1. 1 Student Hands On Training I (2009) Command & Data Handling PCB Build Procedure

2. 2 Student Hands On Training I (2009) What Are We Building?

3. SHOT 1 2009 3 The C&DH PCB 1:

4. SHOT 1 2009 4 The C&DH PCB 2: AVR Board Data Board Z-Accel. Board

5. SHOT 1 2009 5 Organization: The boards may seem like an array of confusing electronics, but one can easily break the board into smaller subsystems of related components. This build is organized by different sub systems integral to the board.

6. SHOT 1 2009 6 Integral Systems: -ATMega32 Microprocessor -2 MB Flash Memory -0-15 PSI Pressure Sensor -3-Axis Acceleration -Temperature Sensor -In-System-Programming -Power Regulation

7. 7 Student Hands On Training I (2009) Safety and Background

8. SHOT 1 2009 8 Board Safety: Caution: Many of the components used in this workshop are sensitive to electrostatic discharge (ESD). Please ensure that you are wearing your protective wrist strap at all times. There will be a warning slide when components are ESD and heat sensitive. Clipping leads can sometimes cause them to separate in a rapid manner that could cause injury. Please take caution when clipping leads. Wear your safety glasses at ALL TIMES!

9. SHOT 1 2009 9 Reading a Resistor: The resistors in this workshop have already been organized by value. In the event that your resistors get mixed, please refer to the chart at the left to classify your resistors, or use your multimeter. If you are unsure, don’t hesitate to raise your hand and ask for assistance.

10. 10 Student Hands On Training I (2009) Verifying Kit Contents

11. SHOT 1 2009 11 Kit Contents—PCBs: PCBs: -One Main Board -One Data Board -One Z Accelerometer Board -One XY Accelerometer Board Note: All boards were tested in-house and are currently in working order.

12. SHOT 1 2009 12 Kit Contents—Resistors: Resistors: -Two 1 KΩ Resistors - R8, R9 -Eight 10 KΩ Resistors - R1, R2 R3, R4, R5, R6, R10, R11 -One 3.3 KΩ Resistors - Indicator -One 100 KΩ Resistor - R7

13. SHOT 1 2009 13 Kit Contents—Capacitors: Capacitors: -Eleven.1 μF Capacitors - C2, C3, C4, C5, C6, C7, C8, C9, CX, CY, CZ -One 1 μF Capacitor - C10 -One 10 μF Capacitors - C1

14. SHOT 1 2009 14 Kit Contents - Connectors: Connectors: -One ISP Cable -Ten 2X1 Headers -One 3X1 Header -One 4X1 Header -Three 3X2 Right Angle Headers

15. SHOT 1 2009 15 Kit Contents—LEDs: LEDs: -Two Red LEDs

16. SHOT 1 2009 16 Kit Contents—Sockets/ICs/Pressure Sensors:

17. SHOT 1 2009 17 Sockets/ICs/Press. Sens.: -One AVR Socket -One AVR -One Level Shifter (LS) -One LS Socket -One Pressure Sensor -One DB9 Connector LS DIP AVR AVR DIP LS Press. Sens DB9 Conn. Kit Contents—Sockets/ICs/Pressure Sensors:

18. SHOT 1 2009 18 Kit Contents—Miscellaneous 1:

19. SHOT 1 2009 19 Kit Contents—Miscellaneous 2: Miscellaneous: -One Red LED -One Green LED -One Switch -One Jumper -One Z-Accelerometer Connector Green LED Red LED Jumper Z-Acc. Conn. Switch

20. SHOT 1 2009 20 Kit Contents—Miscellaneous 3: Miscellaneous: -Wires: -Three Blue -Three Red -Two Black BlackRedBlue

21. SHOT 1 2009 21 Kit Contents—Transistors: Transistors: -One PNP Transistor - T1 -One NPN Transistor - T2

22. SHOT 1 2009 22 Kit Contents—VREGS: VREGS: -One 5V VREG -One 3.3 VREG

23. SHOT 1 2009 23 Kit Contents—Diodes: Diodes: -Three Diodes -D1, D2, D3

24. SHOT 1 2009 24 Board Check: -Check to ensure that your boards have: flash memory (1), a level shifter (2), and four accelerometers (3). -Please raise your hand if any components are missing. 2 1 3

25. SHOT 1 2009 25 Board Schematic: -Check to ensure that your boards have: flash memory (1), a level shifter (2), and four accelerometers (3). -Please raise your hand if any components are missing.

26. SHOT 1 2009 26 Schematic Overview – Part Highlighting: -Blue highlights mean parts will be added to the board in the current step. -Green highlights indicate components already on the board but relevant to the current step. -Red highlights show access points on the PCB where wires can be soldered. Part added previously Access points Part to be added

27. SHOT 1 2009 27 Schematic Overview – Coordinates (A1): -All schematic close-ups include coordinates so they can be easily located in your schematic printout. -The coordinates correspond to the letters across the side of the schematic and the numbers across the top. Coordinates given here Numbers across top Letters along side

28. 28 Student Hands On Training I (2009) Let’s Begin!

