1. Tutorials on Systems Miniaturization Luiz Otávio S. Ferreira - LNLS November 28, 2001

2. Luiz Otávio S. Ferreira2 Outline Introduction to Systems Miniaturization Microfabrication Technologies Microsystems Development and Packaging Microfabrication in Brazil

3. Luiz Otávio S. Ferreira3 Introduction to Systems Miniaturization Microsystems: –Sets of microdevices capable of integrated sensing, analysis and actuation. Microdevices: –Microstructures capable of actuation, or signal transduction, or chemical reaction, etc. Ivo M. Raimundo Jr. IQ/UNICAMP MUSA2000 Nobuo Oki UNESP Ilha Solteira MUSA2000 Luiz O.S. Ferreira LNLS

4. Luiz Otávio S. Ferreira4 Why Miniaturization? Reduction on mass and size. Integration with electronics. Exploitation of new effects due to small size. Cost/performance advantages. Improved reproducibility, accuracy and reliability. Redundancy and arrays. Low power consumption. Less material used for manufacturing. Avoiding of rare or aggressive to environment material. Easy disposal.

5. Luiz Otávio S. Ferreira5 Vocabulary USA –MEMS –Microelectromechanical Systems Europe –Micro Systems Micro Systems Technology Asia –Mechatronics –Micromanufacturing Other names –Micromechanics –Nanotechnology –Microtechnology –Meso Systems

6. Luiz Otávio S. Ferreira6 Market Demands on Miniature Systems Environment Medicin Technology Information Technology Biotechnology Automotive Consumer electronics Projected sales for 2003: 32 B$ (US$) Source: Solid State Technology, July 1999, pp. 63-65.

7. Luiz Otávio S. Ferreira7 Technological Possibilites - 1 Microtechnology for electronics –Technologies developed or improved on last 20 years: Silicon crystal production. Thin film technology. Lithography and etching. Modeling. Characterization. –Non electronic interations: Springs, membranes, piezoresistive effect, heaters, etc. –Well developed material and technology: low cost if large scale production. –Systems integration.

8. Luiz Otávio S. Ferreira8 Technological Possibilities - 2 Full system approach –Technologies for Assembly Interconnection Housing System integration –Bonding and joining SMD, COB, TAB, DCA, Wire bonding, Flip Chip –Analysis of the interactions –Reliability –Performance and cost –Volume

9. Luiz Otávio S. Ferreira9 Technology Adaptation Old technologies, from micro- electronics and from mechanics, are adapted for use on micro-systems integration. Some new steps must be developed. Old materials are used on new ways: different properties. Only a whole system approach leads to effective systems. Numerical analysis of interdependencies.

10. Luiz Otávio S. Ferreira10 Why Integration? Better shielding of weak electric signals from sensors. Individual sensor calibration on factory. Lower calibration cost. On board intelligence. Reduction of connection cables. Standard communication protocols. Save cost on extra electronics housing.

11. Luiz Otávio S. Ferreira11 How to Integrate? Monolithic Integration: –Very difficult and expensive. –Very large scale of production. –Large number of interconnects. –Number of masks. –Time of development. –Yield. –MCM Hybrid Integration: –In 1997, 8% of the pressure sensors and 12% of the accelerometers where monolithically integrated.

12. Luiz Otávio S. Ferreira12 Product Oriented Approach Problem and product oriented approach: YES! Technology oriented approach: NO! Technology: manufacturability. Important technologies are not silicon based: –Mechanical micromachining. –High aspect ratio microstructuring (LIGA). –Replication methods: Electroplating, Injection molding. Hot embossing.

13. Luiz Otávio S. Ferreira13 Availability of Production Many prototypes of sensors. Small number on the market. Prototyping labs are not equipped to make 100,000 devices batchs. Moving the prototype to a foundry implies on starting again from the scratch. Orders of less than 250,000 devices are not attractive to silicon foundries. Multi-User prototyping approach (The MUSA Project).

14. Luiz Otávio S. Ferreira14 COSTS CMOS foundry for monolithically integrated sensors: US$30 Millions. Micromechanical parts line (if the ion implantation is made externally): US$4 Million. Hybrid integration (assembly and thick film line): US$1 Million. CMOS processed silicon: US$ 2.5 to 8. Cent per mm 2 = US$750 to 2100 for a processed 20cm waver. Sensor process: US$0.35 per mm 2 for batch of more than 50,000 chips. Surface micromachining; US$1.80 per mm 2 for 10,000 Chips batch, and 30 cents per mm 2 for 500,000 chips batch. Less than 1 Million chips per year is a risk. Bellow 10,000 chips a year: a big problem.

15. Luiz Otávio S. Ferreira15 People Demand 1996: total= 48,000 USA Japan Europe 29,000 13,000 6,000 2002: projected total=100,000