1. Critical Design Review Patrick Weber, Dorin Blodgett, Michael Stephens, Heather Choi, Kevin Brown, Ben Lampe, Anne-Marie Suriano, Eric Robinson November 19, 2010 11/19/20101

2. 2 Mission Overview 1 2 3 4 5 6 11/19/2010 Presenter: Eric Robinson

3. Mission Overview Scientific Mission o Primary: Collect space dust. o Provide a perspective of what is in our upper atmosphere. o Particle size = nano and micro level o Donate collected aerogel tablets to UW Geology Department for further analysis o SEM photographs of particle trails – velocity analysis o Identify particles – material property analysis o Secondary: o Capture optical images/video of the Earth. o Measure thermal and seismic effects throughout the duration of the launch. o Collect data for future projects. 3 Presenter: Eric Robinson 11/19/2010

4. Mission Overview Engineering Mission o Engineer an extendable boom to mount a dust collector. o Use aerogel and acrylic tablets as dust collectors. o Aerogel Density = 95 kg/m 3 o Acrylic Density = 1200 kg/m 3 o Engineer a water shield to protect dust collector. o Engineer modular electronic systems for: o Capturing and storing images from optical devices. o Recording thermal and seismic data in real time throughout launch using sensors and transferring recording data via provided NASA Wallops Telemetry. 4 Presenter: Eric Robinson 11/19/2010

5. Mission Overview Organizational Chart 5 Presenter: Eric Robinson Project Manager Shawn Carroll Team Leader Patrick Weber Physics Faculty Advisor Dr. Paul Johnson Engineering Faculty Advisor Dr. Carl Frick Integrated Sensors (IS) Michael Stephens Heather Choi Electrical Power System (EPS) Michael Stephens Ben Lampe Telescopic Boom (TB) Patrick Weber Eric Robinson Dorin Blodgett Optical Camera (OC) Kevin Brown Nick Roder Charles Galey 11/19/2010

6. Mission Overview Theory and Concepts o Underlying Science and Theory o Attempt to capture space particles using telescoping boom, aerogel, and acrylic discs. o Quantification of varying flight parameters. 6 Presenter: Eric Robinson 11/19/2010

7. Mission Overview Theory and Concepts o Previous Experimentation o Previous flights have included multi-sensor packages. o Temperature, Humidity, and Pressure Sensors o Accelerometers / Seismic Sensors o Magnetometers o Data Storage (SD Cards) o Results provided a basis for improvement on future data collection and retrieval. o SD Cards impervious to low exposure to salt water o Payload electrical orientation 7 Presenter: Eric Robinson 11/19/2010

8. Mission Overview Concept of Operations 8 Presenter: Eric Robinson t ≈ 0 min Launch Systems Power On (t = -2 min) -Collection of Sensor Data Begins t ≈ 0.7 min End of Orion Burn t ≈ 1.7 min Shedding of Skin Boom Extends via First Timed Event t ≈ 2.8 min Apogee t ≈ 4.0 min Boom Retracts via Arduino Controller Boom Power Shut Down t ≈ 8.2 min Chute Deploys t ≈ 15 min Splash Down Payload Power Down 11/19/2010

9. Mission Overview Expected Results o Successfully collect space dust o Space Dust Composition (10 -6 ) o Exhausted Rocket Fuel o Meteor / Metal Fragments o Other Miscellaneous Gases o Detailed data throughout flight duration o Thermal Data o Seismic/Vibration Data o Earth images/video 9 Presenter: Eric Robinson 11/19/2010

10. 10 Design Description 1 2 3 4 5 6 11/19/2010 Presenter: Eric Robinson

11. Design Description Design Changes Since PDR o Payload water shield has been removed o Complex manufacturability o Electrical components do not need to be salvaged o New Telescopic Boom Control Mechanism o Steel tape reel design (akin to a tape measure) o New high torque gear box DC motor instead of stepper motor o Mission Objective Changes o Pressure sensors have been removed from secondary objective 11 Presenter: Eric Robinson 11/19/2010

12. Design Description De-Scopes and Off-Ramps o De-Scopes o No mission objectives have been removed o All objectives are still considered feasible o Off-Ramps o We do not believe we will run into schedule/budget constraints that would require a contingency. 11/1/201012 Presenter: Eric Robinson

