1. Ribbon Cutting Ceremony Microelectronics Process Engineering Laboratory College of Engineering September 25, 2003

2. Founding Partners Award Intel Corporation Dr. Jai Hakhu

3. Founding Partners Award Applied Materials, Inc. Dr. David N.K. Wang

5. Microelectronics Process Engineering Program Highlights BS degree curriculum Fab-based courses Enhancements to traditional BS curricula Workforce development activities

6. Current process capabilities Metal Deposition and Etch Diffusion and Oxidation Photo- lithography Oxide RIE Wet Chem Etch/Clean Intel Applied Materials Novellus AMD Cypress Quintel

7. Current design facilities Hardware: –500MHz Logic Analyzer –40 Sun workstations –280 Sunfire server CAD Software –Cadence Design Systems –Synopsys –Silvaco

8. Student Impact 2000-03  ProE Courses Basic IC Processing (EE/MatE129) –Fabricate and test devices –NMOS technology –207 students Advanced Thin Film Processes (MatE/ChE166) –Statistics/DOE –Metrology and thin film dep/etching –32 students Microelectronics Mfgr Methods (EE/MatE167) –CMOS technology/SPC –Sea of Gates developed –37 students

9. Student Impact 2000-03 Related Courses Electronic Design I (EE122) –Pilot study in which students designed a current mirror Introduction to Engineering (E10) –Solar cell testing –500 students/year Electronic Properties of Materials (MatE153) –Solar cell processing –300 students/year Introduction to Materials (MatE25) –Lithography (souvenirs) –250 student/year

10. Research Activity LDMOS devices Nitride Gate oxide MEMs projects RIE characterization Photovoltaics Internships

11. Impact 2000-03 Workforce Development Creating interest in semiconductor technology and engineering High school/community college instructor workshop SEMI’s Workforce Development Institute Workshop (HS students) Community college class visits Discover Camp (high school students)

12. Next Big Things Addition of CVD/polysilicon growth –Allow self-aligned gate technology –Reduction in mask set –Allow Analog Leaf Cell manufacture entirely in-house –Allow MEMs research –Enhanced materials science component Analog-Mixed Signal (AMS) designs –very sensitive to manufacturing variations –Students will do design/manufacture/test –Enhancement to EE curriculum Materials Characterization Facility

13. Let’s go meet the students and tour the facility!