1. MSD System Design Review Agenda P11212 : LVE Controls, RF Module Meeting Purpose 1. Present an overview of the project. 2. Confirm understanding of Customer Needs and Engineering Specifications. 3. Review Concept Generation and Refinement process. 4. Proposal for a design solution and analysis of benefits vs. disadvantages. 5. Discuss Feasibility and possible alteration of plan. Materials to be Reviewed 1. Project Description 2. Work Breakdown Structure 3. Customer Needs 4. Engineering Specifications 5. Interface Document 6. Concept Selection Matrix 7. Proposed Ideas 8. LVE Controls vs. LV 1 Gen 1 Design and RP1 Gen 2 Design 9. Project Plan Moving Forward 10. Risk Management

2. Meeting Timeline Start TimeTopic of Review 12:30Project Introduction 12:40Work Break Down structure 12:45Customer Needs 12:50Engineering Specifications 1:00Interface Control Document 1:10Concept Generation and Selection 1:20LVE vs LV1 and RP1 1:35Project Plan 1:40Risk Assessment 1:50Are we ready to design?

4. Work Break Down Structure

5. Work Break Down Assignments Wireless Interface – Dan Microcontroller – Dan Communication Bus – Gokhan Logic Power – Nick Motor Power – Nick H-bridge Drivers – Gokhan Pulse Width Modulation - Gokhan

6. Customer Needs

7. Engineering Specifications

8. Interface Control Document

10. Concept Selection RF Module

11. Concept Selection Microcontroller

12. Concept Selection Motor Control

13. Concept Selection MSA Communication

14. System Analysis Delay through transmission: – Theoretical message size: 18 bits – Single Message Latency: Time through USART: 18b / 31kBps = 72us Time through RF: 18b / 40kbps = 450us Total time: 72us + 450us = 522us – Max messages: 5 – Max messages size: 54 bits – Max Message Latency: Time through USART: 54b / 31kBps = 217us Time through RF: 54b / 40kbps = 1.35ms Total time: 217us + 1350us = 1.567ms – Forward Backward Left Right M1 + M1 - M2 + M2 - M3 + M3 - M4 + M4 - M5 + M5 - M6 + M6 - M7 + M7 - M8 + M8 – – 5 bit: instruction 0-31 – 4 bit: speed 0-15 – X bit: redundancy – 5 instructions at once – (5+4+9)*3= 54 bits/instruction set

15. System Analysis Heat Transfer Rate: Q = ΔT/R ΔT = T interal - T external R = d/ka d = material thickness k = thermal conductivity a = exposed surface area so Q = ΔTka/d

16. System Architecture

17. Previous Architecture

19. Project Plan

20. Project Plan Gannt Chart

21. Risk Assessment