29. SHOT 1 2009 29 Current Sub System: Power Subsystem: Activation Power Regulation Sensor Subsystem: Temperature Sensor Pressure Sensor X & Y Axis Accelerometers Z Axis Accelerometers Command and Data Handling: AVR, Memory, & In-System Serial Programming (ISP) Data Retrieval

30. SHOT 1 2009 30 Activation Schematic 1 (D2): -This circuitry allows power to the board to be switched on when the rocket launches. Turns on when system is armed Power from batteries Power to rest of system

31. SHOT 1 2009 31 Activation Schematic 2 (D2): -The acceleration of launch closes the G- switch. -If the G-switch is closed while the RBF Pin header is shorted, the system turns on. -T2 keeps T1 on even after the G-switch is released. -Everything stays on until the battery is removed. T2 Keeps T1 on after launch T1 Controls power to the board

32. SHOT 1 2009 32 On LED Schematic (C2): -The ON LED indicates that the system is receiving power. -It will not turn on until after the next section (Power Regulation). -R9 prevents the LED from drawing too much power. Will be added later 5V Power Bus

33. SHOT 1 2009 33 RBF/G-Switch Headers: -Solder two (2) of the 2X1 headers into the footprints labeled RBF Pin and G-Switch. -As always, ensure they are flush with the board. G-Switch RBF Pin

34. SHOT 1 2009 34 On and RDY Headers: -Solder two more (2) of the 2X1 headers into the footprints labeled On and RDY. -These headers will be used for indicator LEDs. On RDY

35. SHOT 1 2009 35 Power Header 1: -Solder one (1) of the 2X1 headers into the footprint labeled Power. -This is the primary power header. Power

36. SHOT 1 2009 36 Power Header 2: -There is a secondary power header on the opposite side of the board. DO NOT install this header. Power

37. SHOT 1 2009 37 Pre-Bending: Pre-Bending 101: -Pre-bending is a technique that allows components to be easily inserted into a PCB. -Pre-bending also allows components to lay more flush with the board. -Bending components to the correct bend radius takes practice, but mastering the technique will reap rewarding benefits!

38. SHOT 1 2009 38 Pre-Bending: Pre-Bending 101: -Start with the bending and prodding tool in the position shown in the top picture. -Choose a location along the length of the tool that will yield the appropriate bend radius. -Use your thumb to bend the lead such that the component and lead are orthogonal. 90°

39. SHOT 1 2009 39 Diodes: -Take three (3) diodes from your supplies and use the supplied bending and prodding tool to bend the leads at 90 degrees as shown above. Right: Bent diode ready for installation. Left: Diode as it comes in the kit.

40. SHOT 1 2009 40 Diodes (D1-D3): -Solder one (1) of the bent diodes into the footprint labeled D1 on the board. -Note: Diodes are polarized and the black line on the diode must overlay the while line on the footprint. D1 D2 D3 Black and white overlay

41. SHOT 1 2009 41 Diodes (D1-D3): -Solder one (1) of the bent diodes into the footprint labeled D2. -Check polarity. D1 D2 D3

42. SHOT 1 2009 42 Diodes (D1-D3): -Solder one (1) of the bent diodes into the footprint labeled D3. -Check polarity. D1 D2 D3

43. SHOT 1 2009 43 ESD/Heat Concern: ESD is electrostatic discharge caused by built up charge on your person from not wearing your protective ESD wrist strap. When soldering heat sensitive components, use the guideline 2-3 on, 8-10 seconds off. ESD WARNING: The following components are extremely ESD and heat sensitive!

44. SHOT 1 2009 44 Transistors: -Take the power transistor, T1, and the NPN transistor, T2, from the kit and use the bending and prodding tool to bend the leads as shown above. -Note: Advance to the next slide/page to place these transistors in their footprints to determine the bend location and radius. Bent power transistor, T1 Bent NPN transistor, T2

45. SHOT 1 2009 45 Transistors (T1): -Solder the power transistor, T1, into its footprint and ensure that the bend allows it to lay flush with its heat sink. -Ensure that T1 is flush with the heat sink BEFORE soldering it into its footprint. -DO NOT solder T1 to the heat sink. T1 Use open end of bending tool to bend outside leads then the point for middle lead

46. SHOT 1 2009 46 Transistors (T2): -Place and solder the bent NPN transistor, T2, into its footprint and ensure that the bend allows it to lay flush with the board. T2

47. SHOT 1 2009 47 Resistors: -The next several steps install the resistors for the power sub system. There are four (4) different types of resistors for this sub system: 10K, 100K, 1K, and 3.3K. -The resistors will lay more flush with the board if the bending and prodding tool is used first to bend the resistors are shown above.

