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MICE Collaboration meeting at Berkeley 9 – 12 February 2005 Cooling Channel layout Presented by Stephanie Yang & Wing Lau.

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Presentation on theme: "MICE Collaboration meeting at Berkeley 9 – 12 February 2005 Cooling Channel layout Presented by Stephanie Yang & Wing Lau."— Presentation transcript:

1 MICE Collaboration meeting at Berkeley 9 – 12 February 2005 Cooling Channel layout Presented by Stephanie Yang & Wing Lau

2 Layout issues relating to the Cooling Channel There are many issues relating to the Cooling Channel layout. The one that we would like to bring up at this meeting deserves a priority attention because it requires the support and understanding of all the groups involved. This is the Drawing Control and drawing production approach.

3 Aim: The aim of this talk is to clarify the way Oxford would like to handle and manage the drawings if we were to take ownership of the MICE Cooling Channel drawings Our vision is to manage them in such a way that we can: Do our job with minimal effort; Manage them with sound quality control; Display them with maximum clarity, and Provide easy but secured access for all the MICE members In order that we can do this job properly within our very limited resource, we would demand that all drawings submitted to us are in 3-D solid model format, with all the subcomponents clearly identified and attached We will explain in this talk why we are so insistent of this demand

4 Traditional way of making drawings The traditional way of producing engineering drawings in industries is what we called a “Top Down” approach. Typically this can be cascaded into 5 levels or more. Take the Cooling Channel as an example, these are:- Level 1: General arrangement of the whole Cooling Channel – for the overall layout, space envelop, final assembly etc; Level 2: General arrangement of the module – for interface, space envelop, assembly etc; Level 3: General arrangement of components within he module – for layout, space envelop, connection to component parts, component dimension etc; Level 4: Component details – for detail design illustration of components, assembly of components, relative positioning of component parts etc; Level 5: Component Parts detail – size and dimensioning of parts, manufacturing and assembly of component parts

5 Level 1 --- General Arrangement of the Cooling channel

6 Level 2 ---Module General Arrangement

7 Level 3 -- Module sectional view

8 Level 4 -- Partial Module detail drawing

9 Level 5 -- Component parts details

10 Level 5 -- Further parts details

11 Problem with the “top down” approach Whenever there is a small change at, say, level 5, it may result in a need to update all the drawings at all level -- manually. The QA control of adapting such approach is extremely time consuming. When resource is under constrained, this method becomes unmanageable; In a multi-national collaborative project environment the number of drawings will be significant. This method becomes cumbersome and un- workable

12 Our preferred approach of drawing control and drawing production is:- The “All in one” bottom up approach. This requires The Cooling channel assembly contains all detail information, including the interface details on the individual modules that make up the Cooling Channel; The Module assembly contains all the detail information of all the sub- components that make up the module; The Module sub-assembly contains all the detail information of all the parts that make up the module sub-assemblies; The Parts sub-assemblies contain all the detail dimensions and tolerance requirements that are needed for manufacturing This could best be explained in the following slides:

13 Ladies & Gentlemen The Cooling Channel strip show

14 TOF0Chev 2TOF 1&2Magnetic Shield Detector Module Radiation Shield AFC modules 1 & 3 Coupling Modules 1 & 2 visible ☑☑☑☑☑☑☑☑ Comp.

15 TOF0Chev 2TOF 1&2Magnetic Shield Detector Module Radiation Shield AFC modules 1 & 3 Coupling Modules 1 & 2 visible ☑☑☑☑☑☑☑ Comp.

16 TOF0Chev 2TOF 1&2Magnetic Shield Detector Module Radiation Shield AFC modules 1 & 3 Coupling Modules 1 & 2 visible ☑☑☑☑☑☑ Comp.

17 TOF0Chev 2TOF 1&2Magnetic Shield Detector Module Radiation Shield AFC modules 1 & 3 Coupling Modules 1 & 2 visible ☑☑☑☑☑ Comp.

18 TOF0Chev 2TOF 1&2Magnetic Shield Detector Module Radiation Shield AFC modules 1 & 3 Coupling Modules 1 & 2 visible ☑☑☑☑ Comp.

19 TOF0Chev 2TOF 1&2Magnetic Shield Detector Module Radiation Shield AFC modules 1 & 3 Coupling Modules 1 & 2 visible ☑☑☑ Comp.

20 TOF0Chev 2TOF 1&2Magnetic Shield Detector Module Radiation Shield AFC modules 1 & 3 Coupling Modules 1 & 2 visible ☑☑ Comp.

21 TOF0Chev 2TOF 1&2Magnetic Shield Detector Module Radiation Shield AFC modules 1 & 3 Coupling Modules 1 & 2 visible ☑ Comp.

22 TOF0Chev 2TOF 1&2Magnetic Shield Detector Module Radiation Shield AFC modules 1 & 3 Coupling Modules 1 & 2 visible Comp.

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35 What we have in the MICE web page is

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41 Summary For the MICE drawings to be properly managed without the need for a “full-time” project draughtsman, we would insist that all drawings are submitted to Oxford in 3-D solid model using the proposed “all-in-one” Bottom up approach. The individual module assembly drawing should contain all the Parts with sufficient details that it allows a direct production of all the detail manufacturing drawings without any need for any detail specific 2-D drawings. The module suppliers are responsible for the quality and integrity of their own drawings. They are also responsible for supplying Oxford with their most up to date drawings. Oxford will be responsible only to assemble the individual modules into our overall Cooling Channel. Our web page is the place for storing and displaying these drawings. A hyperlink to the MICE main page will be set up soon.


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