1. Naomi Alandt, Paul Andrews, Jeremiah Zimmerman
Thermofluid Control of a Microscale Cell Culture Platform Project Report
Team Members:
Naomi Alandt, Paul Andrews, Jeremiah Zimmerman
Industry Advisor: Sean S. Kohles PhD
Academic Advisor: Derek C. Tretheway PhD

2. Background
Analysis
Final Design
Manufacturing
The μPIVOT
-μPIV: micron Resolution Particle Image Velocimetry Measurement of fluid flow and flow induced stresses -OT: Optical Tweezers Capture, suspend, and manipulate single cells

3. 50µm X 500 µm channel to heat to 37°C
Background
Analysis
Final Design
Manufacturing
50µm X 500 µm channel to heat to 37°C
Biologically compatible
Cell temperature extremities (4°C < T < 54°C)
Flow path unobstructed and full range of flowrates
Compatibility with Various Chip Designs
Schematic of the OT laser with flow though the PDMS

4. Thermal Modeling Analysis
Background
Analysis
Final Design
Manufacturing
Thermal Modeling Analysis
Computational Fluid Dynamics (CFD) and Finite Element Analysis (FEA)
Constant Surface Temperature
Counter Flow Heat Exchanger
Peltier Junctions
Resistive Wire Heating

5. Thermal Modeling Analysis
Background
Analysis
Final Design
Manufacturing
Thermal Modeling Analysis
Computation Fluid Dynamics (CFD) and Finite Element Analysis (FEA)
CFD model of microfluidic chip with constant inlet temperature
CFD model of constant glass surface temperature outside a 4mm diameter region of interest.

6. Thermal Modeling Analysis
Background
Analysis
Final Design
Manufacturing
Thermal Modeling Analysis
Computation Fluid Dynamics (CFD) and Finite Element Analysis (FEA)
0.5mm width of heat flux
0.5mm wall spacing between heat source and channel
514 W/m2 heat flux
Max temperature 46.8°C (FEA) validates Mathematical at 47.7°C

7. Resistive Heating Analysis
Background
Analysis
Final Design
Manufacturing
Resistive Heating Analysis
Expected ΔT Graphs Material Selection

8. Thickness (μm) Width (mm) Current (mA) ΔT (oC) 10 0.5 185 0.182 5 125
Background
Analysis
Final Design
Manufacturing
Thickness (μm)
Width (mm)
Current (mA)
ΔT (oC) 10
0.5
185
0.182 5
125
0.272 2 80
0.419 1 57
0.601
0.2 26
1.347 51
0.676
1.5 75
0.446
103
0.334
Dimensional
Optimization

9. Temperature Monitoring and Control
Background
Analysis
Final Design
Manufacturing
Temperature Monitoring and Control
Front Back

10. LabView->DAQ-> Thermocouple->Electrical Circuit
Background
Analysis
Final Design
Manufacturing
Electrical Circuit Schematic
LabView->DAQ-> Thermocouple->Electrical Circuit

11. Background
Analysis
Final Design
Manufacturing

12. Background
Analysis
Final Design
Manufacturing

13. Background
Analysis
Final Design
Manufacturing

14. Background
Analysis
Final Design
Manufacturing

15. Background
Analysis
Final Design
Manufacturing

16. Background
Analysis
Final Design
Manufacturing

17. Background
Analysis
Final Design
Manufacturing

18. Background
Analysis
Final Design
Manufacturing

19. Background
Analysis
Final Design
Manufacturing

20. Background
Analysis
Final Design
Manufacturing

21. Conclusions

22. Background
Analysis
Final Design
Manufacturing

23. Background
Analysis
Final Design
Manufacturing
Mask

24. Background
Analysis
Final Design
Manufacturing

25. Background
Analysis
Final Design
Manufacturing

27. Questions?