48. SHOT 1 2009 48 Resistors (10K): R2R3R4 R10 -Bend four (4) of the 10K resistors in the kit as indicated previously and solder them into footprints R2, R3, R4, and R10.

49. SHOT 1 2009 49 Resistors (1K): -Bend one (1) of the 1K resistors in the kit as indicated previously and solder it into footprint R8. R8

50. SHOT 1 2009 50 Resistors (1K): -Bend one (1) of the 1K resistors in the kit as indicated previously and solder it into footprint R9. R9

51. SHOT 1 2009 51 Resistors (100K): -Bend one (1) of the 100K resistors in the kit as indicated previously and solder it into footprint R7. R7

52. SHOT 1 2009 52 Activation Schematic 1 (D2): -This circuitry allows power to the board to be switched on when the rocket launches. Turns on when system is armed Power from batteries Power to rest of system Highlight your schematic

53. SHOT 1 2009 53 Activation Schematic 2 (D2): -The acceleration of launch closes the G- switch. -If the G-switch is closed while the RBF Pin header is shorted, the system turns on. -T2 keeps T1 on even after the G-switch is released. -Everything stays on until the battery is removed. T2 Keeps T1 on after launch T1 Controls power to the board Highlight your schematic

54. SHOT 1 2009 54 On LED Schematic (C2): -The ON LED indicates that the system is receiving power. -It will not turn on until after the next section (Power Regulation). -R9 prevents the LED from drawing too much power. Will be added later 5V Power Bus Highlight your schematic

55. 55 Student Hands On Training I (2009) Power System Test 1: 9V Supply, Flight Pin, RDY LED Power System Test 1: 9V Supply, Flight Pin, RDY LED

56. SHOT 1 2009 56 Power System Test 1: -Take out the multimeter that was provided. -Insert the red plug into the port labeled VΩHz. -Insert the black plug into the port labeled COM. COMVΩHz

57. SHOT 1 2009 57 Power System Test 1: -Turn on the multimeter. -Turn the dial to the 20V DC setting. -Place the red lead on the positive battery terminal. -Place the black lead on the negative battery terminal. -If you do not get a reading of above 9V, raise your hand.

58. SHOT 1 2009 58 Power System Test 1: + - -Set multimeter in continuity test mode. -Place red lead on the positive power terminal. -Place black lead on GND. -If a beep is heard, please raise your hand.

59. SHOT 1 2009 59 Power System Test 1: -Connect your battery to the circuit (red wire is positive). -Connect the red LED to the “RDY” header. -Connect the jumper to “RBF Pin.” -If the red LED does not light, please raise your hand. -Final Step - Disconnect the battery from the board! Jumper NOTE: Red wire from LED connects to “+” on board

60. SHOT 1 2009 60 Current Sub System: Power Subsystem: Activation Power Regulation Sensor Subsystem: Temperature Sensor Pressure Sensor X & Y Axis Accelerometers Z Axis Accelerometers Command and Data Handling: AVR, Memory, & In-System Serial Programming (ISP) Data Retrieval

61. SHOT 1 2009 61 Power Regulation Schematic 1 (C1): - Voltage regulators turn the 9 Volts provided by the battery into the 5 Volt and 3.3 Volt power supplies required by the digital components. 3.3V Output 5V Output 9V Input

62. SHOT 1 2009 62 Power Regulation Schematic 2 (A3): - Capacitors can be used to filter power supplies by storing energy when the voltage is slightly too high and releasing it when the voltage is too low. There is a capacitor for each power supply (5V, 3.3V, and 9V) and also at the power input pins of every chip.

63. SHOT 1 2009 63 ESD/Heat Concern: ESD is electrostatic discharge caused by built up charge on your person from not wearing your protective ESD wrist strap. When soldering heat sensitive components, use the guideline 2-3 on, 8-10 seconds off. ESD WARNING: The following components are extremely ESD and heat sensitive!

64. SHOT 1 2009 64 3.3V Voltage Regulator: Take one (1) 3.3 VREG from the kit (L69B) and solder it to the board. TIP: Place a large blob of solder (2 linear inches) onto the side of the soldering iron’s tip, and tack the large pad on first. Once the large pad is tacked, solder the remaining pads. 3.3 VREG

65. SHOT 1 2009 65 5V Voltage Regulator: Using the technique described on the previous slide, solder one (1) 5.0 VREG onto the board as shown above. 5.0 VREG

66. SHOT 1 2009 66 Capacitors (C1): Take one (1) 10μF capacitor from the kit and solder it into the footprint labeled C1. Note: These capacitors are not polarized 10μF(C1)

67. SHOT 1 2009 67 Capacitors (C2, C6, C7): Take three (3).1μF capacitors from the kit and solder them into the footprints labeled C2, C6, and C7..1μF(C2).1μF(C6). 1μF(C7)

68. SHOT 1 2009 68 Power Regulation Schematic 1 (C1): - Voltage regulators turn the 9 Volts provided by the battery into the 5 Volt and 3.3 Volt power supplies required by the digital components. 3.3V Output 5V Output 9V Input Highlight your schematic

