1. Cooling of Chips in Circuit Boards

2. Problem One way to cool chips mounted on circuit boards is to encapsulate the boards in metal frames that provide efficient pathways for conduction to supporting cold plates. Heat Generated by the chips is then dissipated by transfer to water flowing through passages drilled in the plates.

3. Design/Specifications water Coolant Passages D=10mm, N= 10 Circuit Board Frames T=47 degree Celsius Water Initial temperature = 7 Celsius Mass flow rate = 0.2 kg/s Cold Plate T= 32 degrees Celsius Air P = 1 atm V= 10m/s T = 7 degrees Circuit Board Frames. T=47 Celsius, N=10 Coolant Passages Cold Plate T = 32 Celsius AIR Circuit Board Containing Chips

4. Assumptions Isothermal cold plate All heated generated by circuit boards is dissipated by cold plates Circuit boards may be represented as isothermal at an average surface temperature. Air flow over circuit boards approximates that over a flat plate in parallel flow. Part A: To find how much heat is dissipated by the circuit boards Part B: To find how much of the heat generated by the circuit boards is transferred to air

5. Part A With a total of N = 10 passages, the total heat dissipation is 50.2 kW

6. Part B To find how much of the heat generated by the circuit boards is transferred to air. 2,670W  9.5 percent(low) Heat Transfer to the Air

7. Results Air not effect for Cooling Microchips The cooling capacity of the cold plates far exceeds that of the air flow. However, the challenge would be one of efficiently transferring such a large amount of energy to the cold plates without incurring excessive temperatures on the circuit boards

8. Equations Used