1. Martin von der Mey, EMU at CMU, October 20031 ALCT and TMB Status Martin von der Mey University of California Los Angeles ALCT production statusALCT production status TMB statusTMB status TMB radiation testTMB radiation test RAT statusRAT status

2. Martin von der Mey, EMU at CMU, October 20032 ALCT384 Boards Analog section: test pulse generator, AFEB power, ADCs, DACs (other side) 24 Input signal connectors Delay/ buffer ASICs, 2:1 bus multiplexors (other side) 80 MHz SCSI outputs (to Trigger Motherboard (to Trigger Motherboard) Power, computer connectors Xilinx Mezz. board Spartan XL

3. Martin von der Mey, EMU at CMU, October 20033 Yangheng

4. Martin von der Mey, EMU at CMU, October 20034 ALCT Production

5. Martin von der Mey, EMU at CMU, October 20035 ALCT Production

6. Martin von der Mey, EMU at CMU, October 20036 ALCT Production

7. Martin von der Mey, EMU at CMU, October 20037 ALCT Production Testing Done. Done. All ALCT base boards repaired. Also spares. All ALCT base boards repaired. Also spares. Prepare mezz. Cards spares Prepare mezz. Cards spares

8. Martin von der Mey, EMU at CMU, October 20038 Problems Encountered in testing at UCLA Most frequent problemMost frequent problem On base boards:On base boards: Intermittent problem due to buffer (Clock fanout). Buffers replacedIntermittent problem due to buffer (Clock fanout). Buffers replaced Still solder bridges (50%)Still solder bridges (50%) Shorts inside the PCB board.Shorts inside the PCB board. On mezz. Cards:On mezz. Cards: Bad Eproms (replaced)Bad Eproms (replaced) Bad ball grid connections between FPGA and PCB board.Bad ball grid connections between FPGA and PCB board.

9. Martin von der Mey, EMU at CMU, October 20039 Production of spare Mezz. Boards Want >10 % spares.Want >10 % spares. Need 25 XCV600E type and 15 XCV1000E type.Need 25 XCV600E type and 15 XCV1000E type. Have 3 good XCV600E and 1 good XVC1000EHave 3 good XCV600E and 1 good XVC1000E Have 24 bad XCV600E and 10 bad XCV1000EHave 24 bad XCV600E and 10 bad XCV1000E Already reballed about 100 mezz. Cards and remounted on same boards (success rate 70%).Already reballed about 100 mezz. Cards and remounted on same boards (success rate 70%). Plan :Plan : Remove FPGAs from non working boards and put on new mezz. card.Remove FPGAs from non working boards and put on new mezz. card. Buy 5-10 XCV1000EsBuy 5-10 XCV1000Es

10. Martin von der Mey, EMU at CMU, October 200310 Problems Encountered Broken AFEB connectors. Connectors are very fragile Shipping companies handle packages roughly We recently started packing very carefully We found a company that successfully replaces the broken connectors ($30/connector) Everybody should handle boards with care

11. Martin von der Mey, EMU at CMU, October 200311 Problems found (FAST) In shipping, connector shells got damaged (boxes handled roughly by FedEx) Very difficult to repair, found a company to do it Bottom line: First 100 chambers tested at ISR: 5 broken connector shells, 1 blown fuse, 1 bad channel… 1/38400 channels

12. Martin von der Mey, EMU at CMU, October 200312 RAT: Rpc Alct Transition module Inputs from ALCT and RPC sources Outputs through backplane to TMB. The RPC crate locations is now fixed and cabling can be discussed in detail The layout is done and submitted for board production. We expect to do a data interchange test with RPC in Spring.

13. Martin von der Mey, EMU at CMU, October 200313 RAT2003 Layout VME Backplane RPC connectors To TMB ALCT Input connector Spartan FPGA

14. Martin von der Mey, EMU at CMU, October 200314 Trigger Motherboard (TMB) Inputconnectors From ALCT Main FPGA (on back) XILINX XCV1000E Mezzanine board Inputconnectors From 5 CFEB’s Generates Cathode LCT trigger with input from CFEB (comparator) Generates Cathode LCT trigger with input from CFEB (comparator) Matches ALCT and CLCT; sends trigger primitive info via MPC to Lev-1 muon trigger, sends anode and cathode hits to DMB. Matches ALCT and CLCT; sends trigger primitive info via MPC to Lev-1 muon trigger, sends anode and cathode hits to DMB.