69. SHOT 1 2009 69 Power Regulation Schematic 2 (A3): - Capacitors can be used to filter power supplies by storing energy when the voltage is slightly too high and releasing it when the voltage is too low. There is a capacitor for each power supply (5V, 3.3V, and 9V) and also at the power input pins of every chip. Highlight your schematic

70. 70 Student Hands On Training I (2009) Power System Test 2: ON LED, 3.3 V Supply, 5.0 V Supply Power System Test 2: ON LED, 3.3 V Supply, 5.0 V Supply

71. SHOT 1 2009 71 ON LED Test: Switch ON LED 9 V Batt. RDY LED Jumper Connections: -Connect the LEDs: -Red to RDY -Green to ON -Connect the Switch -Connect the jumper to RBF Pin -Connect the battery NOTE: Red wires from LEDs connect to “+” on board

72. SHOT 1 2009 72 ON LED Test 2: G-Switch ON LED 9 V Batt. RDY LED Jumper Expected Results: -The red LED should be illuminated, but not the green LED -Click the Switch -The green LED should illuminate -Raise your hand if you do not see these results

73. SHOT 1 2009 73 3.3 VREG Test: Connections: -Place the multimeter in 20V mode. -Touch the black terminal to the large pad of the 3.3 VREG (Ground) -Touch the red terminal to pin closes to the label Vreg3.3

74. SHOT 1 2009 74 3.3 VREG Test: Expected Results: -The multimeter should read 3.3 ± 0.1 Volts. -If you do not see these results, please raise your hand.

75. SHOT 1 2009 75 5.0 VREG Test: Connections: -Place the multimeter in 20V mode. -Touch the black terminal to the large pad of the 5.0 VREG (Ground) -Touch the red terminal to pin closes to the label Vreg5.0

76. SHOT 1 2009 76 5.0 VREG Test: Expected Results: -The multimeter should read 5.0 ± 0.1 Volts. -If you do not see these results, please raise your hand. Final Step - Disconnect the battery

77. SHOT 1 2009 77 Current Sub System: Power Subsystem: Activation Power Regulation Sensor Subsystem: Temperature Sensor Pressure Sensor X & Y Axis Accelerometers Z Axis Accelerometers Command and Data Handling: AVR, Memory, & In-System Serial Programming (ISP) Data Retrieval

78. SHOT 1 2009 78 Temperature Sensor Schematic (C5): - The temperature sensor outputs an analog voltage which is proportional to the temperature. A filter capacitor on the power supply reduces the noise in the output signal. Filter capacitor Analog Output Temp. Sensor

79. SHOT 1 2009 79 ESD/Heat Concern: ESD is electrostatic discharge caused by built up charge on your person from not wearing your protective ESD wrist strap. When soldering heat sensitive components, use the guideline 2-3 on, 8-10 seconds off. ESD WARNING: The following components are extremely ESD and heat sensitive!

80. SHOT 1 2009 80 Temperature Sensor: Temp. Sens. -The assistants will now give you a temperature sensor. -Use a similar technique used on the Vregs to solder the temperature sensor to its pads -TIP: Have one of your partners hold it in place with the provided tweezers while a pin is tacked in place.

81. SHOT 1 2009 81 Capacitor (C8): Take one (1).1μF capacitor from the kit, and solder the capacitor into the footprint labeled C8.

82. SHOT 1 2009 82 Temperature Sensor Schematic (C5): - The temperature sensor outputs an analog voltage which is proportional to the temperature. A filter capacitor on the power supply reduces the noise in the output signal. Filter capacitor Analog Output Highlight your schematic

83. 83 Student Hands On Training I (2009) Temperature Sensor Test

84. SHOT 1 2009 84 Temperature Sensor Test 1: Connections: -Connect the LEDs: -Red to RDY -Green to ON -Connect the Switch -Connect the jumper to RBF Pin -Connect the battery -Activate the Switch

85. SHOT 1 2009 85 Temperature Sensor Test 2: Connections 2: -Place the multimeter in 2V mode. -Place the black terminal on the large temperature sensor pad. -Place the red terminal on the pin nearest “p” in Temp.

86. SHOT 1 2009 86 Temperature Sensor Test 2: Expected Results: -If the multimeter does not display a voltage of 0.7 ± 0.1 Volts, please raise your hand. -Ensure that your partner has his/her ESD band on and have him/her place his/her finger on the sensor. -If you do not see an increase in voltage, raise your hand. Final Step - Disconnect the battery

87. SHOT 1 2009 87 Current Sub System: Power Subsystem: Activation Power Regulation Sensor Subsystem: Temperature Sensor Pressure Sensor X & Y Axis Accelerometers Z Axis Accelerometers Command and Data Handling: AVR, Memory, & In-System Serial Programming (ISP) Data Retrieval

88. SHOT 1 2009 88 Development Area Introduction: -The development area gives access to all the microcontroller input and output (I/O) pins as well as 3.3V, 5V, and 9V power. - The development area, also known as the breadboard, allows additional components to be added to the board. It makes the board more reusable and versatile. I/O Access points Power Access points

89. SHOT 1 2009 89 Development Area Schematic: Power access I/O Access

90. SHOT 1 2009 90 Development Area Tips: -When using the breadboard, keep in mind that other parts will use it later, so make sure that the wires crossing the breadboard are not so tight that the area underneath them is unusable. -For wires, use the convention that red is power, black is ground, and blue and white are data.

