNumber of SSD's64-12 Airflow Max (m/s)14.6NA Min (m/s)1.350.5
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Use heater with fins Proportional valve Proportional controller Manufacturing process: Stamping Capacity: larger chamber 19”x10”x10”
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Requirements have been achieved: Budget Mobility Mechanical Aspect Electrical Aspect Academic Achievement: Technical Design Process Teamwork Project Management Financial Management
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