15. Martin von der Mey, EMU at CMU, October 200315 New TMB2003A New TMB2003A under testNew TMB2003A under test

16. Martin von der Mey, EMU at CMU, October 200316 TMB 2003A Status 4 TMB2003A boards assembled 4 TMB2003A boards assembled 2 Virtex-II Mezzanine boards assembled (Xilinx XC2V4000) 2 Virtex-II Mezzanine boards assembled (Xilinx XC2V4000) 2 Board (mostly) debugged 2 Board (mostly) debugged Board-test firmware ported from TMB2001 version. Board-test firmware ported from TMB2001 version. Beam-test firmware was modified for radiation test. Beam-test firmware was modified for radiation test. Radiation test done. Radiation test done.

17. Martin von der Mey, EMU at CMU, October 200317 Changes TMB2001/TMB2003A Changes from TMB2001 to TMB2003A 2 PHOS4 delay ASICs replaced with 3 DataDelay Devices 3D3444(10 channels with 1-ns steps replaced with 12 channels of 2ns steps) Power supply regulators replaced with OSU-approved rad tolerant devices New signals for XC2V4000 FPGA Virtex E mezz. Card replaced by Virtex II for faster speed New RPC signals to the RAT2003 transition module New voltage regulator for RAT2003 FPGA core (+1.8V) New signals to/from DMB. Accommodate backplane changes. New power plane layout Front-panel LEDs are now socketed, for faster assembly

18. Martin von der Mey, EMU at CMU, October 200318 Beam Test of TMB 2001   See Jay’s talk

19. Martin von der Mey, EMU at CMU, October 200319 TMB 2003A Hardware What works: JTAG chain sees Mezzanine FPGA + 4 PROMs, + 2 user PROMs Boot register passes walking 1 Address register passes walking 1 JTAG load command works (didn’t on TMB2001) Front panel cylon display runs VME registers read back ID, slot address, etc ADC reads back voltages and currents What doesn’t work: Some tri-state buffer outputs clamp to ~1V instead of pulling to 3.3V Test code can drive out +3.3V....it just won’t tri-state Tried Foundation and ISE compilers

20. Martin von der Mey, EMU at CMU, October 200320 TMB2003A Board Test Firmware Assembled 2 nd TMB2003 FPGA failed to load from EPROMs....fixed....bad solder on mez IC Delay ICs 3D3444 now working...firmware fix Trying to run full-auto tests Passes:ID register (includes VME slot address readback) VME data walking 1 VME address walking 1 Hard reset from VME User PROM JTAG ID codes User PROM data bus ADC voltage & current Fails:Digital serial numbers (both TMB and mez) SMB temperature IC All Loop-backs

21. Martin von der Mey, EMU at CMU, October 200321 TMB Firmware Firmware tested in 3 beam tests No big problems found Found and fixed problems with “Winner bits” New I/Os added (RPC,DMB) Added global clocks Replaced PHOS4 logic with 3D3444 (State machine clocks data at 20MHz instead of 625 kHz) Radiation test and beam test firmware ported to Virtex II.

22. Martin von der Mey, EMU at CMU, October 200322 New radiation Test

23. Martin von der Mey, EMU at CMU, October 200323 TMB2003A Test Radiation Test New state machine fires internal CLCT pattern injector Injects 1 muon: 6 hits, non-bending Trigger rate: 100KHz or ~10Hz Increments CFEB number each trigger Checks for correct CLCT data Checks for any CLCT data between triggers (spurious muon) Check power-monitor IC for +5V,+3.3V,+1.5V, +1.8V errors Flashes “running” LED at constant rate Test board: Connects to DMB TTL backplane drivers BiColor LEDs display test results Reset button forces FPGA reload (uses power-up IC on TMB)

24. Martin von der Mey, EMU at CMU, October 200324 Old ALCT radiation results Xilinx vs Altera Radiation results shows small improvements to before… Mean lies at 65.24 Rad compared to 59.2 Rad before… The main improvement (factor 5) comes due to combination of 5 chips (1 concentrator and 4 LCT chips into 1).

25. Martin von der Mey, EMU at CMU, October 200325 Radiation Test results Irradiated XC2V4000 Xilinx FPGA New radiation test gives 141 Rad for proton beam. Compared to 65 Rad before. (~2.5 better) SEU proton fluence 79.8*10 7 cm -2 (M.Huhtinen (1-4)*10 10 cm -2 for 10 LHC years) Also tested 6 GTLP chips up to 5 kRads  no problems.

26. Martin von der Mey, EMU at CMU, October 200326 Conclusions ALCT production in excellent shape and mainly done. Doing spares now.ALCT production in excellent shape and mainly done. Doing spares now. TMB firmware in good shape. Tested several times. Improvements on the way.TMB firmware in good shape. Tested several times. Improvements on the way. Received and testing TMB 2003A.Received and testing TMB 2003A. Done TMB radiation test. Excellent.Done TMB radiation test. Excellent. RAT2003 layout finished.RAT2003 layout finished.