91. SHOT 1 2009 91 ESD/Heat Concern: ESD is electrostatic discharge caused by built up charge on your person from not wearing your protective ESD wrist strap. When soldering heat sensitive components, use the guideline 2-3 on, 8-10 seconds off. ESD WARNING: The following components are extremely ESD and heat sensitive!

92. SHOT 1 2009 92 Pressure Sensor 1: -Remove one (1) pressure sensor from the kit. -Find the notched pin (shown above) that will be connected to 5 Volts DC. Notched PWR Pin

93. SHOT 1 2009 93 Pressure Sensor 2: -Carefully insert the pressure sensor into the breadboard. - The row of NC pins should be in column 8. -The notched power pin should be in row 4, column 2. NC Power Data Ground NC Power Goes Here.

94. SHOT 1 2009 94 Pressure Sensor 3: -Now turn the board over and solder all 8 pins. -Note: DO NOT KEEP THE IRON ON ANY PIN LONGER THAN 2-3 SECONDS WITHOUT ALLOWING 10 SECONDS OF COOLING TIME.

95. SHOT 1 2009 95 Bridging 1: Bridging 101: - Building in a bread board section usually calls for a technique called “bridging.” - If you are unfamiliar with bridging, it is used to make electrical connection between components when pre-printed traces do not already exits.

96. SHOT 1 2009 96 Bridging 2: Bridging 101: - To bridge, a good technique calls for bending leads and wire over each other before clipping them. - Once leads and/or wires are in contact, apply a generous amount of solder to create a solder bead between the leads of interest. See the pictures above. Good Bridge Cross-Over

97. SHOT 1 2009 97 Pressure Sensor 4: -Strip both ends of one (1) 1.5 inch red wire. -Insert one end of the wire into a 5V source. -Insert the other end into row 4, column 1 (next to power pin). -Bridge the red wire to the power pin on the pressure sensor. PWR Bridge

98. SHOT 1 2009 98 Pressure Sensor 5: GND Bridge -Strip both ends of one (1) 1.5 inch black wire. -Insert one end of the wire into GND. -Insert the other end into row 2, column 1 (next to ground pin). -Bridge the black wire to the ground pin on the pressure sensor.

99. SHOT 1 2009 99 Pressure Sensor 6: Data Bridge -Strip both ends of one (1) 1.5 inch blue wire. -Insert one end of the wire into A7. -Insert the other end into row 3, column 1 (next to data pin). -Bridge the blue wire to the data pin on the pressure sensor.

100. SHOT 1 2009 100 Development Area Schematic: Power access I/O Access Highlight your schematic

101. 101 Student Hands On Training I (2009) Pressure Sensor Test

102. SHOT 1 2009 102 Pressure Sensor Test: Connections 1: -Connect the LEDs: -Red to RDY -Green to ON -Connect the Switch -Connect the jumper to RBF Pin -Connect the battery -Activate the Switch

103. SHOT 1 2009 103 Pressure Sensor Test: Connections 2: -Place the multimeter in 20V mode. -Place the black terminal on GND. -Place the red terminal at A7 (blue wire).

104. SHOT 1 2009 104 Pressure Sensor Test: Expected Results: -Your multimeter should read between 4.3 to 4.5 Volts (sea level). -If you do not see these results, please raise your hand for assistance.

105. SHOT 1 2009 105 Pressure Sensor Test: Expected Results: -You should also find a red coffee stirring straw in your kit. -Place one end over the pressure sensor and suck on the other end. -You should see the voltage drop. -If your results vary, please raise your hand. Straw Final Step - Disconnect the battery

106. SHOT 1 2009 106 Current Sub System: Power Subsystem: Activation Power Regulation Sensor Subsystem: Temperature Sensor Pressure Sensor X & Y Axis Accelerometers Z Axis Accelerometers Command and Data Handling: AVR, Memory, & In-System Serial Programming (ISP) Data Retrieval

107. SHOT 1 2009 107 X & Y Axis Accelerometer Socket Schematic (A6): -The accelerometers output analog voltages proportional to the acceleration they feel in a particular axis. - Low range accelerometers have much higher precision than high range accelerometers, but will saturate if the acceleration is too great. Low Range Accel High Range Accel

108. SHOT 1 2009 108 X & Y Axis Accelerometers Schematic (B5): -The accelerometers are very sensitive and difficult to solder, so they have been provided on a socket which can be soldered to the board. - To reduce noise there are capacitors on the power supply and analog outputs of the accelerometers. Output filter capacitors Input filter capacitor Accelerometer socket

109. SHOT 1 2009 109 X & Y Accelerometers 1: -Take out four (4) of the 2X1 headers from the kit. Share pliers with your neighbors, and break one (1) 2X1 header into two 1X1 headers.