13. Design Description Subsystem Overview 11/1/201013 Presenter: Eric Robinson MCU Arm Control Temp. Sensor Optical Camera PWR Wallops Telemetry Wallops EPS EPS/STR Interface OC/STR Interface TB/STR Interface TB/EPS Interface OC/EPS Interface STR TB OC Boom Aerogel Motor Boom IS IS/EPS Interface IS/STR Interface Temperature Sensor Accelerometers Optical Camera Accel. Sensor Control Box

14. Design Description Mechanical Design Elements 11/1/201014 Presenter: Eric Robinson

15. Design Description Mechanical Design Elements 11/1/201015 Presenter: Eric Robinson

16. Design Description Mechanical Design Elements 11/1/201016 Presenter: Eric Robinson o Retracted – 11 in boom o Extended – ~19 in boom – ~12 in reach

17. Design Description Electrical System : Components o Arduino Controller o 5M Digital Camera o 16 Mbit data flash o 100:1 Metal gear motor o 250 G Accelerometer 11/1/201017 Presenter: Michael Stephens o 16G 2-Axis Accelerometer o Temperature Sensors o Motor Driver o Encoders o Power Regulators

18. Design Description Electrical System : Arduino o Atmega 328 @ 16 MHz o 32Kb of Program Storage o 2KB of Ram o Digital Pins : 14 o 6 PWM o Analog Pins : 6 o 10 Bit o 10 KHz sample time o Provide control over payload 11/1/201018 Presenter: Michael Stephens

19. Design Description Electrical System : XY Accel. o 2 axis ± 18G o 36 / (2^10) = 0.03515625 G Resolution @ 10 bit o 5V @ 350 µA o 50 Hz cut off filter o Used last year as well o Provide acceleration in the non extreme XY axis. 11/1/201019 Presenter: Michael Stephens

20. Design Description Electrical System : Z Accel. o 1 axis ± 250 G o 500 / (2^10) = 0.48828125 G resolution @ 10 bit o 5V @ 1.5 mA o 400 Hz cutoff filter o Provide acceleration data in the extreme Z (up) axis 11/1/201020 Presenter: Michael Stephens

21. Design Description Electrical System : Motor o 100:1 gear ratio o 140rpm @ 6V o 6V @ 90mA o 800mA stall current @ 6V o 0.9375 in-lb motor torque @ 6V o Provide winding action of tape. 11/1/201021 Presenter: Michael Stephens

22. Design Description Electrical System : Motor Driver o 3 wire interface (In1, In2, PWM) o 1.2 A max @ 15 V 11/1/201022 Presenter: Michael Stephens

23. Design Description Electrical System : Temp. Sensor o TMP36 o -50C to 125C = 175C range o 175 / (2^10) = 0.170898438 degree resolution @ 10 bits o SLOW (300s for full range change) o 5V @.5uA 11/1/201023 Presenter: Michael Stephens

24. Design Description Electrical System : Optics DVR 623V 5M DSC/DV module o 5.1 megapixel o Internal shutter trigger o SD Data up to 4GB o 5V @ ? mA o Provide photos/video of flight 11/1/201024 Presenter: Michael Stephens

25. Design Description Electrical System : Flash Storage o 16 Mbit (2MB) o 3.3V @ 7 mA o 36 Kbytes/second write time o SPI Interface (4 digital pins) 11/1/201025 Presenter: Michael Stephens

26. Design Description Electrical System : Storage o Used for redundant storage of acceleration data o Maximum sensor sampling time 400 Hz o 3 x 10 bit = 30 bits ~ 4 bytes o (((16 000 000 / 8) / 4) / 400) / 60 = 20.8333333 minutes of recording time. 11/1/201026 Presenter: Michael Stephens

27. Design Description Electrical System : Power o 12 V regulators o 6V regulators o 780X series max input voltage 35 volts. 11/1/201027 Presenter: Michael Stephens

28. Design Description Electrical System : Encoder o Digital light sensor o 2 Wires (1 enable, 1 output) o 5V @ 25 mA o Used to sense black and white pattern on spool. o Used to detect stalls o Used to verify extension 11/1/201028 Presenter: Michael Stephens

