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1 Electrical and Computer Engineering Cameron Proctor Ramsey Khudairi Thomas Gilbert Chad Young MDR Presentation TekBand.

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Presentation on theme: "1 Electrical and Computer Engineering Cameron Proctor Ramsey Khudairi Thomas Gilbert Chad Young MDR Presentation TekBand."— Presentation transcript:

1 1 Electrical and Computer Engineering Cameron Proctor Ramsey Khudairi Thomas Gilbert Chad Young MDR Presentation TekBand

2 2 Electrical and Computer Engineering Overview  MDR Goals and PDR Concerns  Development Approach  System Overview  Component Implementations  CDR Goals and Final Demo  Questions

3 3 Electrical and Computer Engineering The TekBand  Bluetooth enabled wristband  Alerts wearer when receiving a phone call Vibration LED display  Wireless storage

4 4 Electrical and Computer Engineering MDR Goals & PDR Concerns MDR Goals:  Read/write between MicroSD and microcontroller  Select and test battery  Create and test sample band with clasp  Pair with Bluetooth module Pair and send information to both cell phone and PC PDR Concerns:  Power constraints  Transmitting data via Bluetooth  Communicating with MicroSD card

5 5 Electrical and Computer Engineering Development Approach  Team roles Division of work Assisted each other when stuck and worked together  Met together regularly Discussed, analyzed and resolved any problems  High level of communication Email Dropbox Portable computers

6 6 Electrical and Computer Engineering System Overview

7 7 Electrical and Computer Engineering The Band  Selected silicone-rubber & neodymium magnets 1:1 ratio Used to make mold and band Strongest available magnets  Design Tasks Make mold and test band Test strength of material Test clasp

8 8 Electrical and Computer Engineering Casting Mold and Band  Mold Poured silicone-rubber around wooden “band”  Band Applied rubber-to-rubber release to mold Mixed and poured rubber in mold  Magnetic clasp Weak Waiting on larger magnets

9 9 Electrical and Computer Engineering Stress Testing  Instron Machine Stretches material Measures force and displacement  Stress = Force/Area Material constant Cross-section: 5mm x 13mm Max stress: 0.43 Mpa Can handle 6.4 lbs. force Bigger band can handle more force  Hardware failure first

10 10 Electrical and Computer Engineering Analysis of Results

11 11 Electrical and Computer Engineering Bluetooth - Profiles  Serial Port Profile Created to replace RS-232 Transmits and receives data via UART Most Bluetooth modules support it  Hands-free Profile Most modern phones have it We were able to display caller ID information onto our computer

12 12 Electrical and Computer Engineering Our Bluetooth Module  We Selected the KC-21 UART SPI port High Speed of 3Mbps  Currently has the Serial Port Profile Makes communication for wireless storage easy  We are able to power and pair with the module

13 13 Electrical and Computer Engineering Transmitting data via Bluetooth **WILL BE ADDED**

14 14 Electrical and Computer Engineering Microcontrollers  We Selected the PIC16F1827 (Microchip) UART 2 SPI ports Low power  Design Tasks Design PCB Demo Board Solder fine pitch component Program Microcontroller to verify PCB Read and Write to MicroSD

15 15 Electrical and Computer Engineering PCB Demo Board Design  Need to access pins, yet too small to solder to directly Breakout General I/O Pins Breakout SPI and UART Pins Provide connection for Programming  Designed using PCB Artist, ordered through Advanced Circuits  Challenge: Hand soldering fine pitch (8 mils) 28 pin UQFN package

16 16 Electrical and Computer Engineering Programming the Microcontroller  Initial Goal: Verify circuitry Solution: simple program programm that blinks an LED Verifies that programming circuitry is correct Verifies I/O breakouts are correct Blinking frequency verifies internal oscillator /* Blink LED connected to RA0 */ //PORTA = 0x00; bits_off(PORTA, 0b00000001); __delay_ms(500); //PORTA = 0x01; bits_on(PORTA, 0b00000001); __delay_ms(500);

17 17 Electrical and Computer Engineering Programming the Micro controller (Cont.)  With PCB verified, the goal is to read and write to the MicroSD  MicroSD Read and Write Overview All read and write operations done in 512 byte blocks as per SD spec. First send read or write command to the MicroSD Then transmit the block address for the SD memory Finally send or receive 512 bytes of data  Byte transmission is handled via the SPI

18 18 Electrical and Computer Engineering Demo Program  Goal: Demonstrate reading and writing capability with MicroSD card  Write a number sequence to the MicroSD card Store 0, 1, 2, 3, …, 15 on the MicroSD  Access the correct memory location, read number sequence and store in an array Array now contains what was read from the card  Display contents of array sequentially in binary using 4 LEDs connected to the general purpose IO

19 19 Electrical and Computer Engineering CDR Goals & Demo Day CDR Goals:  All components fully functional (outside of band)  Completed prototype of band including clasp and display design Demo Day:  One fully functional wristband: Can store data from PC to band via Bluetooth Will vibrate and light up specific LED when receiving a phone call

20 20 Electrical and Computer Engineering Questions?


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