110. SHOT 1 2009 110 X & Y Accelerometers 2: -Place and solder the three (3) 2X1 headers into the 2X1 holes in the ACC footprint. -Place and solder the one (1) 1X1 header into the 1X1 hole in the ACC footprint. 2X1 1X1 2X1

111. SHOT 1 2009 111 X & Y Accelerometers 3: -Place and solder the provided X&Y accelerometer board onto the headers added in the previous step. -Caution: When clipping these leads, ensure that you have your safety glasses on. Hold the leads while clipping them.

112. SHOT 1 2009 112 Capacitors (C5, CX, CY): -Solder three (3) of the.1μF capacitors into the footprints labeled CX, CY, and C5. -Note: These capacitors are located near the accelerometers that were just mounted. CYCXC5

113. SHOT 1 2009 113 X & Y Axis Accelerometer Socket Schematic (A6): -The accelerometers output analog voltages proportional to the acceleration they feel in a particular axis. - Low range accelerometers have much higher precision than high range accelerometers, but will saturate if the acceleration is too great. Low Range Accel High Range Accel Highlight your schematic

114. SHOT 1 2009 114 X & Y Axis Accelerometers Schematic (B5): -The accelerometers are very sensitive and difficult to solder, so they have been provided on a socket which can be soldered to the board. - To reduce noise there are capacitors on the power supply and analog outputs of the accelerometers. Output filter capacitors Input filter capacitor Accelerometer socket Highlight your schematic

115. SHOT 1 2009 115 Current Sub System: Power Subsystem: Activation Power Regulation Sensor Subsystem: Temperature Sensor Pressure Sensor X & Y Axis Accelerometers Z Axis Accelerometers Command and Data Handling: AVR, Memory, & In-System Serial Programming (ISP) Data Retrieval

116. SHOT 1 2009 116 Z Axis Accelerometer Schematic (C6): -There is one high range and one low range Z axis accelerometer. -Since the Z axis accelerometers must be mounted vertically, they are on a separate board, which connects to the main board with four wires. -As before, power supply and output filter capacitors reduce noise in the data. High Range Accel Low Range Accel

117. SHOT 1 2009 117 Z Accelerometer Header: -Solder one (1) 4X1 header into the footprint next to the pressure sensor. -Note: This header will connect the Z accelerometer board to the main board.

118. SHOT 1 2009 118 Z Accelerometer Cable: -Strip and solder the four (4) wire Z Accelerometer Connector into the Z Accelerometer board. -White goes to “L”, Black to “-”, Red to “+”, and Blue to “H”.

119. SHOT 1 2009 119 Z Accelerometer Cable: -Now that the wire have been soldered in, make sure that the leads are clipped as close to the board as possible to prevent shorting on the structural mount that will be added later.

120. SHOT 1 2009 120 Capacitors (CZ and C9): Solder two (2).1μF capacitors into the footprints labeled C9 and CZ on the Z accelerometer board.

121. SHOT 1 2009 121 Capacitors (CZ and C9): -Now that the capacitors have been soldered in, make sure that the leads are clipped as close to the board as possible to prevent shorting on the structural mount that will be added later.

122. SHOT 1 2009 122 Z Axis Accelerometer Schematic (C6): -There is one high range and one low range Z axis accelerometer. -Since the Z axis accelerometer must be mounted vertically, it is on a separate board, which connects to the main board with four wires. -As before, power supply and output filter capacitors reduce noise in the data. High Range Accel Low Range Accel Highlight your schematic

123. 123 Student Hands On Training I (2009) Accelerometer Test: X, Y, and Z Axis Accelerometer Test: X, Y, and Z Axis

124. SHOT 1 2009 124 A Summary: At this point, you should be able to match the picture below. To complete the accelerometer tests, make the following connections. Connections 1: -Connect the LEDs: -Red to RDY -Green to ON -Connect the Switch -Connect the jumper to RBF Pin -Connect z-axis accel. board Blue wire to “H”, red to “+” -Connect the battery -Activate the Switch

125. SHOT 1 2009 125 Accelerometer Test 1: Connections 2: -Place the multimeter in 20V mode. -Place the black terminal on GND or the 3.3 VREG’s largest pad. -Place the red terminal in A0. Expected Results: -You should read 2.5 ± 0.2 Volts. - Raise your hand if you do not get these results.

