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4-channel ASIC Tests Michael Baumer, Jean-Francois Genat, Sam Meehan, Eric Oberla August 26 th 2009.

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Presentation on theme: "4-channel ASIC Tests Michael Baumer, Jean-Francois Genat, Sam Meehan, Eric Oberla August 26 th 2009."— Presentation transcript:

1 4-channel ASIC Tests Michael Baumer, Jean-Francois Genat, Sam Meehan, Eric Oberla August 26 th 2009

2 1 DC, AC, Anodes tests (see also Eric’s document) - DC tests (Chicago) - No s/w needed - DC power vs biases, ring oscillator frequency, ADC ramp monitoring, token passing - AC tests (Hawai’i) - Chip on board (wire-bonding) - DACs, - FPGA, - USB interface (in the FPGA), - Fast pulser, (IEEE488 to PC) - F/w and s/w: load FPGA, program and trigger pulser, control DACs, read digital data, manage results, (LabView ?) Functional and parametric tests: - Sampling cell output vs input and sampling window - Max sampling rate, analog bandwidth - Leakages (voltage droop), - Resolution - Crosstalk - Linearities, dynamic range, - Readout speed. - Anodes/MCP tests (Chicago) - 4 chips (16 channels, 4”) - FPGA - DACs - USB - Test f/w and s/w

3 DC test card DC tests card

4 Detector tests with 4-channel ASIC Goal: Check the sampling ASIC with an actual detector

5 Flip-Chip - CVInc (TX) contacted They can do it, not clear yet if: - Real “cheap” stud-bonding, or - Regular “expensive” bump bonding requiring an Under Bump Metallization - Barcelona people will answer next week


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