29. Design Description Electrical System : Telem. IF 11/1/201029 Presenter: Michael Stephens

30. Design Description Electrical System : Power IF 11/1/201030 Presenter: Michael Stephens

31. Design Description Software Design Elements 11/1/201031 o Programmed on Arduino in “C” o Heavy use of interrupts Presenter: Michael Stephens

32. Design Description Software Design Elements 11/1/201032 Presenter: Michael Stephens

33. 33 Prototyping/ Analysis 1 2 3 4 5 6 11/19/2010 Presenter: Patrick Weber

34. Analysis Results o Telescopic Boom o Finite Element Analysis o Deflections, stress, and strain o Newtonian Laws o Payload Frame o Finite Element Analysis o Deflections, stress, and strain 11/1/201034 Presenter: Patrick Weber

35. Analysis Results Telescopic Boom - Stress Key Results o Stress o Peak von Mises o 11 MPa at truss convergence point Loading of 100G 11/1/201035 Presenter: Patrick Weber

36. Analysis Results Telescopic Boom – Deflection Key Results o Deflection o 6061 Aluminum o 1.12E -2 mm at o center of boom. o 1023 Carbon Steel o 1.099E -2 mm at o center of boom. Loading of 100G 11/1/201036 Presenter: Patrick Weber

37. Analysis Results Telescopic Boom – FOS Key Results o Factor of Safety o 6061 Aluminum o Min - 24.59 o 1023 Carbon Steel o Min – 8.59 Loading of 100G 11/1/201037 Presenter: Patrick Weber

38. Analysis Results Material Decision o Material Strength o Results showed that both materials could handle the loadings with minimal deflection o Material density o Aluminum 6061 o ρ = 0.0975 lb/cu.in. o 1023 Carbon Steel o ρ = 0.284 lb/cu.in. o Therefore 6061 Aluminum Alloy will be the chosen as the material for our mechanical components. 11/1/201038 Presenter: Patrick Weber

39. Analysis Results Material Decision o Aerogel Design o Results from aerogel studies have proven that an Aerogel Density of 95 kg/m 3 will be sufficient in capturing the micro-scaled particles. [1] o [1] – Horz, Friedrich, Mark J. Cintala, Thomas H. See, and Keiko Nakamura-Messenger. "Penetration Tracks in Aerogel. Produced by Al2O3 Spheres." Meteoritics & Planetary Science. 11/1/201039 Presenter: Patrick Weber

40. Prototyping Results o Most prototyping is theoretical and conducted using SolidWorks. o Further prototyping and testing will occur once the parts are manufactured and assembled. o Late January/Early February 11/1/201040 Presenter: Patrick Weber

41. Detailed Mass Budget o Total Mass Budget (15±0.5 lbs) o Structure (5.95 lbs) o Boom (5.05 lbs) o Circuit Trays (0.9 lbs) o Camera (0.25 lb) o Other Sensors (1 lb) o Modular Electrical System (1 lb) o Ballasting (~6.80 lbs) 41 Presenter: Patrick Weber 11/19/2010

42. Detailed Power Budget 42 Presenter: Michael Stephens 11/19/2010 o Redundant Power (2,3) @ T0 launch (17%) o Event Power (4) @ T+5 shield ejection (80%) SourceConsumption (in Amps) Arduino0.02 Encoder0.025 Camera0.1 Temp Sensors0.0000015 XY Acc0.000335 Z Acc0.0015 Motor Driver0.025 Total0.1718365 SourceConsumption (in Amps) Motor0.8 Total0.8

43. Wallops Interfacing: Power 11/1/201043 Presenter: Michael Stephens Power Connector--Customer Side PinFunction 1NC 2 Controller redundant power @ T0 3 4 Motor power @ T+5 after shield ejection 5Common Ground 6 7 8 9NC 10NC 11NC 12Common Ground 13Common Ground 14Common Ground 15Common Ground

