1. Mobile Environment Chamber Internal/External Search Team members: Duc Tran Tuan Ngo Giang Nguyen Peter Elab Thien Nguyen The Duong Advisor: Dr. Mark Weislogel

2. Problem Identification Needs Assessment Objective Requirements Concept Generation Concept Evaluation Proposal PDS We are here!

3. Chamber PC Controller Facility Actuator Solid State Drives Set T Requirements Temp. range: -5 o C  105 o C Accuracy: ± 2 o C Temp. uniformity: ± 4 o C throughout the chamber Ramp rate:10 o C /minute Airflow: 0.5 to 5 m/s across DUT

4. Literature/Patent Search  Disk Drive Test Chamber  Socket for Disk Drive Tester  Efficient Air Flow Chamber  De-humidification

5. Literature/Patent Search  Disk Drive Test Chamber U.S. Patent No. 5,851,143  Socket for Disk Drive Tester  Efficient Air Flow Chamber  De-humidification

6. Literature/Patent Search  Disk Drive Test Chamber  Socket for Disk Drive Tester  Efficient Air Flow Chamber  De-humidification U.S. Patent 6,124,707 (Samsung) U.S. Patent 6,806,700 (Pemstar)

7. Literature/Patent Search  Disk Drive Test Chamber  Socket for Disk Drive Tester  Efficient Air Flow Chamber U.S. Patent No. 7,111,211  De-humidification

8. Literature/Patent Search  Disk Drive Test Chamber  Socket for Disk Drive Tester  Efficient Air Flow Chamber  De-humidification  Compressed dry air  Condensation (from air stream)

9. SystemsEnvironment chambers Burn-in chambers Desktop testers Temperature -34 o C - 100 o CRoom - 70 o CRoom Humidity 5% - 95% RHRoom Ramp rate 1 o C/minute none # of Ports Up to 128Up to 416Up to 16 19’’ Rack Mountable No Yes Estimated cost $400k$100k$10k Similar Product Benchmarking

10. Interview expert Dr. Mark Weislogel Thermal and Fluid Sciences Group Thermal & Fluid problem expert Concept review & suggestion Thermal analysis guidance

11. Environmental Chamber ControllerHeating/Cooling Sensors Direct connect Gateway Counter Flow Conventional Ther- mistors Thermo- couples RTD Concept tree

12. Electrical Components  PID Controller  Heater  Temperature sensor  Chiller o Industrial temperature and process controllers o Automatically adjust outputs based on sensor feedback o Control process variables: temperature, flow, pressure and relative humidity o Real-time communication with PC o Intel recommended

13. Electrical Components  PID Controller  Heater  Temperature sensor  Chiller o Wide-range of temperature: 200 o C (390F)  1200 o C (2200F) o Selection based on actual mechanical shape and size o Off-the-shelf heater is preferred (Intel’s inventory)

14. Electrical Components  PID Controller  Heater  Temperature sensor  Chiller Thermocouple o Voltage output o Low accuracy o Very high temp. range RTD (Resistive Thermal Devices) o Resistance output (metal based) o Below 600 °C range o High accuracy and repeatability (low drift) Thermistor o Resistance output (ceramic/polymer based) o Limited temperature range (−90 °C to 130 °C) o Small package and cheap

15. Electrical Components  PID Controller  Heater  Temperature sensor  Chiller o Re-circulating chillers o Min temperature: -40 o C o Reservoir Size: 2 Liters o Intel provided

16. Heating/Cooling Concepts Technical Problems that designs must address Heat Flux Condensation Thermal uniformity Airflow requirements

17. ` Heating Coils (Resistance) Cooling Coils (Chilled Water) Circulating Fans Intel SSD’s (Solid State Drives) Counter flow Design PROSCONS Thermal UniformityDifficult analysis Heat Flux controllabilityCondensation risk Maintainable Airflow

18. Heating Coils (Resistance) Cooling Coils (Chilled Water) Intel SSD’s (Solid State Drives) Low Risk Design PROSCONS Thermal UniformityDifficult analysis Limit CondensationManufacturability Maintainable AirflowCost

19. Conventional Design PROSCONS ManufacturabilityAirflow Requirements Easy AnalysisCondensation risk Thermal Uniformity

20. Low Risk Design Conventional Design Counter flow Design Further Plans 1.Continue Analysis on each design 2.Computer Simulation 3.Concept/Design Selection 4.Part Selection