126. SHOT 1 2009 126 Accelerometer Test 2: Connections 3: - Ensure that one partner has an ESD strap on. -Have this partner hold the Z Accelerometer board flat against the static mat. -Keep black terminal on GND -Move red terminal from A0 through A5. Expected Results: -If you do not read 2.5 ± 0.2 Volts on all pins, please raise your hand.

127. SHOT 1 2009 127 Accelerometer Test 3: Pin Summary: A0: X-Low Range A1: Y-Low Range A2: Z-Low Range A3: X-High Range A4: Y-High Range A5: Z-High Range Sanity Check: -Have your ESD safe partner reorient the Z Accelerometer board and main board. -Measure voltages on A0-A5 -If you do not see voltages other than 2.5 Volts, raise your hand.

128. SHOT 1 2009 128 ESD/Heat Concern: ESD is electrostatic discharge caused by built up charge on your person from not wearing your protective ESD wrist strap. When soldering heat sensitive components, use the guideline 2-3 on, 8-10 seconds off. ESD WARNING: The following components are extremely ESD and heat sensitive!

129. SHOT 1 2009 129 Accelerometer Test 4: Tilt Test 1: -You will notice that the XY accelerometer board has an axis definition on it. -Have your ESD safe partner rotate the board so that the X axis points to the ceiling. -Now check the voltages on pins A0 and A3. -You should see an increase in voltage (above 2.5 Volts) on both, but the change will be smaller on A3. Axis

130. SHOT 1 2009 130 Accelerometer Test 5: Tilt Test 2: -You will notice that the XY accelerometer board has an axis definition on it. -Have your ESD safe partner rotate the board so that the Y axis points to the ceiling. -Now check the voltages on pins A1 and A4. -You should see an increase in voltage (above 2.5 Volts) on both, but the change will be smaller on A4. Axis

131. SHOT 1 2009 131 Accelerometer Test 6: Tilt Test 3: -You will notice that the Z accelerometer board has an axis definition on it. -Have your ESD safe partner rotate the board so that the Z axis points to the ceiling. -Now check the voltages on pins A2 and A5. -You should see an increase in voltage (above 2.5 Volts) on both, but the change will be smaller on A5. Axis Final Step - Disconnect the battery

132. SHOT 1 2009 132 Current Sub System: Power Subsystem: Activation Power Regulation Sensor Subsystem: Temperature Sensor Pressure Sensor X & Y Axis Accelerometers Z Axis Accelerometers Command and Data Handling: AVR, Memory, & In-System Serial Programming (ISP) Data Retrieval

133. SHOT 1 2009 133 AVR Microcontroller Schematic 1 (B3): -The AVR is the computer that controls the system. -PA0 through PA7 are analog inputs, used to sample the sensors. -PD6 will be used to control an LED Analog Inputs Filter capacitor PD6

134. SHOT 1 2009 134 AVR Microcontroller Schematic 2 (B3): -PB4 through PB7 are a data bus used to talk to the flash memory. -PD0 and PD1 are a Universal Asynchronous Receiver / Transmitter (UART) which can send data to a computer. Flash interface UART

135. SHOT 1 2009 135 Flash Memory Schematic (A1): -The flash memory holds two megabytes of data. -A level shifter allows the AVR, which runs on 5V, to communicate with the 3.3V flash memory. Flash Memory 5V to 3.3V Level Shifter Filter capacitor

136. SHOT 1 2009 136 In-System Programming Schematic (B2): -Using the ISP header with an AVRISP, which will be introduced later, allows the AVR to be programmed without removing it from the circuit.

137. SHOT 1 2009 137 AVR Socket: -Solder one (1) AVR DIP into the “AVR” footprint. -Warning: Make sure that the notches are aligned as indicated above and socket is flush with the board. -Tip: It works well to tack two corners on the back side to ensure it is mounted correctly before soldering all 40 pins. Notches

138. SHOT 1 2009 138 Capacitors (C3 and C4): -Solder two (2).1μF capacitors into the footprints labeled C3 and C4. -Note: The footprints are located directly below the AVR Dip that was installed in the previous step. C3C4

139. SHOT 1 2009 139 Resistors (R1, R5, R6): -Solder three (3) 10K resistors from the kit and solder them into the footprints labeled R1, R5, and R6. R1 R6 R5

140. SHOT 1 2009 140 ISP Header: -Solder one (1) right angle header into the footprints labeled ISP. -The bent pins should be the ones that are soldered. -Caution: When clipping these leads, ensure that you are wearing your eye protection and holding the leads. ISP

141. SHOT 1 2009 141 Indicator LED 1: -Solder one (1) 3.3K resistor into bread board section as indicated above. -The right most lead of the resistor should be in row 1, column 15. -The left most lead of the resistor should be in row 1, column 19.