44. Wallops Interfacing: Telemetry 11/1/201044 Presenter: Michael Stephens Telemetry Connector--Customer Side PinFunctionPinFunction 1 TMP120 NC 2 TMP221 NC 3 TMP322 NC 4 X Accelerometers23 NC 5 Y Accelerometers24 NC 6 Z Accelerometers25 NC 7 26 NC 8 27 NC 9 28 NC 10 NC29 NC 11 NC30 NC 12 NC31 NC 13 NC32 TX send temp data as well as status @19200 Baud 14 NC33 TX GNG tied to common ground 15 NC34 NC 16 NC35 NC 17 NC36 NC 18 NC37 NC 19

45. 45 Manufacturing Plan 1 2 3 4 5 6 11/19/2010 Presenter: Patrick Weber

46. Manufacturing Plan Mechanical Elements o Payload Frame – 6061 Aluminum Alloy o Machined o Bolted together o Telescopic Boom – Precision DOM Aluminum Tubing o Boom Housing o Tubing with Epoxied Flange o Intermediate Arm o Epoxied Rail o Aerogel Arm o CNC machined from Aluminum Barstock o Aerogel Purchased o Parts submitted for machining by Tuesday, November 23 rd 11/1/201046 Presenter: Patrick Weber

47. Manufacturing Plan Electrical Elements o Electrical Power System o Arduino Board o Integrated Sensors o Purchase o All wires will be soldered o All wires and boards will be epoxied to acrylic mounting plates. o Acrylic will comply with no-voltage requirement. o Parts ordered by Wednesday, December 1 st. 11/1/201047 Presenter: Michael Stephens

48. Manufacturing Plan Software Elements o Software will be developed next semester starting mid- January 2011. o Software will be developed in modules and integrated as a whole as they become functional. Software developed in Arduino “C” language. 11/1/201048 Presenter: Patrick Weber

49. 49 Testing Plan 1 2 3 4 5 6 11/19/2010 Presenter: Patrick Weber

50. Testing Plan System Level Testing o Full mission simulation testing using physical model. o Vibration testing at the University as well as Wallops. o Boom extension/retraction test using electronics and mechanical models. o Payload drop testing o Thermal Expansion testing 11/1/201050 Presenter: Patrick Weber

51. Testing Plan Mechanical Testing o Prove mechanical functionality on ground o Boom tests o Cyclic Extension/Retraction Tests o Friction Tests o Bending/Binding Tests o Tape Reel Buckling Strength Tests o Thermal Expansion Tests o Water sealant testing o Pool submersion test on canister o Drop impact test on canister sealing o Testing will be performed as models and utilities become available. 11/1/201051 Presenter: Patrick Weber

52. Testing Plan Electrical Testing o Temperature sensor testing o Measure sensors 24 hours a day and correlate with other temperatures measurements. o Place sensor unit in oven until reading stabilizes. Remove sensor and place outside at night until reading stabilizes. Do this multiple times to determine time delay. o Hot / Cold system test o Place entire system in oven, place outside. Examine for solder disconnects. o Accelerometer testing o Use elevators and cars to verify acceleration readings. 11/1/201052 Presenter: Michael Stephens

53. Testing Plan Software Testing o Asynchronous data capture test o Run Sine wave into ADC. Verify consistent timing. o Motor control test o Extend boom o Retract boom o Verify extension and retraction and analyze fault conditions o Integration testing o Use sine wave generators as sensor inputs o Run simulated mission to detect possible data anomalies / control anomalies. o Multiple day in the life (DITL) tests on ground. o Simulate entire mission with actual sensors. 11/1/201053 Presenter: Michael Stephens

54. 54 Risks 1 2 3 4 5 6 11/19/2010 Presenter: Patrick Weber

55. Risk Walk-Down o Risk Matrix / Mitigation o STR/TB.RSK.1: Canister seals fail at splashdown and aerogel is saturated with water. o TB.RSK.2: Boom jams when skins are shed. Boom fails to open and mission objectives are not met. o IS.RSK.1: Telemetry or flash memory fail and data to be collected for next year’s team is lost. Secondary mission objectives are not met. o EPS.RSK.1: Should the NASA telemetry or Timed Event circuits fail, the boom may prematurely extend causing failure of the UW payload as well as possible damage to the rocket. 55 Presenter: Patrick Weber Consequence EPS.RSK.1 STR/TB.RSK.1 TB.RSK.2 IS.RSK.1 Possibility 11/19/2010

