1. Tower Electronics Module and Tower Power Supply EM Tower Electronics Module (TEM) before coating/staking TEM & TPS assembly Close to 60 TEM & TPS assemblies in the field used as EGSE for CAL, TKR, DAQ, FSW, I&T All flight drawings released Flight PCB’s fabricated All enclosures fabricated One flight PCB loaded at SLAC with flight-lot components for testing; passed tests Flight assembly contract in place All components kitted, will be sent to assembler 9/22/04

2. GASU (Global Trigger, ACD, Signal-Distribution Unit) EM GASU (before harness routing) GASU Assembly 15 GASU assemblies in the field used as EGSE for ACD, DAQ, FSW, I&T All flight drawings submitted for review/release Flight PCB’s contract in procurement SOW for GASU assembly in progress All components ordered Components to be kitted end of September

3. PDU (Power Distribution Unit) EM PDU (before harness routing) PDU Assembly 5 PDU assemblies in the field used as EGSE for DAQ, FSW, I&T All flight drawings submitted for review/release Flight PCB’s requisition in progress SOW for PDU assembly in progress All components ordered Components to be kitted end of September

4. PDU (Power Distribution Unit) EM SIB SIU/EPU Crate Assembly 5 cPCI SIU/PDU assemblies in the field for DAQ, FSW, I&T –Enclosure –PCI Backplane –Crate Power Supply Board –Storage Interface Board (SIB) –LAT Communication Board (LCB) –BAE Processor Board Mechanical flight drawings submitted for review/release Electrical flight drawings almost ready for review/release All components ordered Components to be kitted by end of October