1. ISL David Stuart, UC Santa Barbara May 11, 2006 David Stuart, UC Santa Barbara May 11, 2006

2. ISL David Stuart, UC Santa Barbara May 11, 2006 David Stuart, UC Santa Barbara May 11, 2006 Formerly known as Intermediate Radius Silicon

3. I’ll review the motivation for the detector and give a tour of its design and construction

4. The motivation is best shown by looking at an event display from Run 1.

6. Tracks are obviously missed and obviously easy to find.

7. Actual size

8. Unused hits from: 1.Low p T  > 1

9. Using forward silicon hits in Run 1 1.Stand-alone silicon pattern recognition Fit for  0, d 0, p T (curvature) with 4 hits, <=1 dof. It worked, but was limited by lever arm (L 2 ) Too few hits Poor curvature resolution degraded impact parameter resolution 4% relative increase in b-tagging for top

10. Using forward silicon hits in Run 1 2.Calorimeter-seeded tracking for electrons i.e., Phoenix ee  E T event

12. ISL designed to extend lever arm SVX’ (Run 1) L00 SVXII ISL

13. Design goals Fine granularity at large radius for Low occupancy typical jet has ~10 tracks in a  <0.2 cone, covers 1000 channels Resolution and lever arm (BL 2 ) 100  m pitch = 30  m resolution sufficient for Negligible effect on d 0 resolution Pointing into COT < hit resolution at high p T < hit width at low p T 2trk COT res

14. Portcard scattering is a real complication

15. Design requirements Big (5 m 2 ) Cheap Fast

16. Design requirements Big (5 m 2 )  simple Cheap  simple Fast  simple Piggybacking on SVX-II infrastructure important

17. Sensor Design Big- used max possible sensor size per wafer. HPK only had 4” wafers Micron had 6”, and they were cheaper (in both senses of the word). Layer 6 built with HPK at Fermilab Layer 7 built with Micron at Pisa  Different geometries, mechanics, & quality

20. Readout Hybrid Double sided and spacious Pitch adapter Transceiver

21. Half ladder

22. Full ladder

23. Ganging Not in trigger, but don’t preclude, so r-phi read first. 16 chips total--max FIB can handle. Note up-down reverses hall effect and readout direction.

24. Joel dropped them in place

25. Supported by carbon fiber spaceframe Containing cable and cooling and gang card mounts

32. Notable differences from SVXII Because rad damage is less of a concern, and no direct silicon heating –ISL operates ~10 deg warmer than SVXII Layer 6 has the implant on the z-side IB0,1,4,5 (forward region) –L0,L2,L4 are layer seven (Micron sensors) –L1,L3 are layer six (Hamamatsu sensors) IB2,3 (central region) –Everything is layer six Within a given layer, IBxWyLz, y and z denote phi position of ganged readout pair

33. Forward tracking Recall Design goals

34. Forward tracking ? Recall Design goals