56. 56 User Guide Compliance 1 2 3 4 5 6 11/19/2010 Presenter: Patrick Weber

57. User Guide Compliance 5711/19/2010 RequirementStatus/Reason (if needed) Center of gravity in 1" plane of plate? Unsure Max Height < 12" In compliance Within Keep-Out In compliance Using < 10 A/D Lines In compliance Using/Understand Parallel Line In compliance Using/Understand Asynchronous Line 19200 Baud Using X GSE Line(s) Not at this time Using X Redundant Power Lines 1 Using X Non-Redundant Power Lines 1 Using < 1 Ah 0.152Ah total (all lines) Using <= 28 V 3.3V - 12V Presenter: Patrick Weber

58. Sharing Logistics o Who are we sharing with? – We don’t know. o University of Northern Colorado o Re-entry Experiment Sat: Recover a reusable deployable, attempt to dynamically control the descent of the payload, and gather data during the return trip. o The possibility of a communication system between the AstroX payload and the UNC Re-entry Experiment Sat payload is being considered. o Plan for collaboration? o Email, phone, road-trips to Greeley and Boulder o Communication with Max Woods on a weekly basis. o Grant UNC access to the AstroX private website. 5811/19/2010 Presenter: Patrick Weber

59. 59 Project Management Plan 1 2 3 4 5 6 11/19/2010 Presenter: Patrick Weber

60. Mechanical Schedule o Major Mechanical Milestones: o Design Freeze at CDR (Friday, November 19, 2010) o Blueprints submitted for manufacturing on Nov. 23 o Mechanical prototype constructed mid-January, 2011 o Mechanical prototype fully tested by end of January, 2011 o Impact and submersion testing o Aerogel testing 60 Presenter: Patrick Weber 11/19/2010

61. Electrical Schedule o Major Electrical Milestones: o Electrical Schematics completed by CDR o Components ordered by December 1 o Electrical assembly and testing done by Mid February o Control function test o Telemetry and flash memory output test o Fully functioning payload by end of February 61 Presenter: Patrick Weber 11/19/2010

62. Monetary Budget o Monetary Budget (~$1200) o Structure ($600) o Boom ($300) o Aerogel ($300) o Camera ($100) o Other Sensors ($110) o Modular Electrical System ($200) o Correcting Factor (+$20%) 62 Presenter: Patrick Weber 11/19/2010

63. Work Breakdown Structure 63 Presenter: Patrick Weber Integrated Sensors (IS) Electrical Power System (EPS) Telescopic Boom (TB) Optical Camera (OC) Design Freeze at CDR Submit Work Request Manufacture Boom Parts Assemble Boom and Structure Design Freeze at CDR Order Parts by End of Fall Semester Build Circuits Program Microcontrollers Test Systems Integrate with Boom Design Freeze at CDR Order Parts by End of Fall Semester Build Circuits Program Microcontrollers Test Systems Test functionality of camera If functional: Integrate with Electrical Power System and Integrated Sensors If non-functional: Order another camera 11/19/2010

64. 64 Conclusions 1 2 3 4 5 6 11/19/2010 Presenter: Patrick Weber

65. Mission Overview Scientific Mission o Primary: Collect space dust. o Provide a perspective of what is in our upper atmosphere. o Particle size = nano and micro level o Donate collected aerogel tablets to UW Geology Department for further analysis o SEM photographs of particle trails – velocity analysis o Identify particles – material property analysis o Secondary: o Capture optical images/video of the Earth. o Measure thermal and seismic effects throughout the duration of the launch. o Collect data for future projects. 65 Presenter: Eric Robinson 11/19/2010

66. Mission Overview Engineering Mission o Engineer an extendable boom to mount a dust collector. o Use aerogel and acrylic tablets as dust collectors. o Aerogel Density = 95 kg/m 3 o Acrylic Density = 1200 kg/m 3 o Engineer a water shield to protect dust collector. o Engineer modular electronic systems for: o Capturing and storing images from optical devices. o Recording thermal and seismic data in real time throughout launch using sensors and transferring recording data via provided NASA Wallops Telemetry. 66 Presenter: Eric Robinson 11/19/2010

67. Questions?