1. Instrumentation January 22-25, 2002 San Diego, California, U.S.A IFPAC SM 2002 Sixteenth International Forum Process Analytical Chemistry SM Surface Mount Technology for Process Analytic Sampling Systems Update 2002 Steve Doe, Parker Hannifin Corporation

2. Surface Mount Technology for Sample Systems: Update 2002 “Surface Mount” Definition: Component’s control function is detachable from its flowpath function Providing increased servicability and flexibility while reducing overall space requirements

3. Surface Mount Technology for Sample Systems: Update 2002 Surface Mount System Options 1) Parker Integrated Conditioning System (PICS) w/ SP76 compliant 1½” and 2¼” elastomeric seal interfaces & industrial components 2) 1½” compliant interface w/ metallic seals and semiconductor grade & industrial components (“old” ultra-high purity “standard”) 3) 1 1 / 8 ” interface w/ metallic seals and semiconductor grade & industrial components (emerging ultra-high purity “standard”) 4) R-Max™ stream switching interface (proprietary) SampleSampleSampleSample ConditioningConditioningConditioningConditioning

4. PICS System n Designed w/ 5 flow channels specifically for the majority of sample conditioning systems n Utilizes 1½” SP76 (o-ring) compliant elastomeric interface n Incorporates larger 2¼” footprint to utilize existing industrial devices; SP76 (o-ring) compliant n Substrate heating capability available w/ minimal development Surface Mount Technology for Sample Systems: Update 2002

5. PICS System n Substrate assembled via bolts with tapped holes in head n Bolt interface incorporates dowel pin feature for alignment and added rigidity n O-ring connections between substrate blocks Surface Mount Technology for Sample Systems: Update 2002

6. 1½” Interface 1½” Interface 2¼” Interface Surface Mount Technology for Sample Systems: Update 2002 Std 3 channel access 5 channel access 3 or 5 channel access

7. Surface Mount Technology for Sample Systems: Update 2002

8. 1½” UHP System n Designed for delivery of ultra high purity gasses used in semiconductor applications n Recommended for detection thresholds in the PPB range n Utilizes metallic “C” or “W” seals at interfaces n Systems normally incorporate welded and faceseal type fittings; departure from existing petrochem technology Surface Mount Technology for Sample Systems: Update 2002

9. 1 1 / 8 ” UHP System n Same features as 1½” system, only smaller n Emerging as de-facto standard based on desires of leading semiconductor equipment OEM n Cartridge heaters available n Surface Mount Technology for Sample Systems: Update 2002 In full production; handle & gauge face interference’s identified and in process of correction

10. Block Assembly & Manifolding Surface Mount Technology for Sample Systems: Update 2002

11. System Comparisons Block Dim’s Bore Dia Manifold CL Block Dim’s Bore Dia Manifold CL PICS (S)2.88x1.50x.7.125” na PICS (L)2.88x2.5x.75.125” na 1 1 / 8 ”(C) 1.15x1.12x.7.180” 1.40” 1½”(C) 1.53x1.50x.7.180” 1.60” 1½”HF (C) 1.53x1.50x.7.290” 1.60” 1 1 / 8 ”(W) 1.15x1.12x.7.157” 1.40” 1½” (W) 1.53x1.50x.7.157” 1.60” Surface Mount Technology for Sample Systems: Update 2002

13. Steve Doe n Analytical Market Manager, Parker Hannifin Corporation -work with OEM’s, system integrators & end users n 18 years experience -engineering, manufacturing, operations and sales -primarily in semiconductor business segment -last 2 years in process analytic segment n Goals over next 2 years: -increase presence of Parker products in process analytic industry -and…. Surface Mount Technology for Sample Systems: Update 2002

14. Enjoy family, passions, and….

15. Surface Mount Technology for Sample Systems: Update 2002 …the rewards of work and play!