142. SHOT 1 2009 142 Indicator LED 2: -Solder one (1) red LED into bread board section as indicated above. -Make sure that the flat side of the LED is adjacent to the resistor. -The left lead will go in row 1, column 20. -The right lead will go in row 1, column 21. -Turn the board over and bridge the flat side lead to the resistor. Bridge

143. SHOT 1 2009 143 Indicator LED 3: Bridge -Strip both ends of one (1) 1.5 inch blue wire. -Solder one end of the wire into row 1, column 14 adjacent to the resistor. -Solder the other end into D6. -Bridge the blue wire and resistor on the backside of the board as indicated above.

144. SHOT 1 2009 144 Indicator LED 4: Bridge 5V PWR -Strip both ends of one (1) 1.5 inch red wire. -Solder one end of the wire into row 1, column 22 adjacent to the LED. -Solder the other end into a 5 Volt source. -Bridge the wire and LED on the backside of the board as indicated above.

145. SHOT 1 2009 145 AVR Microcontroller Schematic 1 (B3): -The AVR is the computer that controls the system. -PA0 through PA7 are analog inputs, used to sample the sensors. -PD6 will be used to control an LED Analog Inputs Filter capacitor PD6 Highlight your schematic

146. SHOT 1 2009 146 AVR Microcontroller Schematic 2 (B3): -PB4 through PB7 are a data bus used to talk to the flash memory. -PD0 and PD1 are a Universal Asynchronous Receiver / Transmitter (UART) which can send data to a computer. Flash interface UART Highlight your schematic

147. SHOT 1 2009 147 Flash Memory Schematic (A1): -The flash memory holds two megabytes of data. -A level shifter allows the AVR, which runs on 5V, to communicate with the 3.3V flash memory. Flash Memory 5V to 3.3V Level Shifter Filter capacitor Highlight your schematic

148. SHOT 1 2009 148 In-System Programming Schematic (B2): -Using the ISP header with an AVRISP, which will be introduced later, allows the AVR to be programmed without removing it from the circuit. Highlight your schematic

149. SHOT 1 2009 149 Current Sub System: Power Subsystem: Activation Power Regulation Sensor Subsystem: Temperature Sensor Pressure Sensor X & Y Axis Accelerometers Z Axis Accelerometers Geiger Counter Interface Command and Data Handling: AVR, Memory, & In-System Serial Programming (ISP) Data Retrieval

150. SHOT 1 2009 150 Level Shifter Board Schematic (D4): -The level shifter board allows the AVR, which runs on 5V, to communicate with a computer serial port, which uses +/- 12V. To Computer To main board

151. SHOT 1 2009 151 Data Header: -Solder one (1) right angle header into the footprints labeled Data on the Main Board. -The bent pins should be the ones that are soldered. -Caution: When clipping these leads, ensure that you are wearing your eye protection.

152. SHOT 1 2009 152 Data Header 2: Data -Solder one (1) right angle header into the footprints labeled Data on the Data Board. -The bent pins should be the ones that are soldered. -Caution: When clipping these leads, ensure that you are wearing your eye protection.

153. SHOT 1 2009 153 Level Shifter Socket: -Solder one (1) level shifter socket into the footprint labeled Level Shifter. -Tip: It works well to tack two corners on the back side to ensure it is mounted correctly before soldering all pins.

154. SHOT 1 2009 154 DB9 Serial Connector: -Solder one (1) DB9 serial connector into the data transfer board. -Make sure that the connector is flush with the board and the prongs are securing the board before you begin soldering.

155. SHOT 1 2009 155 Resistors (R11): -Solder one (1) 10k resistor into the footprint labeled R11.

156. SHOT 1 2009 156 Capacitors (C10): Solder one (1) 1μF capacitor into the footprint labeled C10. C10

157. SHOT 1 2009 157 Data LED: -Solder one (1) red LED into the footprint labeled ON. -Note: LEDs are polarized. The flat side of the LED is the negative side and should be placed in the footprint accordingly.

158. SHOT 1 2009 158 ESD/Heat Concern: ESD is electrostatic discharge caused by built up charge on your person from not wearing your protective ESD wrist strap. When soldering heat sensitive components, use the guideline 2-3 on, 8-10 seconds off. ESD WARNING: The following components are extremely ESD and heat sensitive!

159. SHOT 1 2009 159 Level Shifter Insertion: LS -Remove the level shifter from the ESD foam. -Align the notch from the level shifter with the one on the level shifter dip on the board, and GENTLY work the level shifter into the socket. -Take your time with this, bent leads are extremely difficult to straighten. Notch

160. SHOT 1 2009 160 AVR Insertion: -Remove the AVR from the ESD foam. -Align the notch from the AVR with the one on the AVR socket on the board, and GENTLY work the AVR into the socket. -Take your time with this, bent leads are extremely difficult to straighten. AVR Notch

161. SHOT 1 2009 161 Final Products: AVR Board Data Board Z-Accel. Board

162. 162 Student Hands On Training I (2009) Congratulations! The board is now ready for additional SHOT Workshop Modifications (Heater and Camera) Congratulations! The board is now ready for additional SHOT Workshop Modifications (Heater and Camera)