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Planar Optical Integrated Circuits Based on UV-Patternable Sol-Gel Technology
Jean-Marc Sabattié, Brian D. MacCraith, Karen Mongey, Jérôme Charmet, Kieran O’Dwyer, School of Physical Sciences, National Centre for Sensor Research, Dublin City University Mathias Pez, Francois Quentel,Thierry Dean THALES Research & Technology France
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Plan Introduction Objectives Sol-Gel Technology Materials Preparation
UV-Patternable Sol-Gel Technology Waveguide Fabrication Process Parallel Optical Interconnects Assembly
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Introduction Increase in communications traffic
larger capacity networks Planar Lightwave Circuits (PLCs) as the future of optical communications: Passive devices: Parallel Optical Interconnects (POI), Splitters, Couplers... Active devices: Variable Optical Amplifiers...
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Introduction Current technology: silica-on-silicon technology
expensive steps labour intensive refractive index range limitations Flame Hydrolysis Deposition / Chemical Vapour Deposition Undercladding Flame Hydrolysis Deposition and Consolidation Photolithography and Reactive Ion Etching Core overcladding waveguide Consolidation Si or SiO2 SiO2 SiO2/GeO2
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Objectives Demonstration of the UV-patternable silica sol-gels technology for the manufacture of PLCs at room temperature at low cost Example: parallel optical interconnects transmitter chip (POI Tx)
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Objectives: Tx module e- Parallel connector Silicon Substrate
Parallel waveguides Digital input hn e- Optical fibre ribbon Coupling optics wires Integrated circuit VCSEL array
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Waveguide Structure Targets
8-waveguides array sub-module to be integrated into a transmitter chip Constraints: refractive indices are to match silica optical fibre parameters D (refractive index core - refractive index cladding) = 0.02 Cladding Layer Silicon Substrate Guiding Layer
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Zirconia used for refractive index tuning
Sol-Gel Technology Silica/zirconia are made via the sol-gel process from Alkoxide Precursors Si(OR)4 + 2 H2O SiO2 + ROH Zr(OR’)4 + 2 H2O ZrO2 + R’OH Zirconia used for refractive index tuning Catalyst
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Refractive Index Tuning
Precursors for Cladding and Guiding Layers: Tetrathyl orthosilicate (TEOS) 3-(methoxysilyl)propyl methacrylate (MAPTMS) Zirconium Propoxide Irgacure 1800 (photoinitiator) Methacrylic acid (complexing agent for Zr propoxide)
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Refractive Index Tuning
Dn = 0.01 for a 35 % concentration variation TEOS MAPTMS
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Refractive Index Tuning
Dn = 0.01 for a 6 % concentration variation Zr propoxide
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Refractive Index Tuning
Cladding and guiding materials preparation: Same amount of TEOS and MAPTMS in both materials to promote adhesion between layers to obtain materials with similar thermal expansion coefficients Refractive index difference (Dn) tuned by adjusting the Zirconium content
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Hybrid UV-Patternable Sol-Gels
MAPTMS or 3-(methoxysilyl)propyl methacrylate Resulting structure with a non-hydrolysable group as obtained with such precursors
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Hybrid UV-Patternable Sol-Gels
Aim: to create an organic network in parallel to the inorganic silica network by radical polymerisation non soluble in a wide range of solvents
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Hybrid UV-Patternable Sol-Gels
Photoinitiator UV MAPTMS
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Photolithography Standard Mask-Aligner
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Waveguide Preparation Process
Spin-Coating cladding layer Spin-Coating cladding layer Thermal treatment Thermal treatment Spin-Coating guiding layer Dicing Waveguides UV-patterning Polishing facets Solvent wash Optical testing Thermal treatment
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Refractive Index Tuning
UV-patterning step Parameters: Intensity, Duration, Wavelength Effect of the UV exposure on the refractive index of the guiding layer materials
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Waveguide Array Fabrication
Rinsing step Picture of ridge waveguides 3D-Map of ridge waveguides Acquisition with Dektak V 200 Si surface profiler
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Waveguide structures Characterisation of the waveguides
Ridge profile of a ridge waveguide Cross-section picture of a waveguide Acquisition with Dektak V 200 Si surface profiler Acquisition with optical microscope
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Waveguide Array Fabrication Conclusions
Compromise between Refractive Index changes from Precursors UV-patterning Thermal treatments Hardness (for dicing, polishing) Temperature resistance (for electronics bonding)
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Optical Testing End view of two waveguides, light injected at the other ends 250 mm 35.16 mm 32.34 mm Optical Loss = 0.79 dB/cm (measured at 840 nm by butt-coupling) Length of waveguides = ~1 cm
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Tx module with connector
Waveguide array Silicon Signal out Signal in Silicon Fibre Ribbon Laser array driving electronics VCSEL array 850 nm Alignment Pin
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Tx module with connector
Optical interface sub-module Fibre ribbon polished and metallized facet MT-ferrule VCSELs OE-component sub-assembly
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overall transmission rate: 20 Gbit/s per device
POI Tx module testing Transmission tested at 2.5 Gbit/s/channel overall transmission rate: 20 Gbit/s per device
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Conclusions Parallel Optical Interconnect demonstrator
UV-patternable sol-gel materials technology for PLC applications demonstrated Tunability of the materials for various applications (patterns, refractive index) Compatibility with electronics industry methods
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Acknowledgements Brian D. MacCraith, Karen Mongey, Jérôme Charmet,
Kieran O’Dwyer NCSR / School of Physical Sciences, Dublin City University Ireland Mathias Pez, Francois Quentel, Thierry Dean THALES Research & Technology France, Domaine de Corbeville, France European Commission Brite-Euram Programme (Project number: BRPR-G ).
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Thank you for your attention
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