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Mobile Environment Chamber End of Term Progress Report Team members: Tuan Ngo ( presenter 1) Giang Nguyen (presenter 2) Duc Tran Peter Elabd Thien Nguyen The Duong Advisor: Dr. Mark Weislogel
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Chamber PC Controller Facility Actuator Solid State Drives Set T Basic requirements Temp. range: -5 o C to 105 o C Accuracy: ± 2 o C Temp. uniformity: ± 4 o C throughout the chamber Transient:10 o C /minute Airflow: 0.5 m/s minimum across DUT Versatile A chamber that provide temperature controlled air to SSDs while SSDs are powered on and functionally tested
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Problem Identification Requirements External search Concept Generation Concept Evaluation and Selection Detailed Design We are here Proposal PDS
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Summary of external/ internal search and final concept selection
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External / Internal Search Layout design Sub-component selection
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Layout Design Sub-component Selection Technical issues to address: Heating/cooling method Temperature uniformity Air flow requirement Water condensation
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Electrical Components Layout Design Sub-component Selection Controller Chiller Heater/ heat exchanger Fan Insulators
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Fundamental Design PROSCONS CompactTemperature uniformity Counter-flow air movementCondensation risk Capacity
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Low Risk Design PROSCONS Thermal UniformityMobility Condensation PreventionManufacturability Cost
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Improved Design PROSCONS Temperature uniformityMobility Condensation prevention Counter-flow air movement
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Concept scoring matrix Weight Fundamental designLow-Risk designImproved design Cost 3 9912 Performance 5 Temperature uniformity 2 448 Condensation prevention 1 254 Capacity 2 488 Mobility 2 1066 Total10293238
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Chamber as part of testing system
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Main components Controller: Watlow PM3 digital PID controller -Recommended by Intel. -Optimized for thermal control
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Main components Valve: - Regulating flow: Globe valve - Electric control valve
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Main components Heating element: Strip heater -Less space required -Low cost
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Main components Sensor: Resistance Temperature Detector (RTD) -Fast response time -Reliable -Accurate
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Main components Fan: - Flow rate at least 0.5 m/s across SSDs -Higher flow rate, higher thermal uniformity but higher cost. -Must sustain Temp. up to 105 o C
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Main components Heat exchanger: Cooling coil Need analysis on: - Material - Dimensions: length, wall thickness - Fins or no fins
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Main components Insulation: Preferred characteristics: -High thermal resistivity. -Low cost. -Light weight. -Safe: fire-proof.
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More analysis and research required. Any decisions now could be changed based on further analysis and updated PDS. Biggest potential risk: availability of parts. Next step: start parametric design in Spring term.
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