1. Phase Equilibria: Solubility Limit Sucrose/Water Phase Diagram Pure Sugar Temperature (°C) 0 20 4060 80100 Co=Composition (wt% sugar) L (liquid solution i.e., syrup) Solubility Limit L (liquid) + S (solid sugar) 20 40 60 80 100 PureWater

2. Components and Phases Aluminum- Copper Alloy  (darker phase)  (lighter phase)

3. Effect of T & Composition (C o ) 70801006040200 Temperature (°C) CoCo =Composition (wt% sugar) L ( liquid solution i.e., syrup) 20 100 40 60 80 0 L (liquid) + S (solid sugar) water- sugar system

4. Phase Diagrams Phase Diagram for Cu-Ni system wt% Ni 204060801000 1000 1100 1200 1300 1400 1500 1600 T(°C) L (liquid)  (FCC solid solution) L +  liquidus solidus

5. wt% Ni 204060801000 1000 1100 1200 1300 1400 1500 1600 T(°C) L (liquid)  (FCC solid solution) L +  liquidus solidus Cu-Ni phase diagram Phase Diagrams : Number and types of phases

6. wt% Ni 20 1200 1300 T(°C) L (liquid)  (solid) L +  liquidus solidus 304050 L +  Cu-Ni system Composition of phases

7. Weight fractions of phases wt% Ni 20 1200 1300 T(°C) L (liquid)  (solid) L +  liquidus solidus 304050 L +  Cu-Ni system

8. The Lever Rule wt% Ni 20 1200 1300 T(°C) L (liquid)  (solid) L +  liquidus solidus 304050 L +  B T B tie line C o C L C  S R

9. wt% Ni 20 1200 1300 304050 1100 L (liquid)  (solid) L +  L +  T(°C) 35 C o Cu-Ni system Cooling in a Cu-Ni Binary

10. Mechanical Properties: Cu-Ni System --Tensile strength (TS)--Ductility (%EL,%AR) Tensile Strength (MPa) Composition, wt% Ni Cu Ni 020406080100 200 300 400 TS for pure Ni TS for pure Cu Elongation (%EL) Composition, wt% Ni Cu Ni 020406080100 20 30 40 50 60 %EL for pure Ni %EL for pure Cu

11. Binary Eutectic Systems

12. Binary-Eutectic Systems Cu-Ag system L (liquid)  L +  L+    CoCo,wt% Ag 204060 80100 0 200 1200 T(°C) 400 600 800 1000 CECE TE 8.071.991.2 779°C

13. Binary-Eutectic Systems Cu-Ag system L (liquid)  L +  L+    CoCo,wt% Ag 204060 80100 0 200 1200 T(°C) 400 600 800 1000 CECE TE 8.071.991.2 779°C

14. Binary-Eutectic Systems Cu-Ag system L (liquid)  L +  L+    CoCo,wt% Ag 204060 80100 0 200 1200 T(°C) 400 600 800 1000 CECE TE 8.071.991.2 779°C

15. Microstructures in Eutectic Systems: I 0 L +  200 T(°C) CoCo,wt% Sn 10 2 20 CoCo 300 100 L  30  +  400 (room T solubility limit) TETE (Pb-Sn System)

16. Microstructures in Eutectic Systems: II Pb-Sn system L +  200 T(°C) CoCo,wt% Sn 10 18.3 200 CoCo 300 100 L  30  +  400 (sol. limit at T E ) TETE 2 (sol. limit at T room )

17. Microstructures in Eutectic Systems: III Pb-Sn system LL  200 T(°C) C, wt% Sn 2060801000 300 100 L   L+  183°C 40 TETE CECE 61.9

18. Microstructures in Eutectic Systems: III 160  m Micrograph of Pb-Sn eutectic microstructure

19. Lamellar Eutectic Structure

20. Microstructures in Eutectic Systems: IV Pb-Sn system L+  200 T(°C) C o, wt% Sn 2060801000 300 100 L   L+  40  +  TETE L: C o wt% Sn